KR101821425B1 - 정전 척 및 이를 개조하는 방법 - Google Patents

정전 척 및 이를 개조하는 방법 Download PDF

Info

Publication number
KR101821425B1
KR101821425B1 KR1020127015127A KR20127015127A KR101821425B1 KR 101821425 B1 KR101821425 B1 KR 101821425B1 KR 1020127015127 A KR1020127015127 A KR 1020127015127A KR 20127015127 A KR20127015127 A KR 20127015127A KR 101821425 B1 KR101821425 B1 KR 101821425B1
Authority
KR
South Korea
Prior art keywords
metal cooling
cooling plate
plate
ceramic plate
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020127015127A
Other languages
English (en)
Korean (ko)
Other versions
KR20120120165A (ko
Inventor
알리사 하트
존 씨. 보이드
리자 팔마
앨라스데어 덴트
Original Assignee
노벨러스 시스템즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노벨러스 시스템즈, 인코포레이티드 filed Critical 노벨러스 시스템즈, 인코포레이티드
Publication of KR20120120165A publication Critical patent/KR20120120165A/ko
Application granted granted Critical
Publication of KR101821425B1 publication Critical patent/KR101821425B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020127015127A 2009-12-29 2010-12-20 정전 척 및 이를 개조하는 방법 Active KR101821425B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/648,638 US8597448B2 (en) 2009-12-29 2009-12-29 Electrostatic chucks and methods for refurbishing same
US12/648,638 2009-12-29
PCT/US2010/061348 WO2011090650A2 (en) 2009-12-29 2010-12-20 Electrostatic chucks and methods for refurbishing same

Publications (2)

Publication Number Publication Date
KR20120120165A KR20120120165A (ko) 2012-11-01
KR101821425B1 true KR101821425B1 (ko) 2018-01-23

Family

ID=44186004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127015127A Active KR101821425B1 (ko) 2009-12-29 2010-12-20 정전 척 및 이를 개조하는 방법

Country Status (7)

Country Link
US (2) US8597448B2 (https=)
JP (1) JP5769264B2 (https=)
KR (1) KR101821425B1 (https=)
CN (1) CN102696101B (https=)
SG (2) SG181503A1 (https=)
TW (1) TWI488257B (https=)
WO (1) WO2011090650A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8597448B2 (en) 2009-12-29 2013-12-03 Novellus Systems, Inc. Electrostatic chucks and methods for refurbishing same
US9054148B2 (en) * 2011-08-26 2015-06-09 Lam Research Corporation Method for performing hot water seal on electrostatic chuck
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
KR102071674B1 (ko) * 2017-07-19 2020-01-30 주식회사 임나노텍 레이저 용접을 이용한 반도체 스퍼터링 정전척의 리사이클링 시스템
US11488852B2 (en) 2019-05-31 2022-11-01 Applied Materials, Inc. Methods and apparatus for reducing high voltage arcing in semiconductor process chambers
JP7633794B2 (ja) * 2020-03-26 2025-02-20 三星電子株式会社 静電チャック装置
JP2023004738A (ja) * 2021-06-28 2023-01-17 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板載置台の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104113A (ja) 2002-08-22 2004-04-02 Sumitomo Osaka Cement Co Ltd サセプタ装置
JP2005191500A (ja) 2003-12-26 2005-07-14 Creative Technology:Kk 双極型静電チャックの再生方法
JP2007129142A (ja) 2005-11-07 2007-05-24 Ngk Insulators Ltd 基板載置部材の分離方法及び再利用方法
US20080089001A1 (en) 2006-10-13 2008-04-17 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513891A (en) * 1967-06-16 1970-05-26 Production Machines Inc Chuck for veneer lathe inner spindle
US5581874A (en) * 1994-03-28 1996-12-10 Tokyo Electron Limited Method of forming a bonding portion
JP3485390B2 (ja) * 1995-07-28 2004-01-13 京セラ株式会社 静電チャック
JP4311600B2 (ja) * 2001-01-30 2009-08-12 日本碍子株式会社 静電チャック用接合構造体及びその製造方法
JP4003932B2 (ja) * 2002-03-07 2007-11-07 日本碍子株式会社 セラミックス−金属接合体
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
US8124429B2 (en) * 2006-12-15 2012-02-28 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
US9202736B2 (en) * 2007-07-31 2015-12-01 Applied Materials, Inc. Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
JP2011100889A (ja) * 2009-11-06 2011-05-19 Mitsui Eng & Shipbuild Co Ltd 静電チャック、静電チャック製造方法、および静電チャック再生方法
US8597448B2 (en) 2009-12-29 2013-12-03 Novellus Systems, Inc. Electrostatic chucks and methods for refurbishing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104113A (ja) 2002-08-22 2004-04-02 Sumitomo Osaka Cement Co Ltd サセプタ装置
JP2005191500A (ja) 2003-12-26 2005-07-14 Creative Technology:Kk 双極型静電チャックの再生方法
JP2007129142A (ja) 2005-11-07 2007-05-24 Ngk Insulators Ltd 基板載置部材の分離方法及び再利用方法
US20080089001A1 (en) 2006-10-13 2008-04-17 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly

Also Published As

Publication number Publication date
US8597448B2 (en) 2013-12-03
US8968503B2 (en) 2015-03-03
US20140124123A1 (en) 2014-05-08
CN102696101B (zh) 2016-04-06
KR20120120165A (ko) 2012-11-01
SG181503A1 (en) 2012-07-30
WO2011090650A3 (en) 2011-11-10
TW201138017A (en) 2011-11-01
JP5769264B2 (ja) 2015-08-26
US20110155299A1 (en) 2011-06-30
JP2013516084A (ja) 2013-05-09
SG10201408733PA (en) 2015-02-27
TWI488257B (zh) 2015-06-11
CN102696101A (zh) 2012-09-26
WO2011090650A2 (en) 2011-07-28

Similar Documents

Publication Publication Date Title
KR101821425B1 (ko) 정전 척 및 이를 개조하는 방법
JP6640271B2 (ja) 基板を結合する方法
TWI389246B (zh) A method of manufacturing a gas supply structure of an electrostatic chuck device, a gas supply structure of an electrostatic chuck unit, and an electrostatic chuck
TWI591754B (zh) 由靜電夾頭移除受損的環氧樹脂之方法
TWI584371B (zh) 用於電漿切割半導體晶圓之方法和設備
KR102016376B1 (ko) 반도체 식각장비의 리퍼비시 테스트용 더미 싱글 링
US20250220777A1 (en) Method and Apparatus of Substrate Support Repair and Refurbishment
HK1142992B (en) Method for manufacturing gas supply structure in electrostatic chuck apparatus, gas supply structure in electrostatic chuck apparatus, and electrostatic chuck apparatus

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000