KR101712483B1 - Particle collecting module and laser etching apparatus having the same - Google Patents

Abstract

A particle trapping module and a laser etching apparatus having the particle trapping module are disclosed. According to an aspect of the present invention, there is provided a laser etching apparatus comprising: a vacuum chamber in which an etching process is performed on a substrate chucked by an electrostatic chuck for substrate chucking; A laser irradiator for irradiating a laser to etch the organic material deposited on the outer periphery of the substrate; And a particle collecting module provided at at least one side of the vacuum chamber and collecting organic particles separated from the substrate during a laser etching process.

Description

Particle collecting module and laser etching apparatus having the particle collecting module

The present invention relates to a particle trapping module and a laser etching apparatus having the particle trapping module. More particularly, the present invention relates to a particle trapping module capable of efficiently collecting organic particles separated from a substrate during a laser etching process, To a particle trap module capable of producing a high-quality substrate and a laser etching apparatus having the particle trap module.

As a result of the rapid development of information and communication technology and the expansion of the market, a flat panel display is attracting attention as a display device.

Such flat panel display devices include liquid crystal display devices, plasma display panels, and organic light emitting diodes.

Among these organic electroluminescent devices, for example, OLEDs have very good advantages such as high response speed, lower power consumption than conventional LCD, light weight, no need for a separate backlight device, And has been attracting attention as a next generation display device.

Such an organic electroluminescent device is a principle in which an anode film, an organic thin film, and a cathode film are sequentially formed on a substrate, and a voltage is applied between the anode and the cathode to form a proper energy difference in the organic thin film and emit light by itself.

In other words, the injected electrons and holes are recombined, and the excitation energy generated is generated by light. At this time, since the wavelength of light generated according to the amount of the dopant of the organic material can be controlled, full color can be realized.

1 is a structural view of an organic electroluminescent device (OLED).

As shown in this figure, an organic electroluminescent device includes an anode, a hole injection layer, a hole transfer layer, an emitting layer, a hole blocking layer, an electron injection layer, a cathode, and the like are stacked in this order.

In this structure, ITO (Indium Tin Oxide), which has small surface resistance and good transparency, is mainly used as the anode. The organic thin film is composed of a multilayer of a hole injecting layer, a hole transporting layer, a light emitting layer, a hole blocking layer, an electron transporting layer, and an electron injecting layer in order to increase the luminous efficiency. Organic materials used as the light emitting layer include Alq3, TPD, PBD, m-MTDATA, and TCTA. As the cathode, a LiF-Al metal film is used. And since the organic thin film is very weak to moisture and oxygen in the air, a sealing film for sealing is formed at the top to increase the lifetime of the device.

1, the organic electroluminescent device includes an anode, a cathode, and a light emitting layer interposed between the anode and the cathode. When the organic electroluminescent device is driven, holes are injected from the anode into the light emitting layer , Electrons are injected into the light emitting layer from the cathode. The holes and electrons injected into the light emitting layer are combined in the light emitting layer to generate excitons, and the excitons emit light while transitioning from the excited state to the ground state.

Such an organic electroluminescent device can be classified into a monochromatic or full color organic electroluminescent device according to the color to be realized. The full-color organic electroluminescent device includes red (R), green (G) and And a light emitting layer patterned for each blue (B) color is provided to realize a full color.

In the full-color organic electroluminescent device, the patterning of the light-emitting layer may be performed differently depending on the material forming the light-emitting layer.

OLED deposition methods for patterning the light emitting layer include a direct patterning method using a fine metal mask (hereinafter, referred to as a mask), a method using a LITI (Laser Induced Thermal Imaging) method, a method using a color filter, Mask Scanning) deposition method.

On the other hand, in the SMS deposition method described above, an organic material is deposited to the outside of the glass in the scanning direction because the organic material is deposited while scanning with a small mask.

Organic materials deposited on the substrate's outer surface may be inferior in adherence to the sealant when sealing the substrate. Therefore, in the present process, organic substances deposited on the substrate are removed after the deposition process is completed.

Dry etching has been used as a method of removing organic substances deposited on the outer periphery of a substrate, but recently, a method of using a dry type laser which does not affect the device has been considered.

However, when the laser etching method is not equipped with a separate means for collecting organic particles separated from the substrate, the organic particles separated from the substrate during the etching process are re-adsorbed to the substrate, .

In other words, the substrate may be etched while being chucked by the electrostatic chuck, considering that organic particles separated from the substrate may be re-adsorbed onto the substrate by electrostatic chucking of the electrostatic chuck to cause substrate failure , It is necessary to develop a structure that complements these points.

Korea Patent Office Application No. 10-1996-0031671

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a particle collecting module capable of efficiently collecting organic particles separated from a substrate during a laser etching process, The present invention also provides a laser etching apparatus comprising the same.

According to an aspect of the present invention, there is provided an electrostatic chuck for chucking a substrate, comprising: a vacuum chamber in which an etching process for a chucked substrate proceeds; A laser irradiator for irradiating a laser to etch the organic material deposited on the outer surface of the substrate; And a particle collecting module provided at at least one side of the vacuum chamber and collecting organic particles separated from the substrate during the laser etching process. .

The particle trapping module may include an electrostatic chuck for trapping particles.

The particle collecting electrostatic chuck may have an opposite polarity to the electrostatic chuck for substrate chucking.

The electrostatic chuck for trapping particles can be charged with (-).

The particle collecting module may further include a low temperature plate coupled to the electrostatic chuck for trapping the particles.

The particle collecting module may further include a shield coupled to the particle collecting electrostatic chuck.

And a module rotating body connected to the electrostatic chuck for chucking the substrate and rotating the electrostatic chuck for chucking the substrate by a predetermined angle during the etching process by the laser.

The angle range in which the substrate is rotated by the module rotating body may be 90 degrees to 180 degrees.

The laser irradiator is fixed to the outside of the vacuum chamber and can irradiate the laser toward the inside of the vacuum chamber.

And a first laser port may be provided on a wall surface of the vacuum chamber in which the laser irradiator is disposed.

And a module moving body connected to the substrate chucking electrostatic chuck to move the electrostatic chuck for substrate chucking to the first laser port area.

And a controller for controlling operations of the module rotating body and the module moving body.

The vacuum chamber may have an inlet and an outlet for receiving and chucking the substrate chucking chucking electrostatic chuck, and a gate door may be openably and closably coupled to the inlet and outlet area.

The vacuum chamber may be partitioned into a first space through which the etching process proceeds and a second space through which the etching process is not performed.

A fixed mirror fixedly disposed on one side of the second space and reflecting a laser beam radiated from the laser irradiator in a predetermined direction; And a moving mirror disposed movably in the periphery of the fixed mirror and reflecting the laser reflected from the fixed mirror back to the substrate in the first space.

And a mirror moving guide connected to the moving mirror to guide movement of the moving mirror.

The barrier rib may be formed with second and third laser ports for guiding the laser reflected from the moving mirror to the substrate in the first space.

According to another aspect of the present invention, there is provided an electrostatic chuck for trapping particles, which is provided on at least one side of a process chamber for manufacturing a substrate and collects organic particles separated from the substrate during a process for manufacturing the substrate, A particle collecting module may be provided.

Wherein the process chamber may be a vacuum chamber in which the interior is held in vacuum and the substrate may be chucked in an electrostatic chuck for substrate chucking in the vacuum chamber and wherein the electrostatic chuck for particle capture has a polarity opposite to that of the electrostatic chuck for substrate chucking Lt; / RTI >

The electrostatic chuck for trapping particles can be charged with (-).

And a low temperature plate coupled to the particle collecting electrostatic chuck.

And a shield coupled to the particle collecting electrostatic chuck.

The process for fabricating the substrate may be an etching process for etching the organic material deposited on the outer portion of the substrate by irradiating a laser.

According to the present invention, it is possible to efficiently collect the organic particles separated from the substrate during the etching process by the laser so as not to be reabsorbed to the substrate, thereby producing a high-quality substrate.

1 is a structural view of an organic electroluminescent device (OLED).
2 is a schematic view showing an etching and sealing structure for an OLED substrate.
FIGS. 3 to 7 are operation diagrams of the laser etching apparatus according to an embodiment of the present invention.
8 is a view for explaining the principle of collecting organic particles.
9 is a control block diagram of a laser etching apparatus according to an embodiment of the present invention.
10 to 12 are operation diagrams of the laser etching apparatus according to another embodiment of the present invention, respectively.
13 to 16 are modifications to the particle trapping module, respectively.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

2 is a schematic view showing an etching and sealing structure for an OLED substrate.

Referring to this figure, an organic light emitting diode (OLED) substrate according to the present embodiment has a structure in which an organic material is deposited on a pattern glass as shown in FIG. 2 (a), and then sealed with a sealing glass .

At this time, since the organic substance deposited on the outer surface of the substrate is inferior in adhesion to the sealing agent (S, Sealing, see FIG. 2C) when the substrate is sealed, Organic matter deposited on the outer part should be removed.

As described above, when dry etching is used, plasma is not preferable because it may penetrate the device and cause characteristic deformation of the device. Therefore, in this embodiment, And the organic material deposited on one side (L1) and the other side (L2) of the outer frame is etched.

When the present embodiment is applied, organic substances deposited on one side (L1) and the other side (L2) of the outer frame part of the substrate can be efficiently removed by using a laser, unlike the prior art.

Particularly, due to the following structural features, the organic particles separated from the substrate can be re-adsorbed onto the substrate to prevent the production of the defective substrate. This will be described in detail with reference to FIG. 3 to FIG.

FIGS. 3 to 7 are operation diagrams of the laser etching apparatus according to an embodiment of the present invention, respectively. FIG. 8 is a view for explaining the principle of collecting organic particles, and FIG. FIG. 2 is a control block diagram of a laser etching apparatus according to an embodiment of the present invention.

Referring to these drawings, the laser etching apparatus of the present embodiment is configured to remove (etch) organic materials deposited on one side (L1, see FIG. 2) and the other side (L2, see FIG. 2) The apparatus may include a vacuum chamber 110, an electrostatic chuck 150 for substrate chucking, a laser irradiator 120, a module rotating body 130, a module moving body 140, and a particle collecting module 170.

As will be described below, the particle trapping module 170 may be applied to various process chambers for manufacturing a substrate. Hereinafter, the particle trapping module 170 may be applied to an etching process for etching organic substances deposited on the outer surface of a substrate by irradiating laser And the particle collecting module 170 is applied to the vacuum chamber 110. FIG. However, the scope of rights of the present invention can not be limited thereto.

The vacuum chamber 110 forms a place where the etching process for the substrate proceeds. 2) and the other side (refer to FIG. 2) of the substrate by the laser irradiation method, since the inside of the chamber must maintain a vacuum, the vacuum chamber 110 . A vacuum pump (not shown) or the like may be provided at one side of the vacuum chamber 110 to maintain a proper vacuum pressure.

On one side wall of the vacuum chamber 110, an entrance / exit part 111 through which the substrate enters / exits is formed. A gate door 112 for opening and closing the access portion 111 is provided in the access portion 111 area.

The substrate which is put in and out of the vacuum chamber 110 through the entrance portion 111 is loaded into the vacuum chamber 110 or unloaded from the vacuum chamber 110 while being chucked by the electrostatic chuck 150 for substrate chucking.

The electrostatic chuck 150 for substrate chucking is simplified briefly. A chuck is a device for holding a substrate during a process, mainly divided into an E-chuck and an M-chuck. The M-chuck mechanically presses the substrate, so it can generate particles on the substrate and also make the edge of the substrate useless.

However, this problem has disappeared due to the development of the electrostatic chuck (ES-Chuck) being applied in this embodiment.

The electrostatic chuck (ES-Chuck) being applied in this embodiment improves the problem in the existing M-chuck by literally holding the substrate by the electrostatic force, that is, the electrostatic force.

Electrostatic chuck (ES-Chuck) includes Uni-polar, Bi-polar and Tri-polar type.

The Uni-polar type applies a positive voltage to the chuck, and is connected to the ground by chucking due to plasma generation. In order to dechuck the chuck, reverse bias should be applied. If the opposite reverse bias is not applied, the substrate is attracted for several to several tens of minutes even if the power supply is interrupted.

Bi-polar type is a structure in which chucking is released by applying reverse bias of applied voltage for chucking by applying +/- DC voltage to chuck. The chucking or chucking can be performed only by the chuck itself, and there is an advantage that no plasma is required.

The tri-polar type is similar to the Bi-polar type. One of the other is to read the DC self bias (Bias) generated in the plasma and compensate for the +/- voltage by Vdc, so that the net charge ) Should be zeroed.

The electrostatic chuck 150 for substrate chucking applied in this embodiment applies a Bi-polar type high temperature electrostatic chuck from among the above types of electrostatic chuck (ES-Chuck). This is advantageous because the substrate can be continuously adsorbed for several to several tens of minutes even if the power supply is interrupted while the substrate is chucked. However, uni-polar type or tri-polar type electrostatic chuck may be used.

The laser irradiator 120 irradiates a laser to remove organic substances deposited on one side (L1) (see FIG. 2) and the other side (see FIG. 2) of the substrate.

In this embodiment, the laser irradiator 120 is fixed to the outside of the vacuum chamber 110 and irradiates the laser toward the inside of the vacuum chamber 110.

At this time, a first laser port 113 is provided on the wall surface of the vacuum chamber 110 where the laser irradiator 120 is disposed. The laser irradiator 120 allows the laser to be irradiated through the first laser port 113 to be directed to the substrate.

In the case of this embodiment, the laser irradiator 120 is fixed in position and the etching process is proceeded while moving the substrate through the electrostatic chuck 150 for chucking the substrate. This may be a solution to the problem of laser imbalance when the laser irradiator 120 is moved and the problem of damage to the expensive laser irradiator 120.

However, if the laser can be stably irradiated, the etching process may be performed while moving the laser irradiator 120 while the substrate is fixed, unlike the present embodiment.

The module rotating body 130 is connected to the electrostatic chuck 150 for chucking the substrate as shown in FIG. 4 to FIG. 5. The electrostatic chuck 150 for substrate chucking is provided so that organic particles separated from the substrate during the laser etching process are not re- 150 in advance by a predetermined angle.

An angle range in which the substrate is rotated by the module rotating body 130 may be 90 degrees to 180 degrees, and in this embodiment, 100 degrees is selected.

If the etching process is performed through the laser in a state in which the substrate is flipped at 100 degrees as in the present embodiment, the organic particles separated from the substrate at the angle may be re-adsorbed to the substrate to prevent the production of the defective substrate .

Therefore, it is advantageous that the angle of rotation of the substrate is 100 degrees or more, but it is sufficient to prevent the organic particles separated from the substrate from being reabsorbed to the substrate again to produce the defective substrate if the substrate has a range of 90 degrees to 180 degrees.

The module moving body 140 is connected to the electrostatic chuck 150 for substrate chucking and serves to move the electrostatic chuck 150 for substrate chucking to the region of the first laser port 113.

As with the module rotating body 130, the operation of the module moving body 140 can also be controlled by the controller 160.

The module rotating body 130 and the module moving body 140 are schematically illustrated in the drawing by the module rotating body 130 and the module moving body 140. The module rotating body 130 and the module moving body 140 are connected to each other by a motor, a ball screw, a cylinder, and the like.

On the other hand, the controller 160 may include a central processing unit (CPU) 161, a memory 162 (MEMORY), and a support circuit 163 (SUPPORT CIRCUIT) as shown in FIG.

The central processing unit 161 may be one of various computer processors that can be industrially applied to control the operation of the module rotating body 130 and the module moving body 140 in this embodiment.

The memory 162 (MEMORY) is connected to the central processing unit 161. [ The memory 162 may be a computer-readable recording medium and may be located locally or remotely and may be any of various types of storage devices, including, for example, a random access memory (RAM), a ROM, a floppy disk, At least one or more memories.

A support circuit 163 (SUPPORT CIRCUIT) is coupled with the central processing unit 161 to support the typical operation of the processor. Such a support circuit 163 may include a cache, a power supply, a clock circuit, an input / output circuit, a subsystem, and the like.

In this embodiment, the controller 160 controls the operation of the module rotating body 130 and the module moving body 140, and such a series of processes and the like can be stored in the memory 162. Typically, a software routine may be stored in the memory 162. The software routines may also be stored or executed by other central processing units (not shown).

Although processes according to the present invention are described as being performed by software routines, it is also possible that at least some of the processes of the present invention may be performed by hardware. As such, the processes of the present invention may be implemented in software executed on a computer system, or in hardware such as an integrated circuit, or in combination of software and hardware.

Meanwhile, as described above, when the laser etching method as in the present embodiment is not provided with a separate means for collecting organic particles separated from the substrate, the organic particles separated from the substrate during the etching process are transferred back to the substrate There is a concern that the substrate may be re-adsorbed to cause defects. However, in the case of this embodiment, the problem is solved by providing the particle collecting module 170.

The particle collecting module 170 applied in this embodiment includes the electrostatic chuck 170 for collecting particles.

The particle collecting electrostatic chuck 170 is disposed on the inner wall of the vacuum chamber 110. In this embodiment, the particle collecting electrostatic chuck 170 is provided on both the bottom wall of the vacuum chamber 110 and the side wall adjacent thereto. So that the organic particles can be adsorbed well.

The particle collecting electrostatic chuck 170 applied in this embodiment has a polarity opposite to that of the electrostatic chuck 150 for substrate chucking used for chucking the substrate.

Since the electrostatic chuck 150 for substrate chucking is generally positively charged, the electrostatic chuck 170 for particle trapping can be charged with negative (-).

The role of the particle collecting electrostatic chuck 170 will be described in more detail with reference to FIG.

Referring to FIG. 8, in the etching process, the foreign particles that are separated from the organic material of the substrate are most (+) charged organic particles, and the neutral organic particles, which are broken due to other molecular bonds, Organic particles are a minority.

Thus, the (+) electric charge organic particles occupying the majority of the organic particle can be collected by adjusting the polarity of the particle collecting electrostatic chuck 170.

Specifically, when the substrate is chucked to the (+) charged electrostatic chuck 150 for substrate chucking, (-) charge moves to the chucking surface, and the surface of the substrate is charged to (-). When the electrostatic chuck 170 for collecting the particles charged on the opposite side is disposed, the (+) electric charge of the positive (+) charge generated from the organic substance is protruded by the repulsive force. The organic particles of charge can be efficiently collected.

In contrast to the conventional detachable electrostatic chuck (not shown) having a positive electrode, the particle collecting electrostatic chuck 170 applied to the present embodiment is simple in structure and easy to install or maintain since only one polarity is required.

A laser etching method for a substrate having such a structure will be described.

First, the substrate is chucked to the electrostatic chuck 150 for chucking the substrate from the outside of the vacuum chamber 110. As described above, the electrostatic chuck 150 for substrate chucking is applied as an electrostatic chuck, and the substrate can be chucked on top of the electrostatic chuck 150 for substrate chucking.

The substrate chucked face up on the electrostatic chuck 150 for chucking the substrate is introduced into the vacuum chamber 110 through the entrance portion 111 by the electrostatic chuck 150 for substrate chucking, It is loaded from that location.

Next, the electrostatic chuck 150 for substrate chucking is flipped by a predetermined angle by the operation of the module rotating body 130 so that the organic particles separated from the substrate in the etching process are not reabsorbed to the substrate, Is slanted in a face down state. The slope at this time may be approximately 100 degrees.

After the substrate is tilted in a face down state, a substrate scanning step is performed in which the substrate is aligned and then the substrate is scanned by irradiating a laser to the outer periphery of the substrate for advancing the etching process.

During the substrate scanning step, the substrate is moved toward the laser irradiated at a fixed position to perform the etching process. That is, when the substrate is moved by a predetermined distance as shown in FIG. 6 by the module moving body 140, organic matter deposited on one side (L1, see FIG. 2) of the substrate by the laser irradiated is removed, The organic material deposited on the other side of the substrate (L2, see FIG. 2) is removed by the laser irradiated when the substrate is further moved by a predetermined distance as shown in FIG.

On the other hand, the organic particles of (+) charges protruding during the etching process are efficiently trapped by the electrostatic chuck 170 for trapping particles charged on the wall surface of the vacuum chamber 110, It is possible to maximally reduce the phenomenon that the organic particles leaving the substrate are re-adsorbed to the substrate.

Next, after the substrate scanning step is performed to remove the organic substances deposited on one side (L1, see FIG. 2) and the other side (L2 (see FIG. 2) of the substrate), the etched portions are inspected, The substrate is unloaded through one reverse operation.

According to the present embodiment having such a structure and operation, it is possible to efficiently collect the organic particles separated from the substrate in the etching process by the laser so as not to be reabsorbed to the substrate, and to produce a high-quality substrate.

10 to 12 are operation diagrams of the laser etching apparatus according to another embodiment of the present invention, respectively.

Unlike the vacuum chamber 110 of FIGS. 3 to 7 described above, even when the vacuum chamber 210 shown in FIGS. 10 to 12 is used, when the particle collecting electrostatic chuck 270 is used, The organic particles separated from the substrate can be efficiently collected without being reabsorbed to the substrate, and a high-quality substrate can be produced.

10 to 12, in the case of the laser etching apparatus of the present embodiment, the vacuum chamber 210 is divided into a first space 210a through which the etching process is performed by the partition 211 and a second space 210b through which the etching process is not performed. And a space 210b.

A first laser port 213 is provided on a sidewall of the second space 210b adjacent to the laser irradiator 220 and second and third laser ports 214 and 215 are provided on the partition 211,

The chucked substrate is loaded on the electrostatic chuck 250 for substrate chucking in the first space 210a. On the other hand, a fixed mirror 280, a moving mirror 281, and a mirror moving guide 282 are provided in the second space 210b.

The movable mirror 281 and the mirror moving guide 282 are provided in the second isolated space 210b because the fixed mirror 280, the movable mirror 281 and the mirror moving guide 282 are provided in the isolated second space 210b. ) Is not contaminated.

The fixed mirror 280, the moving mirror 281 and the mirror moving guide 282 are disposed on the outer side of the outer periphery of the substrate L1 and the laser beam irradiated from the laser irradiator 220 fixed to the outside of the vacuum chamber 210 2) and the other side (L2, see Fig. 2).

The stationary mirror 280 is fixedly disposed on one side of the second space 210b. The fixed mirror 280 reflects the laser beam irradiated through the first laser port 213 from the laser irradiator 220 to the moving mirror 281 at the corresponding position. Therefore, the stationary mirror 280 is disposed with a constant inclination.

The movable mirror 281 is shifted as shown in Figs. 11 and 12, unlike the fixed mirror 280. Fig. The movable mirror 281 receives the laser beam reflected by the fixed mirror 280 and reflects the laser beam again through the second and third laser ports 214 and 215 to one side L1 of the substrate (see FIG. 2) 2) and serves to etch the outer frame of the substrate.

The mirror moving guide 282 is provided to guide the movement of the movable mirror 281 as shown in Figs. The mirror moving guide 282 can be applied to the normal LM guide.

Hereinafter, the laser etching method of this embodiment will be described.

First, the substrate chucked face up on the electrostatic chuck 250 for chucking the substrate is transferred to the first space (not shown) of the vacuum chamber 210 through the entrance portion 211 by the electrostatic chuck 250 for substrate chucking, (210a) and is loaded at the corresponding position as shown in FIG.

Next, in order to prevent the organic particles separated from the substrate from being re-adsorbed on the substrate during the etching process, the electrostatic chuck 250 for chucking the substrate is moved to a predetermined angle, for example, 100 degrees The substrate is flipped so that the substrate is tilted in a face down state.

When the substrate is tilted in a face down state, the laser is irradiated through the first laser port 213 in the laser irradiator 220. The irradiated laser is reflected by the fixed mirror 280 and the movable mirror 281 and is transmitted to the one side L1 of the substrate (see FIG. 2) through the second laser port 214 to the other side L1 of the substrate , See Fig. 2).

When the process is completed, the moving mirror 281 is moved through the mirror moving guide 282 as shown in Fig. When the movement of the movable mirror 281 is completed, the laser is irradiated through the first laser port 213 in the laser irradiator 220. The irradiated laser is respectively reflected by the fixed mirror 280 and the movable mirror 281 and is transmitted to the other side L2 of the substrate (see FIG. 2) through the third laser port 215 to the other side L2 of the substrate , See Fig. 2).

On the other hand, the organic particles of positive electric charge protruding during the etching process are efficiently collected by the electrostatic chuck 270 for collecting the particles charged on the wall surface of the vacuum chamber 210, It is possible to maximally reduce the phenomenon that the organic particles leaving the substrate are re-adsorbed to the substrate.

The structure similar to that of this embodiment differs from that of the first embodiment in that the module moving body 140 (see FIG. 4) is not used but the fixed mirror 280, the moving mirror 281 and the mirror moving guide The height of the vacuum chamber 210 can be lowered because the module moving body 140 (see FIG. 3) is not used in this case. In this case, It will be advantageous to apply it to the etching process of a large substrate.

Even if such a structure is applied, the organic particles separated from the substrate during the etching process by the laser can be efficiently collected without being reabsorbed to the substrate, and a high-quality substrate can be produced.

13 to 16 are modifications to the particle trapping module, respectively.

13, the particle collecting module 370 includes an electrostatic chuck 380 for collecting particles and a low temperature plate 390 coupled to the particle collecting electrostatic chuck 380.

The reason why the low temperature plate 390 is coupled to the electrostatic chuck 380 for particle trapping as shown in FIG. 13 is that the high temperature molecules moving away from the substrate due to its molecular nature move to a place with low temperature, That is, means for collecting high temperature organic particles.

In the case of FIG. 14, the particle collecting module 470 is shown to use both the electrostatic chuck 480a for collecting particles charged with (+) and the electrostatic chuck 480b for collecting particles charged with (-) In this case, the organic particles having the opposite polarity can be efficiently collected.

15, the particle collecting module 570 includes an electrostatic chuck 580 for collecting particles and a shield 590 (shield) coupled to the particle collecting electrostatic chuck 580.

The shield 590 is coupled to the side of the particle collecting electrostatic chuck 580 so as to facilitate the maintenance of the particle collecting electrostatic chuck 580. That is, by allowing the particles to be collected only in the electrostatic chuck for collecting particles 580, the contamination of the chamber in which the particle collecting module 570 is used can be prevented.

16, the particle collecting module 670 is applied to the adsorber 670. Since the organic particles can be forcibly collected by the adsorption force of the adsorber 670, this can also provide the same effect

For reference, in the above-described embodiments, the particle trap modules 170 to 670 are described as being applied to a laser etching apparatus. However, various devices that need to collect particles while using various process chambers for manufacturing semiconductors or display substrates The particle collecting modules 170 to 670 may be applied to a process chamber such as a cleaning apparatus, and these matters also belong to the scope of the present invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: vacuum chamber 111:
112: gate door 113: first laser port
120: laser irradiator 130: module rotating body
140: Module moving body 150: Electrostatic chuck for substrate chucking
160: controller 170: particle trap module

Claims (23)

A vacuum chamber in which an etching process is performed on a chucked substrate by an electrostatic chuck for substrate chucking;
A laser irradiator for irradiating a laser to etch the organic material deposited on the outer surface of the substrate; And
And a particle collecting module provided at at least one side of the vacuum chamber for collecting organic particles separated from the substrate during the laser etching process,
Wherein the particle trapping module includes an electrostatic chuck for trapping particles, and the electrostatic chuck for trapping particles has an opposite polarity to the electrostatic chuck for substrate chucking. delete delete The method according to claim 1,
Wherein the electrostatic chuck for trapping particles is charged with negative (-). The method according to claim 1,
The particle collecting module includes:
And a low-temperature plate coupled to the particle-collecting electrostatic chuck. The method according to claim 1,
The particle collecting module includes:
Further comprising: a shield coupled to the particle collecting electrostatic chuck. The method according to claim 1,
And a module rotator connected to the electrostatic chuck for chucking the substrate and rotating the electrostatic chuck for chucking the substrate by a predetermined angle during an etching process by the laser. 8. The method of claim 7,
Wherein an angle range in which the substrate is rotated by the module rotating body is 90 degrees to 180 degrees. The method according to claim 1,
Wherein the laser irradiator is fixed to the outside of the vacuum chamber and irradiates the laser toward the inside of the vacuum chamber. 8. The method of claim 7,
Wherein a laser port is provided on a wall surface of the vacuum chamber in which the laser irradiator is disposed. 11. The method of claim 10,
Further comprising a module moving body connected to the substrate chucking electrostatic chuck and moving the electrostatic chuck for substrate chucking to the first laser port area. 12. The method of claim 11,
Further comprising a controller for controlling operations of the module rotating body and the module moving body. The method according to claim 1,
Wherein the substrate is chucked at one side of the vacuum chamber to form an entrance / exit portion for entering and exiting the substrate chucking electrostatic chuck,
And a gate door is coupled to the access portion so as to be openable and closable. The method according to claim 1,
The vacuum chamber includes:
Wherein the first space is divided into a first space where the etching process is performed by the barrier ribs and a second space where the etching process is not performed. 15. The method of claim 14,
A fixed mirror fixedly disposed on one side of the second space and reflecting a laser beam radiated from the laser irradiator in a predetermined direction; And
Further comprising a moving mirror movably disposed around the fixed mirror and reflecting the laser reflected from the fixed mirror back to the substrate in the first space. 16. The method of claim 15,
And a mirror movement guide connected to the movable mirror for guiding movement of the movable mirror. 16. The method of claim 15,
Wherein the barrier ribs are formed with second and third laser ports for guiding the laser reflected from the moving mirror to the substrate in the first space. And a particle collecting electrostatic chuck provided at at least one side of the process chamber for manufacturing the substrate and collecting organic particles separated from the substrate in a process for manufacturing the substrate,
The process chamber is a vacuum chamber in which the interior is kept in vacuum,
The substrate being chucked in an electrostatic chuck for substrate chucking in the vacuum chamber,
Wherein the particle collecting electrostatic chuck has a polarity opposite to that of the electrostatic chuck for substrate chucking. delete 19. The method of claim 18,
And the electrostatic chuck for particle capture is charged with negative (-). 19. The method of claim 18,
And a low-temperature plate coupled to the electrostatic chuck for trapping the particles. 19. The method of claim 18,
And a shield coupled to the electrostatic chuck for trapping particles. 19. The method of claim 18,
Wherein the process for fabricating the substrate is an etching process for etching an organic material deposited on an outer portion of the substrate by irradiating a laser beam.

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