KR101827591B1 - 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법 - Google Patents

전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법 Download PDF

Info

Publication number
KR101827591B1
KR101827591B1 KR1020137007004A KR20137007004A KR101827591B1 KR 101827591 B1 KR101827591 B1 KR 101827591B1 KR 1020137007004 A KR1020137007004 A KR 1020137007004A KR 20137007004 A KR20137007004 A KR 20137007004A KR 101827591 B1 KR101827591 B1 KR 101827591B1
Authority
KR
South Korea
Prior art keywords
coupling agent
metal powder
electromagnetic wave
thermally conductive
magnetic metal
Prior art date
Application number
KR1020137007004A
Other languages
English (en)
Korean (ko)
Other versions
KR20130099066A (ko
Inventor
다츠오 구무라
유스케 구보
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20130099066A publication Critical patent/KR20130099066A/ko
Application granted granted Critical
Publication of KR101827591B1 publication Critical patent/KR101827591B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15358—Making agglomerates therefrom, e.g. by pressing
    • H01F1/15366—Making agglomerates therefrom, e.g. by pressing using a binder
    • H01F1/15375—Making agglomerates therefrom, e.g. by pressing using a binder using polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K2003/023—Silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0856—Iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Hard Magnetic Materials (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137007004A 2010-08-23 2011-08-23 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법 KR101827591B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-185890 2010-08-23
JP2010185890A JP2012044084A (ja) 2010-08-23 2010-08-23 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
PCT/JP2011/068976 WO2012026466A1 (ja) 2010-08-23 2011-08-23 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187003115A Division KR101914424B1 (ko) 2010-08-23 2011-08-23 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법

Publications (2)

Publication Number Publication Date
KR20130099066A KR20130099066A (ko) 2013-09-05
KR101827591B1 true KR101827591B1 (ko) 2018-03-22

Family

ID=45723460

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137007004A KR101827591B1 (ko) 2010-08-23 2011-08-23 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법
KR1020187003115A KR101914424B1 (ko) 2010-08-23 2011-08-23 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020187003115A KR101914424B1 (ko) 2010-08-23 2011-08-23 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법

Country Status (5)

Country Link
JP (1) JP2012044084A (ja)
KR (2) KR101827591B1 (ja)
CN (1) CN103053230B (ja)
TW (1) TW201223431A (ja)
WO (1) WO2012026466A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013118313A (ja) * 2011-12-05 2013-06-13 Dexerials Corp 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
CN104494241B (zh) * 2014-12-08 2016-09-21 国家电网公司 一种电磁屏蔽复合橡胶材料及其制备方法
US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
JP6366627B2 (ja) * 2016-03-25 2018-08-01 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JP6113351B1 (ja) 2016-03-25 2017-04-12 富士高分子工業株式会社 磁気粘弾性エラストマー組成物、その製造方法及びこれを組み込んだ振動吸収装置
CN111669956B (zh) 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 热管理和/或电磁干扰减轻材料以及相关装置和方法
US11373921B2 (en) * 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN111961439A (zh) * 2020-08-17 2020-11-20 苏州超弦新材料有限公司 一种高性能吸波粉体表面处理工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002129019A (ja) * 2000-10-25 2002-05-09 Shin Etsu Chem Co Ltd 電磁波吸収性シリコーンゴム組成物
JP2002363411A (ja) 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd 金属粉含有シリコーンゴム組成物
JP2005310952A (ja) 2004-04-20 2005-11-04 Nec Tokin Corp 電磁干渉抑制体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3641796B2 (ja) * 1999-10-18 2005-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
JP4790892B2 (ja) * 2000-04-27 2011-10-12 ポリマテック株式会社 電波吸収体
JP4365067B2 (ja) * 2002-05-14 2009-11-18 東レ・ダウコーニング株式会社 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体
US6850182B2 (en) * 2002-08-19 2005-02-01 Sumitomo Electric Industries, Ltd. Electromagnetic wave absorber
US20090114440A1 (en) * 2007-01-18 2009-05-07 Kazumi Yamamoto Conductive Magnetic Filler, Resin Composition Containing the Filler, Electromagnetic Interference Suppressing Sheet Using the Resin Composition and Applications Thereof, and Process for Producing the Electromagnetic Interference Suppressing Sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002129019A (ja) * 2000-10-25 2002-05-09 Shin Etsu Chem Co Ltd 電磁波吸収性シリコーンゴム組成物
JP2002363411A (ja) 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd 金属粉含有シリコーンゴム組成物
JP2005310952A (ja) 2004-04-20 2005-11-04 Nec Tokin Corp 電磁干渉抑制体

Also Published As

Publication number Publication date
JP2012044084A (ja) 2012-03-01
CN103053230A (zh) 2013-04-17
WO2012026466A1 (ja) 2012-03-01
TWI561155B (ja) 2016-12-01
CN103053230B (zh) 2016-07-06
KR20180014876A (ko) 2018-02-09
TW201223431A (en) 2012-06-01
KR101914424B1 (ko) 2018-11-01
KR20130099066A (ko) 2013-09-05

Similar Documents

Publication Publication Date Title
KR101827591B1 (ko) 전자파 흡수성 열전도 시트 및 전자파 흡수성 열전도 시트의 제조 방법
TWI553673B (zh) Electromagnetic wave absorptive heat conducting sheet and electromagnetic wave absorptive heat conducting sheet
JP4623244B2 (ja) 電磁波吸収性熱伝導性シリコーンゴム組成物
JP3719382B2 (ja) 電磁波吸収性シリコーンゴム組成物
US6716904B2 (en) Heat-radiating electromagnetic wave absorber
KR102167531B1 (ko) 반도체 장치
JP6727187B2 (ja) 混合アスペクト比粒子分散を有する熱界面材料
JP2003347787A (ja) 電磁波吸収性組成物
KR20200140253A (ko) 반도체 장치
KR101243944B1 (ko) 분산성이 개선된 방열 코팅용 습식복합소재 및 이를 이용한 방열 코팅용 습식복합코팅막
US8465663B2 (en) Composition for electromagnetic wave suppression and heat radiation and method for manufacturing composition for electromagnetic wave suppression and heat radiation
KR20200098778A (ko) 전기자동차 배터리 패키징용 방열패드의 제조방법
US11329005B2 (en) Semiconductor device and method of producing the same
KR102445111B1 (ko) 반도체 장치 및 반도체 장치의 제조 방법
WO2021241541A1 (ja) 樹脂組成物及び電子部品
TW202335000A (zh) 電磁干擾抑制材料
KR20150049976A (ko) 착빙설 방지 코팅제 조성물 및 그 제조방법
JP2021134121A (ja) 複合窒化アルミニウム粉末及びその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant