KR101821882B1 - 절단 장치 및 절단 방법 - Google Patents

절단 장치 및 절단 방법 Download PDF

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Publication number
KR101821882B1
KR101821882B1 KR1020160056996A KR20160056996A KR101821882B1 KR 101821882 B1 KR101821882 B1 KR 101821882B1 KR 1020160056996 A KR1020160056996 A KR 1020160056996A KR 20160056996 A KR20160056996 A KR 20160056996A KR 101821882 B1 KR101821882 B1 KR 101821882B1
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KR
South Korea
Prior art keywords
rotary blade
concave portion
fixing member
flange
support portion
Prior art date
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KR1020160056996A
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English (en)
Korean (ko)
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KR20160134509A (ko
Inventor
마사유키 야마모토
모토키 후카이
칸지 이시바시
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160134509A publication Critical patent/KR20160134509A/ko
Application granted granted Critical
Publication of KR101821882B1 publication Critical patent/KR101821882B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Sawing (AREA)
KR1020160056996A 2015-05-13 2016-05-10 절단 장치 및 절단 방법 Active KR101821882B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-098196 2015-05-13
JP2015098196A JP6430329B2 (ja) 2015-05-13 2015-05-13 切断装置及び切断方法

Publications (2)

Publication Number Publication Date
KR20160134509A KR20160134509A (ko) 2016-11-23
KR101821882B1 true KR101821882B1 (ko) 2018-01-24

Family

ID=57352811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160056996A Active KR101821882B1 (ko) 2015-05-13 2016-05-10 절단 장치 및 절단 방법

Country Status (4)

Country Link
JP (1) JP6430329B2 (enrdf_load_stackoverflow)
KR (1) KR101821882B1 (enrdf_load_stackoverflow)
CN (1) CN106142198B (enrdf_load_stackoverflow)
TW (1) TWI599442B (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110603121A (zh) 2017-03-31 2019-12-20 圣戈班磨料磨具有限公司 研磨轮组件
JP6560714B2 (ja) * 2017-06-26 2019-08-14 Ｔｏｗａ株式会社 ブレード交換機構、切断装置およびブレード交換方法
JP7138452B2 (ja) * 2018-03-01 2022-09-16 株式会社ディスコ フランジ機構
JP2022505206A (ja) 2018-10-19 2022-01-14 サンーゴバン アブレイシブズ，インコーポレイティド 砥石車アセンブリ
JP7098581B2 (ja) * 2019-07-29 2022-07-11 Ｔｏｗａ株式会社 ブレード交換機構、切断装置、及び切断品の製造方法
US11730575B2 (en) * 2020-09-10 2023-08-22 James R. Glidewell Dental Ceramics, Inc. Milling burs and systems and methods for performing quality control of the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法
JP4904606B2 (ja) 2006-08-03 2012-03-28 株式会社東京精密 切断刃装着装置、及び、その切断刃装着方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494698A (en) * 1994-11-07 1996-02-27 Xerox Corporation Teflon filled resinoid dicing blades for fabricating silicon die modules
US5992285A (en) * 1994-11-21 1999-11-30 Talarico; Joe Floating punch holder
US5701789A (en) * 1995-04-10 1997-12-30 Best Cutting Die Company Waste repellent die structure
US5827159A (en) * 1996-05-15 1998-10-27 Adachi; Hiroshi Combination tool changer and storage device for die cutter
US5896796A (en) * 1997-06-06 1999-04-27 Chih; Chen-Keng Device for punching holes in a bicycle rim
AU684703B3 (en) * 1997-08-19 1997-12-18 Fu-Chuan Huang Cutting mechanism for a thermal-shrinking film labeling machine
JP4023525B2 (ja) * 1997-09-04 2007-12-19 株式会社ディスコ 電鋳ブレード
DE19857913C2 (de) * 1998-12-16 2003-10-02 System 3R Internat Ab Vaelling Kupplungsvorrichtung
JP3061113U (ja) * 1999-01-29 1999-09-17 榮昌 陳 切刃保護装置を備えた型抜き加工装置
EP1044819A3 (en) * 1999-04-14 2001-06-27 Star Micronics Co., Ltd. Cutter apparatus and printer
CH693824A5 (fr) * 1999-04-28 2004-02-27 Bobst Sa Dispositif de fixation et de guidage d'un palier sur un bâti.
CN1226116C (zh) * 1999-05-31 2005-11-09 比特林制造传播有限公司 切割机
JP4559094B2 (ja) * 2004-02-16 2010-10-06 株式会社ディスコ 切削ブレード装着装置，切削装置
JP2008103648A (ja) * 2006-10-23 2008-05-01 Matsushita Electric Ind Co Ltd 半導体装置の製造装置および半導体装置の製造方法
JP5096052B2 (ja) * 2007-06-22 2012-12-12 株式会社ディスコ 切削装置
JP2015085466A (ja) * 2013-10-31 2015-05-07 株式会社ディスコ フランジ機構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4904606B2 (ja) 2006-08-03 2012-03-28 株式会社東京精密 切断刃装着装置、及び、その切断刃装着方法
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法

Also Published As

Publication number Publication date
JP6430329B2 (ja) 2018-11-28
CN106142198A (zh) 2016-11-23
CN106142198B (zh) 2018-04-10
TW201710022A (zh) 2017-03-16
KR20160134509A (ko) 2016-11-23
JP2016209980A (ja) 2016-12-15
TWI599442B (zh) 2017-09-21

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