KR101808372B1 - Cu-Ni-Si 계 합금 및 그 제조 방법 - Google Patents

Cu-Ni-Si 계 합금 및 그 제조 방법 Download PDF

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Publication number
KR101808372B1
KR101808372B1 KR1020137026578A KR20137026578A KR101808372B1 KR 101808372 B1 KR101808372 B1 KR 101808372B1 KR 1020137026578 A KR1020137026578 A KR 1020137026578A KR 20137026578 A KR20137026578 A KR 20137026578A KR 101808372 B1 KR101808372 B1 KR 101808372B1
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South Korea
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orientation
mass
copper
area ratio
annealing
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KR1020137026578A
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English (en)
Korean (ko)
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KR20130143647A (ko
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다카아키 하타노
마사유키 나가노
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제이엑스금속주식회사
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
KR1020137026578A 2011-03-09 2012-03-01 Cu-Ni-Si 계 합금 및 그 제조 방법 KR101808372B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011051975A JP4857395B1 (ja) 2011-03-09 2011-03-09 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JPJP-P-2011-051975 2011-03-09
PCT/JP2012/055255 WO2012121109A1 (fr) 2011-03-09 2012-03-01 ALLIAGE À BASE DE Cu-Ni-Si ET PROCÉDÉ POUR SA FABRICATION

Publications (2)

Publication Number Publication Date
KR20130143647A KR20130143647A (ko) 2013-12-31
KR101808372B1 true KR101808372B1 (ko) 2017-12-12

Family

ID=45604520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137026578A KR101808372B1 (ko) 2011-03-09 2012-03-01 Cu-Ni-Si 계 합금 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP4857395B1 (fr)
KR (1) KR101808372B1 (fr)
CN (1) CN103403202B (fr)
TW (1) TWI447241B (fr)
WO (1) WO2012121109A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5039862B1 (ja) * 2011-07-15 2012-10-03 Ｊｘ日鉱日石金属株式会社 コルソン合金及びその製造方法
WO2013021969A1 (fr) * 2011-08-05 2013-02-14 古河電気工業株式会社 Feuille de cuivre laminée pour un collecteur de batterie secondaire et son procédé de fabrication
JP5039863B1 (ja) * 2011-10-21 2012-10-03 Ｊｘ日鉱日石金属株式会社 コルソン合金及びその製造方法
JP5916418B2 (ja) * 2012-02-13 2016-05-11 古河電気工業株式会社 銅合金板材およびその製造方法
TWI461549B (zh) * 2012-02-14 2014-11-21 Jx Nippon Mining & Metals Corp Carbene alloy and its manufacturing method
JP6111028B2 (ja) * 2012-03-26 2017-04-05 Ｊｘ金属株式会社 コルソン合金及びその製造方法
JP2016084542A (ja) * 2012-03-26 2016-05-19 Ｊｘ金属株式会社 コルソン合金及びその製造方法
JP6196757B2 (ja) * 2012-07-12 2017-09-13 Ｊｘ金属株式会社 コルソン合金及びその製造方法
JP6223057B2 (ja) 2013-08-13 2017-11-01 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
CN103484719A (zh) * 2013-09-29 2014-01-01 苏州市凯业金属制品有限公司 一种白铜合金金属管
JP6050738B2 (ja) 2013-11-25 2016-12-21 Ｊｘ金属株式会社 導電性、成形加工性および応力緩和特性に優れる銅合金板
JP6355671B2 (ja) * 2016-03-31 2018-07-11 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条及びその製造方法
JP2017014624A (ja) * 2016-09-05 2017-01-19 Ｊｘ金属株式会社 コルソン合金及びその製造方法
JP6440760B2 (ja) * 2017-03-21 2018-12-19 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
JP6345290B1 (ja) 2017-03-22 2018-06-20 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
CN107326215A (zh) * 2017-08-15 2017-11-07 徐高杰 一种槽楔用铜合金的加工方法
JP6762333B2 (ja) * 2018-03-26 2020-09-30 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条
CN114752810B (zh) * 2022-03-24 2023-04-11 江苏恒盈电子科技有限公司 一种线路板用高强度半导体引线框架及其制备方法
CN114855026B (zh) * 2022-03-25 2023-02-14 宁波博威合金材料股份有限公司 一种高性能析出强化型铜合金及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011017072A (ja) * 2009-07-10 2011-01-27 Furukawa Electric Co Ltd:The 銅合金材料
JP5158915B2 (ja) 2010-08-27 2013-03-06 古河電気工業株式会社 銅合金板材およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4566048B2 (ja) * 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP4006460B1 (ja) * 2006-05-26 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4596493B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 導電性ばね材に用いられるＣｕ−Ｎｉ−Ｓｉ系合金
JP4875768B2 (ja) * 2008-06-03 2012-02-15 古河電気工業株式会社 銅合金板材およびその製造方法
JP4563495B1 (ja) * 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5520533B2 (ja) * 2009-07-03 2014-06-11 古河電気工業株式会社 銅合金材およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011017072A (ja) * 2009-07-10 2011-01-27 Furukawa Electric Co Ltd:The 銅合金材料
JP5158915B2 (ja) 2010-08-27 2013-03-06 古河電気工業株式会社 銅合金板材およびその製造方法
KR101503185B1 (ko) 2010-08-27 2015-03-16 후루카와 덴키 고교 가부시키가이샤 구리합금 판재 및 그 제조방법

Also Published As

Publication number Publication date
TWI447241B (zh) 2014-08-01
CN103403202B (zh) 2016-08-10
JP2012188689A (ja) 2012-10-04
KR20130143647A (ko) 2013-12-31
TW201239107A (en) 2012-10-01
CN103403202A (zh) 2013-11-20
JP4857395B1 (ja) 2012-01-18
WO2012121109A1 (fr) 2012-09-13

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