KR101757497B1 - 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법 - Google Patents

경화성 조성물, 경화물 및 경화성 조성물의 사용 방법 Download PDF

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Publication number
KR101757497B1
KR101757497B1 KR1020127020627A KR20127020627A KR101757497B1 KR 101757497 B1 KR101757497 B1 KR 101757497B1 KR 1020127020627 A KR1020127020627 A KR 1020127020627A KR 20127020627 A KR20127020627 A KR 20127020627A KR 101757497 B1 KR101757497 B1 KR 101757497B1
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KR
South Korea
Prior art keywords
group
silane compound
carbon atoms
curable composition
halogen atom
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KR1020127020627A
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English (en)
Korean (ko)
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KR20120135225A (ko
Inventor
미키히로 가시오
리츠민 죠
Original Assignee
린텍 가부시키가이샤
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Publication of KR20120135225A publication Critical patent/KR20120135225A/ko
Application granted granted Critical
Publication of KR101757497B1 publication Critical patent/KR101757497B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020127020627A 2010-02-10 2011-02-09 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법 KR101757497B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010027271 2010-02-10
JPJP-P-2010-027271 2010-02-10
PCT/JP2011/052709 WO2011099501A1 (ja) 2010-02-10 2011-02-09 硬化性組成物、硬化物および硬化性組成物の使用方法

Publications (2)

Publication Number Publication Date
KR20120135225A KR20120135225A (ko) 2012-12-12
KR101757497B1 true KR101757497B1 (ko) 2017-07-12

Family

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KR1020127020627A KR101757497B1 (ko) 2010-02-10 2011-02-09 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법

Country Status (5)

Country Link
JP (1) JP5700689B2 (zh)
KR (1) KR101757497B1 (zh)
CN (1) CN102741348B (zh)
TW (1) TWI518137B (zh)
WO (1) WO2011099501A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103282440B (zh) * 2010-11-30 2016-01-20 琳得科株式会社 固化性组合物、固化物及固化性组合物的使用方法
JP6331688B2 (ja) * 2014-05-23 2018-05-30 株式会社リコー 液体吐出ヘッド及びその製造方法、並びに液体吐出装置及び画像形成装置
MY189101A (en) * 2015-12-22 2022-01-25 Lintec Corp Curable composition, method for producing curable composition, cured product, and use of curable composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104505A1 (ja) * 2008-02-19 2009-08-27 リンテック株式会社 ポリオルガノシロキサン化合物を主成分とする接着剤

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
JP5115099B2 (ja) * 2006-09-04 2013-01-09 東レ・ファインケミカル株式会社 アシロキシ基を有するシリコーン共重合体及びその製造方法
JP5050684B2 (ja) * 2006-10-13 2012-10-17 日立化成工業株式会社 感光性樹脂組成物、シリカ系被膜の形成方法、及びシリカ系被膜を備える装置及び部材
US7736837B2 (en) * 2007-02-20 2010-06-15 Az Electronic Materials Usa Corp. Antireflective coating composition based on silicon polymer
JP5075680B2 (ja) * 2007-03-28 2012-11-21 リンテック株式会社 光素子用封止材および光素子封止体
JP5425406B2 (ja) * 2007-06-29 2014-02-26 リンテック株式会社 ポリシルセスキオキサン化合物からなる成形材料、封止材および光素子封止体
CN102007165B (zh) * 2008-02-14 2016-04-13 琳得科株式会社 由聚有机硅氧烷化合物构成的成型材料、密封材料及光元件密封体
JP5425759B2 (ja) * 2008-03-26 2014-02-26 リンテック株式会社 シラン化合物重合体からなる固定材及び光素子封止体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104505A1 (ja) * 2008-02-19 2009-08-27 リンテック株式会社 ポリオルガノシロキサン化合物を主成分とする接着剤

Also Published As

Publication number Publication date
JP5700689B2 (ja) 2015-04-15
KR20120135225A (ko) 2012-12-12
WO2011099501A1 (ja) 2011-08-18
TW201139560A (en) 2011-11-16
JPWO2011099501A1 (ja) 2013-06-13
CN102741348A (zh) 2012-10-17
CN102741348B (zh) 2014-11-12
TWI518137B (zh) 2016-01-21

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