KR101761429B1 - 액처리 장치, 액처리 장치의 제어 방법, 및 컴퓨터 판독 가능한 기억 매체 - Google Patents

액처리 장치, 액처리 장치의 제어 방법, 및 컴퓨터 판독 가능한 기억 매체 Download PDF

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KR101761429B1
KR101761429B1 KR1020120080725A KR20120080725A KR101761429B1 KR 101761429 B1 KR101761429 B1 KR 101761429B1 KR 1020120080725 A KR1020120080725 A KR 1020120080725A KR 20120080725 A KR20120080725 A KR 20120080725A KR 101761429 B1 KR101761429 B1 KR 101761429B1
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supply
valve
liquid
processing apparatus
supply pipe
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Korean (ko)
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KR20130014024A (ko
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노리히로 이토
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6508—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6534—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks

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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020120080725A 2011-07-27 2012-07-24 액처리 장치, 액처리 장치의 제어 방법, 및 컴퓨터 판독 가능한 기억 매체 Active KR101761429B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011164651A JP5613636B2 (ja) 2011-07-27 2011-07-27 液処理装置、液処理装置の制御方法、コンピュータプログラム、及びコンピュータ可読記憶媒体
JPJP-P-2011-164651 2011-07-27

Publications (2)

Publication Number Publication Date
KR20130014024A KR20130014024A (ko) 2013-02-06
KR101761429B1 true KR101761429B1 (ko) 2017-07-25

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JP (1) JP5613636B2 (https=)
KR (1) KR101761429B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180350636A1 (en) * 2017-05-31 2018-12-06 Tokyo Electron Limited Substrate solution-treatment apparatus, treatment solution supplying method and storage medium

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6216200B2 (ja) * 2013-09-30 2017-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6439964B2 (ja) * 2014-09-17 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6328538B2 (ja) * 2014-11-11 2018-05-23 東京エレクトロン株式会社 基板液処理装置の洗浄方法、記憶媒体及び基板液処理装置
JP6625385B2 (ja) * 2015-09-28 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2017212335A (ja) * 2016-05-25 2017-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11094568B2 (en) * 2017-04-24 2021-08-17 Tokyo Electron Limited Processing apparatus, abnormality detection method, and storage medium
JP7071209B2 (ja) * 2018-05-11 2022-05-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液吐出装置、処理液吐出方法、および基板処理装置
KR102139606B1 (ko) * 2018-12-21 2020-07-30 세메스 주식회사 기판 처리 장치 및 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031668A (ja) * 2002-06-26 2004-01-29 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理システム、およびプログラム
JP2004273838A (ja) * 2003-03-10 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010073826A (ja) * 2008-09-17 2010-04-02 Realize Advanced Technology Ltd 処理液供給装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031668A (ja) * 2002-06-26 2004-01-29 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理システム、およびプログラム
JP2004273838A (ja) * 2003-03-10 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010073826A (ja) * 2008-09-17 2010-04-02 Realize Advanced Technology Ltd 処理液供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180350636A1 (en) * 2017-05-31 2018-12-06 Tokyo Electron Limited Substrate solution-treatment apparatus, treatment solution supplying method and storage medium
US10937669B2 (en) * 2017-05-31 2021-03-02 Tokyo Electron Limited Substrate solution-treatment apparatus, treatment solution supplying method and storage medium

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KR20130014024A (ko) 2013-02-06
JP2013030559A (ja) 2013-02-07
JP5613636B2 (ja) 2014-10-29

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