KR101821424B1 - 플라즈마 프로세싱 시스템에서 플라즈마의 한정 상태를 검출하는 방법 및 장치 - Google Patents

플라즈마 프로세싱 시스템에서 플라즈마의 한정 상태를 검출하는 방법 및 장치 Download PDF

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KR101821424B1
KR101821424B1 KR1020127012991A KR20127012991A KR101821424B1 KR 101821424 B1 KR101821424 B1 KR 101821424B1 KR 1020127012991 A KR1020127012991 A KR 1020127012991A KR 20127012991 A KR20127012991 A KR 20127012991A KR 101821424 B1 KR101821424 B1 KR 101821424B1
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KR20120097504A (ko
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존 씨 주니어 발코어
제임스 로저스
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1020127012991A 2009-11-19 2010-11-19 플라즈마 프로세싱 시스템에서 플라즈마의 한정 상태를 검출하는 방법 및 장치 Active KR101821424B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US26288609P 2009-11-19 2009-11-19
US61/262,886 2009-11-19
US30362810P 2010-02-11 2010-02-11
US61/303,628 2010-02-11
US12/907,859 US8901935B2 (en) 2009-11-19 2010-10-19 Methods and apparatus for detecting the confinement state of plasma in a plasma processing system
US12/907,859 2010-10-19
PCT/US2010/057478 WO2011063262A2 (en) 2009-11-19 2010-11-19 Methods and apparatus for detecting the confinement state of plasma in a plasma processing system

Publications (2)

Publication Number Publication Date
KR20120097504A KR20120097504A (ko) 2012-09-04
KR101821424B1 true KR101821424B1 (ko) 2018-01-23

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US (1) US8901935B2 (enExample)
JP (1) JP5837503B2 (enExample)
KR (1) KR101821424B1 (enExample)
CN (1) CN102612738B (enExample)
SG (1) SG10201406957PA (enExample)
TW (1) TWI529844B (enExample)
WO (1) WO2011063262A2 (enExample)

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Also Published As

Publication number Publication date
CN102612738B (zh) 2016-01-06
US8901935B2 (en) 2014-12-02
KR20120097504A (ko) 2012-09-04
TWI529844B (zh) 2016-04-11
SG10201406957PA (en) 2014-12-30
US20110115492A1 (en) 2011-05-19
JP5837503B2 (ja) 2015-12-24
TW201126642A (en) 2011-08-01
CN102612738A (zh) 2012-07-25
WO2011063262A3 (en) 2011-09-22
JP2013511815A (ja) 2013-04-04
WO2011063262A2 (en) 2011-05-26

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