SG10201406957PA - Methods and apparatus for detecting the confinement state of plasma in a plasma processing system - Google Patents

Methods and apparatus for detecting the confinement state of plasma in a plasma processing system

Info

Publication number
SG10201406957PA
SG10201406957PA SG10201406957PA SG10201406957PA SG10201406957PA SG 10201406957P A SG10201406957P A SG 10201406957PA SG 10201406957P A SG10201406957P A SG 10201406957PA SG 10201406957P A SG10201406957P A SG 10201406957PA SG 10201406957P A SG10201406957P A SG 10201406957PA
Authority
SG
Singapore
Prior art keywords
plasma
detecting
methods
state
esc
Prior art date
Application number
SG10201406957PA
Other languages
English (en)
Inventor
Jr John C Valcore
James Rogers
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201406957PA publication Critical patent/SG10201406957PA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/14Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/62Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
SG10201406957PA 2009-11-19 2010-11-19 Methods and apparatus for detecting the confinement state of plasma in a plasma processing system SG10201406957PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26288609P 2009-11-19 2009-11-19
US30362810P 2010-02-11 2010-02-11
US12/907,859 US8901935B2 (en) 2009-11-19 2010-10-19 Methods and apparatus for detecting the confinement state of plasma in a plasma processing system

Publications (1)

Publication Number Publication Date
SG10201406957PA true SG10201406957PA (en) 2014-12-30

Family

ID=46319942

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406957PA SG10201406957PA (en) 2009-11-19 2010-11-19 Methods and apparatus for detecting the confinement state of plasma in a plasma processing system

Country Status (7)

Country Link
US (1) US8901935B2 (enExample)
JP (1) JP5837503B2 (enExample)
KR (1) KR101821424B1 (enExample)
CN (1) CN102612738B (enExample)
SG (1) SG10201406957PA (enExample)
TW (1) TWI529844B (enExample)
WO (1) WO2011063262A2 (enExample)

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Also Published As

Publication number Publication date
US8901935B2 (en) 2014-12-02
TW201126642A (en) 2011-08-01
JP5837503B2 (ja) 2015-12-24
JP2013511815A (ja) 2013-04-04
CN102612738A (zh) 2012-07-25
TWI529844B (zh) 2016-04-11
KR101821424B1 (ko) 2018-01-23
WO2011063262A2 (en) 2011-05-26
KR20120097504A (ko) 2012-09-04
CN102612738B (zh) 2016-01-06
US20110115492A1 (en) 2011-05-19
WO2011063262A3 (en) 2011-09-22

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