KR101803109B1 - 링 조명을 갖는 다크 필드 검사 시스템 - Google Patents
링 조명을 갖는 다크 필드 검사 시스템 Download PDFInfo
- Publication number
- KR101803109B1 KR101803109B1 KR1020127004139A KR20127004139A KR101803109B1 KR 101803109 B1 KR101803109 B1 KR 101803109B1 KR 1020127004139 A KR1020127004139 A KR 1020127004139A KR 20127004139 A KR20127004139 A KR 20127004139A KR 101803109 B1 KR101803109 B1 KR 101803109B1
- Authority
- KR
- South Korea
- Prior art keywords
- inspection system
- dark field
- beam forming
- wafer
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22771309P | 2009-07-22 | 2009-07-22 | |
| US61/227,713 | 2009-07-22 | ||
| PCT/US2010/042354 WO2011011291A1 (en) | 2009-07-22 | 2010-07-16 | Dark field inspection system with ring illumination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120052994A KR20120052994A (ko) | 2012-05-24 |
| KR101803109B1 true KR101803109B1 (ko) | 2017-11-29 |
Family
ID=43499363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127004139A Active KR101803109B1 (ko) | 2009-07-22 | 2010-07-16 | 링 조명을 갖는 다크 필드 검사 시스템 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9176072B2 (https=) |
| EP (1) | EP2457251A4 (https=) |
| JP (2) | JP5639169B2 (https=) |
| KR (1) | KR101803109B1 (https=) |
| CN (1) | CN102473663B (https=) |
| IL (1) | IL217178A (https=) |
| TW (1) | TWI536012B (https=) |
| WO (1) | WO2011011291A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12422379B2 (en) | 2021-10-20 | 2025-09-23 | Lg Energy Solution, Ltd. | Side surface inspection device of cylindrical battery |
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|---|---|---|---|---|
| EP2625508A2 (en) * | 2010-10-08 | 2013-08-14 | Dark Field Technologies, Inc. | Retro-reflective imaging |
| US8885148B2 (en) | 2011-01-04 | 2014-11-11 | Asml Holding N.V. | System and method for design of linear motor for vacuum environment |
| WO2012170352A2 (en) * | 2011-06-06 | 2012-12-13 | The Regents Of The University Of California | Multiplex fluorescent particle detection using spatially distributed excitation |
| US8995746B2 (en) * | 2013-03-15 | 2015-03-31 | KLA—Tencor Corporation | Image synchronization of scanning wafer inspection system |
| CN103245671B (zh) * | 2013-05-09 | 2016-04-13 | 深圳先进技术研究院 | 冲压件表面缺陷检测装置及方法 |
| US9747670B2 (en) | 2013-06-26 | 2017-08-29 | Kla-Tencor Corporation | Method and system for improving wafer surface inspection sensitivity |
| US9182351B2 (en) | 2013-11-26 | 2015-11-10 | Nanometrics Incorporated | Optical metrology system for spectral imaging of a sample |
| US9846122B2 (en) | 2013-11-26 | 2017-12-19 | Nanometrics Incorporated | Optical metrology system for spectral imaging of a sample |
| KR102241978B1 (ko) | 2014-09-11 | 2021-04-19 | 삼성전자주식회사 | 피검체의 표면 검사 방법 및 이를 수행하기 위한 광학 시스템 |
| US9891177B2 (en) * | 2014-10-03 | 2018-02-13 | Kla-Tencor Corporation | TDI sensor in a darkfield system |
| US9395309B2 (en) | 2014-10-15 | 2016-07-19 | Exnodes Inc. | Multiple angle computational wafer inspection |
| CN104407453A (zh) * | 2014-12-17 | 2015-03-11 | 中国电子科技集团公司第三十八研究所 | 一种光控型可调太赫兹波衰减器及其使用方法 |
| JP6522384B2 (ja) * | 2015-03-23 | 2019-05-29 | 三菱重工業株式会社 | レーザレーダ装置及び走行体 |
| CN106066562B (zh) * | 2015-04-21 | 2020-07-10 | 康代有限公司 | 具有扩展的角覆盖范围的检查系统 |
| US10192716B2 (en) * | 2015-09-21 | 2019-01-29 | Kla-Tencor Corporation | Multi-beam dark field imaging |
| JP2017198612A (ja) * | 2016-04-28 | 2017-11-02 | キヤノン株式会社 | 検査装置、検査システム、および物品製造方法 |
| US10739275B2 (en) * | 2016-09-15 | 2020-08-11 | Kla-Tencor Corporation | Simultaneous multi-directional laser wafer inspection |
| WO2018160595A2 (en) | 2017-02-28 | 2018-09-07 | The Regents Of The University Of California | Optofluidic analyte detection systems using multi-mode interference waveguides |
| US11187789B2 (en) | 2017-04-12 | 2021-11-30 | Sense Photonics, Inc. | Devices incorporating integrated detectors and ultra-small vertical cavity surface emitting laser emitters |
| US11237872B2 (en) | 2017-05-23 | 2022-02-01 | Kla-Tencor Corporation | Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries |
| CN111164727A (zh) * | 2017-09-29 | 2020-05-15 | Asml荷兰有限公司 | 用于晶圆检查的高级充电控制器的方法和设备 |
| KR101969232B1 (ko) * | 2017-10-31 | 2019-04-17 | 주식회사 이노비즈 | 측면 비전 장치 |
| CN107727668B (zh) * | 2017-11-03 | 2023-11-14 | 浙江科技学院 | 基于偏振消光的透明介质单面选择成像方法及其装置 |
| CN109973858B (zh) * | 2017-12-28 | 2022-03-08 | 中国科学院深圳先进技术研究院 | 一种用于水下暗场成像的照明器 |
| US20190227002A1 (en) * | 2018-01-24 | 2019-07-25 | Corning Incorporated | Apparatus and methods for inspecting damage intensity |
| US20190355110A1 (en) * | 2018-05-15 | 2019-11-21 | Camtek Ltd. | Cross talk reduction |
| EP3611569A1 (en) * | 2018-08-16 | 2020-02-19 | ASML Netherlands B.V. | Metrology apparatus and photonic crystal fiber |
| US10942135B2 (en) * | 2018-11-14 | 2021-03-09 | Kla Corporation | Radial polarizer for particle detection |
| WO2020170389A1 (ja) * | 2019-02-21 | 2020-08-27 | 株式会社エフケー光学研究所 | 異物検査装置及び異物検査方法 |
| DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
| CN112697794A (zh) * | 2019-10-23 | 2021-04-23 | 上海微电子装备(集团)股份有限公司 | 一种掩模版检测装置、光刻设备及掩模版检测方法 |
| US11397153B2 (en) * | 2019-12-03 | 2022-07-26 | Kla Corporation | Apparatus and method for gray field imaging |
| US11733172B2 (en) | 2020-05-15 | 2023-08-22 | Kla Corporation | Apparatus and method for rotating an optical objective |
| CN112098421B (zh) * | 2020-09-15 | 2022-06-28 | 上海微电子装备(集团)股份有限公司 | 暗场检测装置 |
| CN112179909B (zh) * | 2020-10-19 | 2024-09-20 | 中国工程物理研究院激光聚变研究中心 | 微型大视场超分辨显微成像装置 |
| WO2022176208A1 (ja) | 2021-02-22 | 2022-08-25 | 株式会社 ジャパンセル | 所定光生成方法、所定光利用方法、所定光を利用したサービス提供方法、測定/イメージング方法、光学特性変換素子、光源部、計測部、測定装置、所定光利用装置およびサービス提供システム |
| US20240104777A1 (en) * | 2022-09-23 | 2024-03-28 | Apple Inc. | Camera-alignment-based fault detection for physical components |
| CN117589790B (zh) * | 2023-11-30 | 2024-07-23 | 魅杰光电科技(上海)有限公司 | 暗场照明装置及暗场照明的光学检测系统 |
| CN117538333A (zh) * | 2023-12-26 | 2024-02-09 | 苏州矽行半导体技术有限公司 | 镜头阵列和晶圆检测设备 |
| WO2025187232A1 (ja) * | 2024-03-04 | 2025-09-12 | パナソニックIpマネジメント株式会社 | レンズ、光学システム、撮像装置及び検査装置 |
| CN119556513B (zh) * | 2024-12-16 | 2026-02-10 | 中国科学院空天信息创新研究院 | 一种基于空心方环激光照明的水下成像装置 |
| KR102874969B1 (ko) * | 2025-06-24 | 2025-10-23 | 주식회사 블루타일랩 | 워피지 검사를 위한 빔 패턴 분석 장치 및 이를 포함하는 웨이퍼 검사 장치 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005517906A (ja) * | 2002-02-11 | 2005-06-16 | ケーエルエー−テンカー テクノロジィース コーポレイション | 表面の異常および/または形状を検出するためのシステム |
| JP2005214978A (ja) * | 2004-01-30 | 2005-08-11 | Leica Microsystems Semiconductor Gmbh | ウェーハを検査するための装置及び方法 |
| JP2007192759A (ja) * | 2006-01-23 | 2007-08-02 | Hitachi High-Technologies Corp | 欠陥検査装置およびその方法 |
| JP2007240512A (ja) * | 2006-02-08 | 2007-09-20 | Hitachi High-Technologies Corp | ウェハ表面欠陥検査装置およびその方法 |
| JP2008046075A (ja) * | 2006-08-21 | 2008-02-28 | Omron Corp | 光学系、薄膜評価装置および薄膜評価方法 |
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| JPS61104243A (ja) | 1984-10-29 | 1986-05-22 | Hitachi Ltd | 異物検出方法及びその装置 |
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| KR100663365B1 (ko) * | 2005-07-18 | 2007-01-02 | 삼성전자주식회사 | 내부에 적어도 한 쌍의 빔 경로들을 갖는 렌즈 유니트를구비하는 광학적 검사장비들 및 이를 사용하여 기판의 표면결함들을 검출하는 방법들 |
| JP4988224B2 (ja) * | 2006-03-01 | 2012-08-01 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
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-
2010
- 2010-07-16 EP EP10802700.4A patent/EP2457251A4/en not_active Withdrawn
- 2010-07-16 US US12/919,760 patent/US9176072B2/en active Active
- 2010-07-16 CN CN201080033782.9A patent/CN102473663B/zh active Active
- 2010-07-16 JP JP2012521696A patent/JP5639169B2/ja active Active
- 2010-07-16 KR KR1020127004139A patent/KR101803109B1/ko active Active
- 2010-07-16 WO PCT/US2010/042354 patent/WO2011011291A1/en not_active Ceased
- 2010-07-22 TW TW099124187A patent/TWI536012B/zh active
-
2011
- 2011-12-25 IL IL217178A patent/IL217178A/en active IP Right Grant
-
2014
- 2014-07-07 JP JP2014140065A patent/JP6072733B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005517906A (ja) * | 2002-02-11 | 2005-06-16 | ケーエルエー−テンカー テクノロジィース コーポレイション | 表面の異常および/または形状を検出するためのシステム |
| JP2005214978A (ja) * | 2004-01-30 | 2005-08-11 | Leica Microsystems Semiconductor Gmbh | ウェーハを検査するための装置及び方法 |
| JP2007192759A (ja) * | 2006-01-23 | 2007-08-02 | Hitachi High-Technologies Corp | 欠陥検査装置およびその方法 |
| JP2007240512A (ja) * | 2006-02-08 | 2007-09-20 | Hitachi High-Technologies Corp | ウェハ表面欠陥検査装置およびその方法 |
| JP2008046075A (ja) * | 2006-08-21 | 2008-02-28 | Omron Corp | 光学系、薄膜評価装置および薄膜評価方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12422379B2 (en) | 2021-10-20 | 2025-09-23 | Lg Energy Solution, Ltd. | Side surface inspection device of cylindrical battery |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2457251A4 (en) | 2017-11-08 |
| IL217178A0 (en) | 2012-02-29 |
| JP5639169B2 (ja) | 2014-12-10 |
| JP2014222239A (ja) | 2014-11-27 |
| US20110169944A1 (en) | 2011-07-14 |
| CN102473663A (zh) | 2012-05-23 |
| JP2012533756A (ja) | 2012-12-27 |
| CN102473663B (zh) | 2016-11-09 |
| JP6072733B2 (ja) | 2017-02-01 |
| KR20120052994A (ko) | 2012-05-24 |
| US9176072B2 (en) | 2015-11-03 |
| TWI536012B (zh) | 2016-06-01 |
| IL217178A (en) | 2017-04-30 |
| TW201132960A (en) | 2011-10-01 |
| WO2011011291A1 (en) | 2011-01-27 |
| EP2457251A1 (en) | 2012-05-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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