KR101786411B1 - 구리 합금판 및 그것을 구비하는 방열용 전자 부품 - Google Patents

구리 합금판 및 그것을 구비하는 방열용 전자 부품 Download PDF

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Publication number
KR101786411B1
KR101786411B1 KR1020167015140A KR20167015140A KR101786411B1 KR 101786411 B1 KR101786411 B1 KR 101786411B1 KR 1020167015140 A KR1020167015140 A KR 1020167015140A KR 20167015140 A KR20167015140 A KR 20167015140A KR 101786411 B1 KR101786411 B1 KR 101786411B1
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KR
South Korea
Prior art keywords
copper alloy
annealing
heat dissipation
rolling
mpa
Prior art date
Application number
KR1020167015140A
Other languages
English (en)
Korean (ko)
Other versions
KR20160083102A (ko
Inventor
유키 가와사키
아키히로 가키타니
Original Assignee
제이엑스금속주식회사
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Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20160083102A publication Critical patent/KR20160083102A/ko
Application granted granted Critical
Publication of KR101786411B1 publication Critical patent/KR101786411B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
KR1020167015140A 2013-11-08 2014-06-10 구리 합금판 및 그것을 구비하는 방열용 전자 부품 KR101786411B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-232380 2013-11-08
JP2013232380A JP5822895B2 (ja) 2013-11-08 2013-11-08 銅合金板および、それを備える放熱用電子部品
PCT/JP2014/065366 WO2015068420A1 (ja) 2013-11-08 2014-06-10 銅合金板および、それを備える放熱用電子部品

Publications (2)

Publication Number Publication Date
KR20160083102A KR20160083102A (ko) 2016-07-11
KR101786411B1 true KR101786411B1 (ko) 2017-10-17

Family

ID=53041209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167015140A KR101786411B1 (ko) 2013-11-08 2014-06-10 구리 합금판 및 그것을 구비하는 방열용 전자 부품

Country Status (5)

Country Link
JP (1) JP5822895B2 (zh)
KR (1) KR101786411B1 (zh)
CN (1) CN105705666B (zh)
TW (1) TWI545209B (zh)
WO (1) WO2015068420A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107400799A (zh) * 2017-08-07 2017-11-28 苏州列治埃盟新材料技术转移有限公司 一种用于机车电子硬件设备的铜基合金材料及其制备方法
JP6783342B2 (ja) * 2019-04-12 2020-11-11 日鉄ステンレス株式会社 オーステナイト系ステンレス鋼およびその製造方法
CN111128944B (zh) * 2019-12-30 2021-12-10 南通南平电子科技有限公司 一种高性能电容引线框架
JP2023005017A (ja) * 2021-06-28 2023-01-18 Ｄｏｗａメタルテック株式会社 銅合金板材および銅合金板材の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4157899B2 (ja) 2006-11-17 2008-10-01 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板
JP2010126783A (ja) 2008-11-28 2010-06-10 Nippon Mining & Metals Co Ltd 電子材料用銅合金板又は条
JP2012211353A (ja) 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP2013108122A (ja) 2011-11-18 2013-06-06 Jx Nippon Mining & Metals Corp 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP5847787B2 (ja) 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4209145B2 (ja) * 2002-06-28 2009-01-14 日鉱金属株式会社 曲げ加工性に優れた高強度りん青銅条
JP4255330B2 (ja) 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP5235080B2 (ja) * 2007-09-28 2013-07-10 Ｊｘ日鉱日石金属株式会社 銅合金箔及びそれを用いたフレキシブルプリント基板
JP5320642B2 (ja) * 2009-04-17 2013-10-23 株式会社Ｓｈカッパープロダクツ 銅合金の製造方法及び銅合金
JP5170916B2 (ja) * 2010-08-27 2013-03-27 古河電気工業株式会社 銅合金板材及びその製造方法
JP5427968B1 (ja) * 2013-03-29 2014-02-26 Ｊｘ日鉱日石金属株式会社 銅合金板および、それを備える放熱用電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4157899B2 (ja) 2006-11-17 2008-10-01 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板
JP2010126783A (ja) 2008-11-28 2010-06-10 Nippon Mining & Metals Co Ltd 電子材料用銅合金板又は条
JP2012211353A (ja) 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP2013108122A (ja) 2011-11-18 2013-06-06 Jx Nippon Mining & Metals Corp 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP5847787B2 (ja) 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板

Also Published As

Publication number Publication date
CN105705666A (zh) 2016-06-22
CN105705666B (zh) 2018-01-09
TWI545209B (zh) 2016-08-11
TW201518519A (zh) 2015-05-16
KR20160083102A (ko) 2016-07-11
JP2015093994A (ja) 2015-05-18
JP5822895B2 (ja) 2015-11-25
WO2015068420A1 (ja) 2015-05-14

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