TW201139560A - Curable composition, cured article, and use of curable composition - Google Patents

Curable composition, cured article, and use of curable composition Download PDF

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TW201139560A
TW201139560A TW100104249A TW100104249A TW201139560A TW 201139560 A TW201139560 A TW 201139560A TW 100104249 A TW100104249 A TW 100104249A TW 100104249 A TW100104249 A TW 100104249A TW 201139560 A TW201139560 A TW 201139560A
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decane
compound
curable composition
decane compound
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TW100104249A
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Chinese (zh)
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TWI518137B (en
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Mikihiro Kashio
Ritsumin Cho
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Lintec Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Abstract

Disclosed are: a curable composition comprising (A) a silane compound copolymer having a specific repeating unit, (B) an epoxy compound, and (C) a curing agent comprising an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride at a such a ratio that (A):[(B)+(C)] is 100:20 to 100:60 (by mass); a cured article produced by curing the composition; and a method for utilizing the composition as an adhesive agent for a fixing material for an optical element or a sealing material for a fixing material for an optical element. The curable composition can exhibit excellent heat resistance and transparency for a long period and enables the production of a cured article capable of exhibiting high adhesion properties even at high temperatures.

Description

201139560 六、發明說明: 【發明所屬之技術領域】 本發明係關於可得透明 接著力之硬化物之硬化性組 化物,以及使用該組成物作 元件固定用封裝材之方法。 性及耐熱性優良,且具有高的 成物,硬化該組成物而成之硬 為光元件固定材用接著劑或光 【先前技術】 至今,硬化性組成物,依照用途做了各式各樣的改良 ’而在產業上廣泛地利用於作為光學零件或原形體之原料 、接著劑、塗層劑#。例如,形成透明性優良的硬化物之 硬化性組成物,作為光學零件的原料或㈣劑,此外,形 成具有高接著力的硬化物之硬化性組成物,可良好地用於 作為接者劑或塗層劑。 此外,近年來,硬化性組成物,亦被利用作為製造光 元件封裝體時,作為光元件固定材用接著劑或光元件固定 材用封裝劑等的光元件固定材用組成物。 光元件,有半導體雷射(LD)等的各種雷射或發光二極 體⑽)等的發光元件、感光元件、複合光元件、光積體電 路等。近年,#光波♦更短波長的藍光或白光的光元件被 開發而廣泛地被使用。隨著如此之發光波峰波長短的發光 兀件的高亮度化的飛躍的進步,《元件的發熱量有變的更 大的傾向。 然而,在於近年隨著光元件的高亮度化,光元件固定 3 201139560 材用組成物的 一 〜奶里即元或由光 70件所產生的高溫的熱’而惡化產生龜裂、剝離等問題。 為解決此問題,在於專利文獻卜3,提案有以聚倍半石夕 氧烷化合物為主成分之光元件固定材用組成物。 但是’即使是以專利文獻卜3所記載之聚倍半矽氧烷化 合物為S成分之光元件以㈣组成物之硬化物亦有難 以保持充分的接著力,而得到耐熱性及透明性之情形。 此外,作為用於光元件封裝用之組成物,於專利文獻4 ,提案有使用脂環式環氧樹脂之環氧樹脂組成物,於專利 文獻5,提案含有聚硫醇化合物之環氧樹脂組成物。 但疋,即使是使用該等組成物之情形,隨著經時變化 無法滿足充分的耐光惡化性,或有接著力降低之情形。 因此,期望開發可得耐熱性、透明性更優良,高接著 力之硬化物之硬化性組成物。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2004-359933號公報 [專利文獻2]日本特開2005-263869號公報 [專利文獻3]日本特開200 6-328231號公報 [專利文獻4]曰本特開平7-309927號公報 [專利文獻5]日本特開2009-00 1 752號公報 【發明内容】 4 201139560 [發明所欲解決的課題] 本發明係有鑑於所關先前技術 之情形而完成者[Technical Field] The present invention relates to a hardenable composition of a cured product which can obtain a transparent and subsequent force, and a method of using the composition as a member for fixing a component. It is excellent in properties and heat resistance, and has a high product, and is hardened into an adhesive for optical element fixing materials or light. [Previous technique] The curable composition has been variously used according to the purpose. The improvement is widely used in the industry as a raw material, an adhesive, and a coating agent # as an optical component or a prototype. For example, a curable composition of a cured product having excellent transparency is formed as a raw material or a (four) agent for an optical component, and a curable composition having a cured product having a high adhesion is formed, and can be suitably used as a carrier or Coating agent. In addition, in the case of manufacturing an optical element package, the curable composition is used as a composition for an optical element fixing material such as an adhesive for an optical element fixing material or an encapsulant for an optical element fixing material. The optical element includes a light-emitting element such as a laser or a light-emitting diode (10) such as a semiconductor laser (LD), a light-receiving element, a composite optical element, and an optical unit circuit. In recent years, #光波♦ Short-wavelength blue or white light elements have been developed and widely used. With the advancement of the high luminance of the light-emitting element having such a short wavelength of the light-emitting peak, the heat generation amount of the element tends to become larger. However, in recent years, with the increase in the brightness of the optical element, the optical element is fixed, and the problem of cracking, peeling, etc. is deteriorated by the heat of the high-temperature heat generated by the material of the composition of the material. . In order to solve this problem, in the patent document 3, a composition for an optical element fixing material containing a polysilsesquioxane compound as a main component is proposed. However, even in the case of the optical element having the poly-sesquioxalate compound described in Patent Document 3 as the S component, it is difficult to maintain sufficient adhesion by the cured product of the (IV) composition, and heat resistance and transparency are obtained. . Further, as a composition for optical element packaging, Patent Document 4 proposes an epoxy resin composition using an alicyclic epoxy resin, and Patent Document 5 proposes an epoxy resin composition containing a polythiol compound. Things. However, even in the case of using such a composition, sufficient light deterioration resistance cannot be satisfied with the change over time, or there is a case where the adhesion is lowered. Therefore, it has been desired to develop a curable composition of a cured product which is excellent in heat resistance, transparency, and high adhesion. [Patent Document 1] [Patent Document 1] JP-A-2004-359933 [Patent Document 2] JP-A-2005-263869 [Patent Document 3] JP-A-200-328231 [ [Patent Document 5] JP-A-H07-309927 (Patent Document 5) Japanese Laid-Open Patent Publication No. 2009-00 No. 752 (Summary of Invention) 4 201139560 [Problems to be Solved by the Invention] The present invention is based on the prior Completion of the technical situation

件固定用封裝材之方法。 明性優良,且具有高的接 硬化該組成物而成之硬化 件固定材用接著劑或光元 [用以解決課題的手段] 現(A)具有特定的矽烷化合物共聚物 本發明者們為解決上述課題反覆銳意研究的結果,發 、(B)環氧樹脂、及(c) 具有羧基之脂環酸針及含有其他的脂環酸酐之組成物之硬 化物,可成為可長期保持優良的透明性、耐熱性,且即使 在於高溫亦可具有高的接著力之硬化物,達至完成本發明。 因此根據本發明之第1,可提供下述[丨]〜[8 ]之硬化性 組成物。 [1]一種硬化性組成物,其係將(A)於分子内,具有下 式(i)、(ii)及(iii)所示之反覆單位之中的(〇及(Η)、(〇 及(iii)、(ii)及(iii)或(i)、(ii)及(iii)之反覆單位, 重量平均分子量為1,000〜30, 〇〇〇之矽烷化合物共聚物; 環氧化合物;及(C)具有幾基之脂環酸酐及含有其他的脂環 酸酐之硬化劑,以(A ) : [ ( B ) + (c ) ] = 1 〇 〇 : 2 〇〜1 〇 〇 : 6 0之比 例(質量比)含有: 201139560A method of fixing a package. An adhesive or optical element for a hardened member fixing material which is excellent in adhesion and has a high adhesion to the composition. [A means for solving the problem] Now (A) has a specific decane compound copolymer. The present inventors As a result of resolving the above problems, the cured product of (B) epoxy resin, and (c) a alicyclic acid needle having a carboxyl group and a composition containing another alicyclic acid anhydride can be excellent in long-term stability. The present invention has been completed in view of transparency, heat resistance, and a cured product having a high adhesion even at a high temperature. Therefore, according to the first aspect of the present invention, the following hardening compositions of [丨] to [8] can be provided. [1] A curable composition which is (A) in a molecule and which has a repeating unit represented by the following formulas (i), (ii) and (iii) (〇 and (Η), (〇) And the reciprocating unit of (iii), (ii) and (iii) or (i), (ii) and (iii), the weight average molecular weight of 1,000 to 30, decane compound copolymer; epoxy compound And (C) an alicyclic anhydride having several groups and a hardener containing other alicyclic anhydrides to (A) : [ ( B ) + (c ) ] = 1 〇〇: 2 〇~1 〇〇: 6 The ratio of 0 (mass ratio) contains: 201139560

式中,K1係表示氫原子或碳t Η之燒基,χ。係表示齒素 原子、氰基或以式:GG表示之基,式中,G係表示經基之 保護基,D係表示單鍵結或連接基,R2係表示碳數卜別之 烧基或可具有取代基之苯基。 [2]如[1]所述之硬化性組成物’其中上述(A)之碎烧化 合物共聚物’係以式:f-cmxq-D-表示之基之存在量 ([V-CiKXO-D])與R2之存在量([R2])之莫耳比為, [R^CHUS-D] : [R2] = 55: 45〜25: 75之矽烷化合物共聚物。 [3 ] —種硬化性組成物,其係將(A,)使包含以式(1). F-CHUO-D-SKORKxi-p所示之矽烷化合物(1)之至少 一種,及式(2) : R2Si(0R4)q(X2)3-q所示之石夕燒化合物(2)之 至少一種之石夕院化合物之混合物縮合而得,重量平均分子 量為1,000〜30,000之矽烷化合物共聚物;(B)環氧彳匕& 物;及(C)具有緩基之脂環酸針及含有其他的脂環酸野之石更 化劑,以(A, ): [(B) + (C)] = l〇〇 : 20~1 00 : 60 之比例(質 量比)含有: 6 201139560 式中,R係表示氫原子或碳數i〜6之烷基,χ❶係表示鹵素 原子、氰基或以式:〇G表示之基,式中,G係表示羥基之 保護基,D係表示單鍵結或連接基,R3係表示碳數卜6之 烷基,X1係表示鹵素原子,p係〇〜3之整數;R2係表示碳數 卜20之烷基或可具有取代基之苯基,R4係表示碳數u之 烷基’ X2係表示鹵素原子,q係表示〇〜3之整數。 [4 ]如[3 ]所述的硬化性組成物,其中上述(A,)之石夕院 化合物共聚物,係將矽烷化合物(丨)與矽烷化合物(2 )以莫 耳比,[矽烷化合物(1)]:[矽烷化合物(2)] = 5^ 45__25 : 7 5之比例縮合而得之矽烷化合物共聚物。 [5 ]如[1 ]或[3 ]所述的硬化性組成物,其中上述(c)的 硬化劑之質量比為(具有羧基之脂肪酸酐):(其他的脂肪酸 酐)=50 : 50〜10 : 90 。 [6 ]如[1 ]或[3 ]所述的硬化性組成物,其中進一步包含 氧化防止劑。 [7 ]如[6 ]所述的硬化性組成物’其中氧化防止劑係碳 系氧化防止劑。 [8 ]如[1 ]或[3 ]所述的硬化性組成物,其係光元件固定 材用組成物。 根據本發明之第2,可提供下述[9 ]、[ 1 〇 ]之硬化物。 [9 ] 一種硬化物,其係硬化[1 ]或[3 ]所述的硬化性組成 物而成。 [10 ]如[9 ]所述之硬化物,其係光元件固定材。 根據本發明之第3,可提供下述[11]、[12]之使用本 201139560 發明之硬化性組成物之方法。 [11] 一種方法,其係使用Π]或[3]所述的硬化性組成 物’作為光元件固定材用接著劑。 [12] —種方法,其係使用[丨]或[3]所述的硬化性組成 物’作為光元件固定材用封裝劑。 [發明效果] 根據本發明之硬化性組成#,可#即使被照射高能量 的光之情形或向溫狀態,並不會著色而降低透明性,可長 期具有優良的透明性,且在於高溫亦可具有高的接著力之 硬化物。 本發明之硬化性組成物,可使用於形成光元件固定材 時,特別是可良好地使用於作為光元件固定用接著劑,及 光元件固定材用封裝劑。 【實施方式】 以下,將本發明分項為1)硬化性組成物、2)硬化物、 及3)硬化性組成物之使用方法詳細說明。 1)硬化性組成物 本發明之硬化性組成物,其特徵在於: (Α)於分子内,具有下式(i)、(Η)及(iu)所示之反 覆單位之中的(i)及(1i)、(i)及(ill)、(⑴及(iU)或 (〇、(ii)及(iii)之反覆單位,重量平均分子量為 1,〇〇〇〜3〇,〇〇〇之矽烷化合物共聚物;(B)環氧化合物;及 (C)具有羧基之脂環酸酐及含有其他的脂環酸酐之硬化 201139560 劑,以(A) : [(B) + (C)] = 100 : 2(Κ100 ·· 60 之比例(質量比) 含有: R\ CH—X。In the formula, K1 represents a hydrogen atom or a burnt group of carbon t χ, χ. Is a dentate atom, a cyano group or a group represented by the formula: GG, wherein G represents a protecting group of a radical, D represents a single bond or a linking group, and R 2 represents a carbon number or a burning group or A phenyl group which may have a substituent. [2] The curable composition as described in [1] wherein the calcined compound copolymer of the above (A) is present in a group represented by the formula: f-cmxq-D- ([V-CiKXO-D ]) The molar ratio of the amount of R2 present ([R2]) is [R^CHUS-D]: [R2] = 55: 45~25: 75 decane compound copolymer. [3] A curable composition comprising (A,) at least one of a decane compound (1) represented by the formula (1). F-CHUO-D-SKORKxi-p, and a formula (2) : a mixture of a mixture of at least one of the shixi compound compounds of the diarrhea compound (2) represented by R2Si(0R4)q(X2)3-q, obtained by copolymerization of a decane compound having a weight average molecular weight of 1,000 to 30,000 (B) epoxy oxime &substance; and (C) alicyclic acid needle with a slow base and other alicyclic acid saponifiers to (A, ): [(B) + (C)] = l〇〇: 20~1 00 : 60 ratio (mass ratio) contains: 6 201139560 where R represents a hydrogen atom or an alkyl group having a carbon number of i to 6, and lanthanide represents a halogen atom and cyanogen. A group represented by the formula: 〇G, wherein G represents a protecting group of a hydroxyl group, D represents a single bond or a linking group, R3 represents an alkyl group of carbon number 6, and X1 represents a halogen atom, p An integer of 〇3; R2 represents an alkyl group of carbon number 20 or a phenyl group which may have a substituent, and R4 represents an alkyl group of a carbon number u. X2 represents a halogen atom, and q represents an integer of 〇~3. . [4] The curable composition according to [3], wherein the above-mentioned (A,) Shi Xiyuan compound copolymer is a decane compound (丨) and a decane compound (2) in a molar ratio, [decane compound (1)]: [decane compound (2)] = 5^45__25: a decane compound copolymer obtained by condensation of a ratio of 7 5 . [5] The curable composition according to [1] or [3] wherein the mass ratio of the hardener of the above (c) is (fatty acid anhydride having a carboxyl group): (other fatty acid anhydride) = 50: 50~ 10 : 90 . [6] The curable composition according to [1] or [3], further comprising an oxidation preventing agent. [7] The curable composition as described in [6] wherein the oxidation preventing agent is a carbon-based oxidation preventing agent. [8] The curable composition according to [1] or [3], which is a composition for a light element fixing material. According to the second aspect of the present invention, the following cured products of [9] and [1 〇] can be provided. [9] A cured product obtained by hardening a hardenable composition as described in [1] or [3]. [10] The cured product according to [9], which is a light element fixing material. According to a third aspect of the present invention, there is provided a method of using the curable composition of the invention of the above [11], [12], in the following [11], [12]. [11] A method of using the curable composition as described in [3] or [3] as an adhesive for an optical element fixing material. [12] A method of using the curable composition as described in [丨] or [3] as an encapsulant for an optical element fixing material. [Effect of the Invention] According to the curable composition # of the present invention, even if it is irradiated with high-energy light or in a warm state, it does not color and reduces transparency, and can have excellent transparency for a long period of time, and is also high in temperature. A hardened material that can have a high adhesion force. When the curable composition of the present invention is used for forming an optical element fixing material, it can be suitably used as an adhesive for fixing an optical element and an encapsulant for an optical element fixing material. [Embodiment] Hereinafter, the method of using the present invention as 1) a curable composition, 2) a cured product, and 3) a curable composition will be described in detail. 1) Curable composition The curable composition of the present invention is characterized in that (i) is in the molecule and has (i) among the repetitive units represented by the following formulas (i), (Η) and (iu) And the recurring units of (1i), (i) and (ill), ((1) and (iU) or (〇, (ii) and (iii), the weight average molecular weight is 1, 〇〇〇~3〇, 〇〇〇 a decane compound copolymer; (B) an epoxy compound; and (C) an alicyclic anhydride having a carboxyl group and a hardened 201139560 agent containing other alicyclic anhydrides, wherein (A): [(B) + (C)] = 100 : 2 (Κ100 ·· 60 ratio (mass ratio) Contains: R\ CH—X.

/ 0) 〇〇 (Hi) ο (Α)矽烷化合物共聚物 本發明之硬化性組成物,作為(A)成分,含有:以上述 式(i)、(ii)及(iii)所示之反覆單位之中,具有及 (η)、(1)及(iii)、(ii)及(Ui)或(i)、(u)及之反 覆單位’重量平均分子量為um,,,之錢化合物共 聚物(以下,有稱為「矽烷化合物共聚物(A)」之情形)。 矽烷化合物共聚物(A),可分別具有(i)、(ii)、(ill) 所示之反覆單位之一種,或兩種以上。 式(iMiii)中,R1係表示氫原子或碳數卜6之烷基, 以氫原子為佳。 以R1表示之碳數1〜6之烷基,可舉甲基、乙基、正丙 基、異丙I、正丁基、第三丁基、異丁基、第二丁基、正 戊基、正己基等。 X係表不氟原子、氣原子、溴原子、碘元子等的鹵素 201139560 原子;氰基或以式:〇G表示之基。 G係表示羥基之保護基。羥基之保護基,並無特別限 制,可舉已知作為㈣之保護基之習知之保護基。可舉例 如,醯基系保護基;三甲基石夕炫基、三乙基石夕烧基、第三 丁基一甲基#院I、第^丁基二苯基⑦炫基等㈣炫基系 保護基;=甲氧基甲基、甲氧基以氧基甲基、卜以氧基乙 土 氫比南2基、四氫呋喃-2-基等的縮醛系保護基; 第三丁氧基幾基等的烧氧幾基系保護基;甲基、乙基、第 三丁基、辛基、烯丙基、三苯基甲基、节基、冑甲氧基节 基苟基二苯甲基、二苯甲基等的峻系保護基等。該等 之中’ G以醯基系保護基為佳。 醯基系保護基,具體而言,係以式·· _c(=〇)r5表示之 基。式中’R5係表示甲基、乙基、正丙基、異丙基、正丁 基、異丁基、第二丁某、篦=丁且 * 了暴m、正戊基等的碳數卜6 之燒基’或可具有取代基之苯基。 ’可舉甲 異丁基、 異辛基等 甲氧基、 以R表示之可具有取代基之苯基之取代基 基、乙基、正丙基、異丙基、正丁基第二丁美 第二丁基、正戊基、正己基、正庚基正辛基、 的烷基;氟原子、氣原子、溴原子等的 乙氧基等的烷氧基。 μ ’ 該等之中 以入手容易性,及可得具有高 硬化物,以選自由氣原子、以式:〇G,表示之 者力之 係表示醯基系之保護基。)及氰基之基為佳,:二式中’G’ 子、乙醯氧基及氰基之基更佳,…氧基特別佳自由氯原 201139560 D係表示單鍵結或連接基。 連接基,可舉可具有取代基之2價有機基。該有機基 之碳數以1〜2 0為佳,以1〜1 〇更佳。 可具有取代基之2價有機基,可舉例如,可具有取代 基之亞烷基、可具有取代基之亞烯基、可具有取代基之亞 炔基、可具有取代基之亞芳基、可具有取代基之(亞烷基、 亞烯基、或亞炔基)及可具有取代基之亞芳基之組合所構成 之2價基等。 可具有取代基之亞烷基之亞烷基,可舉亞曱基、亞乙 基、亞丙基、三亞甲基、四亞甲基、五亞甲基、六亞曱基 等的碳數1~20’最好是碳數1〜1〇之亞烷基。 可具有取代基之亞烯基之亞烯基,可舉亞乙烯基、亞 丙烯基 '亞丁烯基、亞戊烯基等的碳數2〜20之亞烯基,以 碳數2〜10之亞烯基為佳。 可具有取代基之亞炔基之亞炔基,可舉亞乙炔基亞 炳块基等的碳數2〜20之亞炔基’以碳數2〜1〇之亞块基為 佳。 可具有取代基之亞芳基之亞芳基,可舉鄰亞苯基、間 亞苯基、對亞苯基、2, 6-亞萘基等的碳數6〜20之亞芳基, 以碳數6〜10之亞芳基為佳。 上述亞烷基、亞烯基、及亞炔基之取代基,可舉敦原 子、氯原子等的i素原子;曱氧基、乙氧基等的烷氧基; 甲硫基、乙硫基等的烷硫基;曱氧基羧基、乙氧基叛基等 的烷氧基羧基等。 201139560 上述亞芳基之取代基,可舉氛 、 +仇&、硝基、氟原子、氣 原子、肩原子等的鹵素原子;甲美、7健姑 了丁 、乙基等的烷基;甲氧 基、乙氧基等的烷氧基、甲硫基、 ^ 乙硫基等的烷硫基等。 該等取代基,可於亞烧基、亞烯基、亞块基及亞芳基 之基與任意位置鍵結,可為相同或相異複數個鍵結。 可具有取代基之(亞烷基、亞烯基、或亞炔基)與可具 有取代基之亞芳基之組合所構成之2價基,可舉上述可且 有取代基之(亞院基、亞稀基、或亞块基)之至少—種,與 上述可具有取代基之亞芳基之至少一種串聯鍵結之基。具 體而言’可舉下式所示之基。/ 0) 〇〇 (Hi) ο (Α) decane compound copolymer The curable composition of the present invention, as component (A), contains: repeats represented by the above formulas (i), (ii) and (iii) Among the units, there are (η), (1) and (iii), (ii) and (Ui) or (i), (u) and the recurring unit 'weight average molecular weight um,,, the money compound copolymerization (hereinafter, there is a case called "decane compound copolymer (A)"). The decane compound copolymer (A) may have one of the reversing units represented by (i), (ii), and (ill), or two or more types. In the formula (iMiii), R1 represents a hydrogen atom or an alkyl group having a carbon number of 6, and a hydrogen atom is preferred. The alkyl group having 1 to 6 carbon atoms represented by R1 may, for example, be methyl, ethyl, n-propyl, isopropyl I, n-butyl, t-butyl, isobutyl, t-butyl or n-pentyl. , Zhengjiji and so on. The X series shows a halogen such as a fluorine atom, a gas atom, a bromine atom or an iodine atom. The atom is represented by a cyano group or a group represented by the formula: 〇G. G is a protecting group of a hydroxyl group. The protecting group for the hydroxy group is not particularly limited, and a conventional protecting group known as a protecting group of (d) can be mentioned. For example, a fluorenyl-based protecting group; a trimethyl sulphate group, a triethyl sulphate group, a tert-butyl-methyl group, a butyl group, a butyl group, a phenyl group, and the like; An acetal protecting group of a methoxymethyl group, a methoxy group, an oxymethyl group, a ethoxyethyl hydrogen group, a south 2 group, a tetrahydrofuran-2-yl group, etc.; a third butoxy group Other oxygen-based protecting groups; methyl, ethyl, tert-butyl, octyl, allyl, triphenylmethyl, benzyl, fluorenyloxy-decyldiphenylmethyl, A protecting group such as a diphenylmethyl group. Among these, 'G is preferably a thiol-based protecting group. The oxime-based protecting group is specifically represented by the formula _c(=〇)r5. Wherein 'R5 is a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a fluorene group, a butyl group, a butyl group, a pentyl group, and the like. 6 is a base or a phenyl group which may have a substituent. 'A methoxy group such as a methyl isobutyl group or an isooctyl group, a substituent group of a phenyl group which may have a substituent represented by R, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl butyl group An alkyl group such as a second butyl group, n-pentyl group, n-hexyl group or n-heptyl n-octyl group; or an alkoxy group such as an ethoxy group such as a fluorine atom, a gas atom or a bromine atom. μ 。 。 。 。 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ And a cyano group is preferred, and the base of the 'G', ethoxy, and cyano groups is more preferred, and the oxy group is particularly preferably free of chlorine. 201139560 D represents a single bond or a linker. The linking group may be a divalent organic group which may have a substituent. The carbon number of the organic group is preferably from 1 to 2 0, more preferably from 1 to 1 Torr. The divalent organic group which may have a substituent, and, for example, an alkylene group which may have a substituent, an alkenylene group which may have a substituent, an alkynylene group which may have a substituent, an arylene group which may have a substituent, A divalent group or the like which may have a combination of an alkylene group, an alkenylene group or an alkynylene group and an arylene group which may have a substituent. An alkylene group which may have a substituent alkylene group, and may have a carbon number of 1 or more such as an anthracenylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group or a hexamethylene group. Preferably, ~20' is an alkylene group having a carbon number of 1 to 1 fluorene. The alkenylene group which may have a substituent alkenylene group may, for example, be an alkenylene group having 2 to 20 carbon atoms such as a vinylidene group, a propenylene group, a butylene group or a pentenylene group, and have a carbon number of 2 to 10 Alkenylene is preferred. The alkynylene group having an alkynylene group having a substituent may, for example, be an alkynylene group having 2 to 20 carbon atoms such as an ethynylene group or a subunit having a carbon number of 2 to 1 Å. The arylene group which may have a substituent arylene group may, for example, be an arylene group having 6 to 20 carbon atoms such as an o-phenylene group, a m-phenylene group, a p-phenylene group or a 2,6-naphthylene group. An arylene group having 6 to 10 carbon atoms is preferred. Examples of the substituent of the above alkylene group, alkenylene group, and alkynylene group include an atomic atom such as a halogen atom or a chlorine atom; an alkoxy group such as a decyloxy group or an ethoxy group; and a methylthio group or an ethylthio group. An alkylthio group; an alkoxycarboxy group such as a methoxycarboxy group or an ethoxylated group; and the like. 201139560 The substituent of the above arylene group may be a halogen atom such as an atmosphere, a venom, a nitro group, a fluorine atom, a gas atom or a shoulder atom; or an alkyl group such as a sulfonate or an ethyl group; An alkoxy group such as a methoxy group or an ethoxy group, a methylthio group or an alkylthio group such as an ethylthio group. The substituents may be bonded to any of the groups of the alkylene group, the alkenylene group, the sub-block group and the arylene group, and may be the same or different plural bonds. a divalent group which may be a combination of an (alkylene group, an alkenylene group, or an alkynylene group) which may have a substituent and an arylene group which may have a substituent, and may have a substituent described above. At least one of a substrate, a sub-substrate, or a sub-block, and a group bonded to at least one of the above-mentioned arylene groups having a substituent. Specifically, the base shown by the following formula can be mentioned.

該等之中,作為D,由可得具有高接著力之硬化物, 以碳數1 10之亞烷基為佳,以碳數丨〜6之亞烷基更佳,以 亞曱基或亞乙基特別佳。 式(ιιΜιιι)中,r2係表示碳數卜2〇之烷基或可具有 取代基之苯基。 ' 以R表示之碳數1〜2〇之烷基,可舉甲基、乙基、正 丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、 正戊基、正己基、正辛基、異辛基、正壬纟、正癸基、正 十二烷基等。 以R表示之可具有取代基之苯基之取代基,可舉甲 12 201139560 異丁基、 異辛基等 氣原子等 基、乙基、正丙基、異丙基、正丁基、第二丁基 第三丁基、正戊基、正己基、正庚基、正辛基、 的烷基;甲氧基、[氧基等的烷氧基;敗原子、 的鹵素原子等。 以R2表示之可具有取代基之苯基之具體例,可舉笨 基、2-氯苯基、4_甲基苯基、3_乙基苯基、24_二甲基苯 基、2-曱氧基苯基等。 在於矽烷化合物共聚物(A),以式:Rl_CH(xe)_卜表示 之基之存在量([1?1411(}〇咄])與RZ之存在量([1?2])之 比,心叫D]:[昨55:45〜25:75為佳。藉由在該 範圍内,可得之硬化物透明性及接著性優良,1由於耐熱 性優良而即使放置於高溫後亦可抑制該等性質之降低。 以式:V-CHUq-D-表示之基及R2之存在量,例如可 藉由測量矽烷化合物共聚物(A)之NMR光譜定量。 矽烷化合物共聚物(A)之單位構造排列並無特別限 定,可舉無規共聚物、嵌段共聚物、接枝共聚物、交互共 聚物等,以無規共聚物特別佳。 石夕院化合物共聚物(A)之重量平均分子量(Mw)為 1,000〜30, 000之範圍,以uood’ooo之範圍。藉由在於 該範圍,可得組成物的操作性優良,且接著性、耐熱性優 良的硬化物。重量平均分子量(Mw),可例如以四氫呋喃(THF) 作為溶劑之凝膠滲透層析(GPC)之標準聚苯乙烯換算值求 得。 石夕烧化合物共聚物(A)之分子量分布(Mw/Mn),並無特 201139560 別限制,通常以H3.0,以i.卜2.0之範圍為佳。藉由 在於該範圍内,可得接著性、耐熱性優良的硬化物。 矽烷化合物共聚物(Α)可以一種單獨,或組合兩種以上 使用。 矽烷化合物共聚物(Α)’係梯型構造之聚倍半矽氧化合 物。 聚倍半矽氧化合物具有梯型構造,例如,可藉由對反 應生成物進行紅外線吸收光譜測定、x射線繞射測定、nmR 測定而確認。 在於本發明之硬化性組成物,上述(^)成分之矽烷化合 物共聚物(A),亦可係將包含: 式⑴:R丨-CH(X0)-D-Si(OR3)P(X 丨)3-p 所示之矽烷化合物(1)之至少一種,及 式(2) : R2Si(0R4)q(X2)3-q 所示之矽烷化合物(2 )之至少一種之矽烷化合物之混合物 縮合而得,重量平均分子量為1,〇〇〇〜3〇, 〇〇〇之矽烷化合物 共聚物(以下,有稱為「矽烷化合物共聚物(A,)」之情 形。),矽烷化合物共聚物(A)以矽烷化合物共聚物(A,) 為佳。 [矽烷化合物(1)] 矽烷化合物(1), 係以式(丨). t-CHCXO-D-SiCORqpa1)31表示之化合物。藉由使用石夕院 化合物(1),可得於硬化後透明性、接著力亦良好的矽烷化 合物共聚物。 201139560 式(1)中,R1、X。及D之且俨仓丨 之/、體例,可舉於矽烷化合物共聚 物(A )所例示之R、XG及D。 R係表示甲基、乙基、正丙基、 異丙基、正丁基、第 二丁基、異丁基、第三丁基、正光且 戊基、正己基等的碳數1〜6 之烷基。 X1係表示氟原子、氣原子、溴 属原子、碘原子等的鹵素 原子。 、 p係表示0〜3之整數。 P為2以上時,0R3相互可為相同亦可為相此夕卜, (3-p)為2以上時,X1相互可為相同亦可為相異。 矽烷化合物(1)的具體例’可舉:氣甲基三曱氧基矽烷 、溴甲基三乙氧基矽烷、2-氣乙基三丙氧基矽烷、2_溴乙 基三丁氧基矽烷'3-氯丙基三甲氧基矽烷、3_氣丙基三乙 氧基石夕烧、3-氣丙基三丙氧基錢、3_氣丙基三丁氧基石夕 院、3-漠丙基三甲氧基我、3,丙基三乙氧基钱、3_ 漠丙基三丙氧基钱m基三丁氧基钱、3_氣丙基 三甲氧基矽烷、3-氟丙基三乙氧基矽烷、3_氟丙基三丙氧 基矽烷、3-氟丙基三丁氧基矽烷、3_碘丙基三甲氧基矽烷 、2-氣乙基三曱氧基矽烷、3-氣丙基三甲氧基矽烷、4_氣 丁基三曱氧基石夕烧、5-氣戊基三甲氧基矽烷、2_氣丙基三 甲氧基矽烷、3-氣-3-乙醯丙基三曱氧基矽烷、3_氣_3_曱 氧基Ik基丙基二甲氧基石夕院、鄰(2 -氣乙基)苯基三丙氧基 石夕烧、間(2 -氣乙基)苯基三丙氧基矽燒、對(2_氯乙基)苯 基三丙氧基矽烷、對(2-氟乙基)苯基三丙氧基矽烧等的χ0 15 201139560 為鹵素原子之三院氧基石夕院化合物類; 氣曱基三氣矽烷、溴曱基溴二曱基矽烷、2_氯乙基二 氣曱氧基矽炫*、2 -溴乙基二氣乙氧基矽院、3_氯丙基三氣 石夕烧、3 -氮丙基三溴石夕烧、3 -氣丙基二氣甲氧基石夕烧、3-氣丙基二氯乙氧基矽烷、3-氯丙基氣二曱氧基矽烷、3-氣 丙基氣二乙氧基矽烷、3-溴丙基二氯乙氧基矽烷、3-溴丙 基三溴矽烷、3-溴丙基三氣矽烷、3-溴丙基氣二曱氧基矽 烷、3-氟丙基三氣矽烷、3-氟丙基氣二甲氧基矽烷、3-氟 丙基二氣甲氧基矽烷、3-氟丙基氣二乙氧基矽烷、3-碘丙 基三氣石夕炫、4 -氣丁基氣二乙氧基;ε夕烧、3 -氯正丁基氣二 乙氧基矽烷、3 -氣-3 -乙醯丙基二氯乙氧基矽烷、3 -氣-3-曱氧基幾基丙基三漠石夕烧等的X °為函素原子之鹵化石夕院化 合物類; 氰基曱基三甲氧基石夕院、氰基甲基三乙氧基石夕烧、1-氰基乙基三曱氧基矽烷、2-氰基乙基三甲氧基矽烷、2-氰 基乙基三乙氧基石夕烧、2 -氰基乙基三丙氧基石夕烧、3 -氰基 丙基三曱氧基石夕炫*、3 -氰基丙基三乙氧基石夕院、3 -氣基丙 基二丙氧基石夕烧、3_氰基丙基三丁氧基石夕院、4 -氰基丁基 三甲氧基矽烷、5-氰基戊基三曱氧基矽烷、2-氰基丙基三 甲氧基矽烷、2-(氰基甲氧基)乙基三甲氧基矽烷、2-(2-氰基乙氧基)乙基三曱氧基矽烷、鄰(氰基甲基)笨基三丙氧 基矽烷、間(氰基甲基)苯基三甲氧基矽烷、對(氰基甲基) 苯基三乙氧基矽烷、對(2-氰基乙基)苯基三甲氧基矽烷等 之X°為氰基之三烷氧基矽烷化合物類; 16 201139560 鼠基甲基二氣石夕烧、乱基曱基漠二甲氧基石夕烧、2 -氰 基乙基二氯甲氧基矽烷、2-氰基乙基二氣乙氧基矽烷、3_ 氰基丙基三氣矽烷、3-氰基丙基三溴矽烷、3_氰基丙基二 氯甲氧基矽烷、3-氰基丙基二氣乙氧基矽烷' 3_氰基丙基 氣二曱氧基矽烷、3-氰基丙基氣二乙氧基矽烷、4_氰基丁 基氣二乙氧基矽烷、3-氰基正丁基氯二乙氧基矽烷、2_(2_ 氰基乙基)苯基三氯矽烷、2-(2-氰基乙基)乙基溴二乙氧基 石夕烧、2-(2 -氰基乙基)乙基二氯丙氧基矽烷、鄰(2 —氰基乙 基)本基二氣石夕烧、間(2 -氰基乙基)苯基二曱氧基漠石夕院、 對(2 -乱基乙基)苯基二曱氧基氣石夕烧、對(2_氰基乙基)笨 基三溴矽烷等的X11為氰基之函化矽烷化合物類; 3-乙醯氧基丙基三甲氧基矽烷、3_乙醯氧基丙基三乙 氧基矽烷、3-乙醯氧基丙基三丙氧基矽烷、3_乙醯氧基丙 基三丁氧基矽烷、3-丙醯氧基丙基三丁氧基矽烷、3_丙醯 氧基丙基三乙氧基矽烷、3—笨曱醯氧基丙基三曱氧基矽烷 、3-苯甲醯氧基丙基三乙氧基矽烷、3_笨曱醯氧基丙基三 丙氧基矽烷、3-苯曱醯氧基丙基三丁氧基矽烷、2_三曱基 石夕氧基乙基三甲基石夕炫、3-三乙基矽氧基丙基三乙氧基矽 烷、3-(2-四氫η比喃氧基)丙基三丙氧基矽烷、3_(2_四氫吨 喝氧基)丙基三τ氧基料、3-甲氧基f基氧丙基三甲氧基 夕燒3曱氧基乙氧基甲基氧丙基三乙氧基石夕炫、3_(ι一乙 氧基乙基氧)丙基三丙氧基钱、3_(第三丁氧基幾基氧)丙 基三甲氧基石夕烷、3_第三丁氧基丙基三甲氧基石夕烷' 3_节 氧基丙基三乙氧基矽烷、3_三苯基甲氧基丙基三乙氧基矽 17 201139560 烷等的Χβ為上式:0G所示之基之三完氧基矽烷化合物類; 3-乙醯氧基丙基三氣矽烷、3—乙醯氧基丙基三溴矽烷 、3-乙醯氧基丙基二氣甲氧基矽烷、3_乙醯氧基丙基二氯 乙氧基矽烷、3-乙醯氧基丙基氣二曱氧基矽烷、3_乙醯氧 基丙基氣二乙氧基矽烷、3-苯曱醯氧基丙基三氣矽烷、3一 三曱基矽氧基丙基氣二甲氧基矽烷' 3_三乙基矽氧基丙基 二氣曱氧基矽烷、3-(2-四氫吡喃氧基)丙基氯二乙氧基矽 烷、3-(2-四氫呋喃氧基)丙基二氣乙氧基矽烷、3_曱氧基 甲基氧丙基三溴矽烷、3-甲氧基乙氧基甲基氧丙基三氯矽 烷、3-(1-乙氧基乙基養)丙基氣二曱氧基矽烷、3_第三丁 氧基幾基氧丙基二氯甲氧基石夕&、3—第Z 丁氧基丙基氣二 氣乙氧基矽烷、3-三苯基甲氧基丙基二氣乙氧基矽烷、3_ 节氧基丙基三漠㈣等的X。為上式:QG所示之函化石夕院化 合物類等。 該等矽烷化合物(1)可以一種單獨,或組合兩種以上 用。 該等之中,矽烷化合物(1),由可得具有更優良的接著 ,之硬化物,以X。為齒素原子之三烷氧基矽烷化合物類、 X為氰基之二烷氧基矽烷化合物類、或χ()為上式:沉所示之 基之二烷氧基矽烷化合物類為佳,以具有3_氯丙基之三俨 氧基石夕貌化合物類、具有3_乙酿氧基丙基之三院氧基:: :合物類、具有2_氰基乙基之三烷氧基矽烷化合物類二 具有3-氰基丙基之三烷氧基矽烷化合物類更佳。 [矽烷化合物(2 )] 201139560 矽烷化合物(2), 矽烷化合物。 係以式(2) : K2Si(〇R4)q(x2)3q所示之 式(2)中,R2之具體例,可舉於矽烧化合物共聚物(A) 例示作為R2者。 R24係表示與上述㈣樣的碳數卜6之院基。 X2係表示與上述χ1同樣的南素原子。 q係表示〇〜3之任一整數。 Q為2以上時’ 〇R4相互可為相同亦可為相異。此外, (3-〇為2以上時,X2相互可為相同亦可為相異。 矽烷化合物(2)之具體例,可舉:甲基三甲氧基矽烷、 甲基二乙氧基矽烷、乙基三曱氧基矽烷、乙基三乙氧基矽 烷、正丙基三曱氧基矽烷、正丁基三乙氧基矽烷、異丁基 二甲氧基矽烷、正戊基三乙氧基矽烷、正己基三甲氧基矽 烷、異辛基三乙氧基矽烷、十二烷基三甲氧基矽烷、曱基 二甲氧基乙氧基矽烷、甲基二乙氧基曱氧基矽烷等的烷基 二元氣基石夕院化合物類; 甲基氣二甲氧基矽烷、甲基二氯曱氧基矽烷、甲基氣 二乙氧基矽烷、乙基氣二曱氧基矽烷、乙基二氣曱氧基矽 烧、正丙基氣二甲氧基矽烷、正丙基二氯曱氧基矽烷等的 烷基ii化烷氧基矽烷類; 曱基三氯矽烷、曱基三溴矽烷、乙基三氯矽烷、乙基 二 >臭石夕烧、正丙基三氯石夕统、等的院基三||化石夕烧化合物 類; 苯基三曱氧基矽烷、4-甲氧基苯基三曱氧基矽烷、2- 19 201139560 氣苯基三甲氧基矽烷、苯基三乙氧基矽烷、2-甲氧基笨基 二乙乳基石夕院、苯基二曱氧基乙氧基石夕院、苯基二乙氧基 曱氧基矽烷等的可具有取代基之苯基三烷氧基矽烷化合物 類; 苯基氣二曱氧基矽烷、苯基二氣甲氧基矽烷、苯基氣甲 氧基乙氧基矽烧、苯基氣二乙氧基矽院、苯基二氣乙氧基石夕 院等的可具有取代基之苯基函化烷氧基矽烷化合物類; 苯基三氣矽烷、苯基三溴矽烷、4-曱基苯基三氣碎境 、2-氣笨基三氣矽烷、2-乙氧基苯基三氣矽烷等的可具有 取代基之笨基三函化矽烷化合物。 該等石夕院化合物(2)’可以一種單獨,或組合兩種以上 使用。 [石夕烧化合物之混合物] 用於製造矽烷化合物共聚物(A,)時之矽烷化合物之 混合物’可為矽烷化合物(1)及矽烷化合物(2)所組成之現 合物’進一步亦可以不阻礙本發明之目的之範圍包含其他 石夕院化合物之混合物’惟以矽烷化合物(丨)及矽烷化合物 (2)所組成之混合物為佳。 石夕统化合物(1)與石夕院化合物(2 )之使用比例,以莫耳 比以[矽烷化合物(1)]:[矽烷化合物(2)] = 55 : 45〜25 : 了5 為佳。 使上述石夕院化合物之混合物縮合之方法’並無特別限 制’可舉將矽烷化合物(1 )、矽烷化合物(2 )、及根據所期 望之其他矽烷化合物溶解於溶劑,添加既定量的觸媒,以 20 201139560 既定的溫度攪拌之方法。 使用之觸媒,可Α酸觸媒及驗觸#之任一。 媒可舉鹽酸、硫酸、硝酸、鱗酸等的無機酸; 甲碩I、二氟甲磺酸、苯磺酸、”苯磺酸、醋酸、三氟 醋酸等的有機酸等。 鹼觸媒,可舉=甲其於 -r甘 雔― 竿—甲基胺、二乙基胺、二異丙胺基鋰' 又(山甲基矽基)胺基鋰…比啶、I 8~二氮雜雙環[5. 4. °] 反7烯苯胺、甲基吡啶、1,4-二氮雜雙環[2. 2. 2] 辛坑、味唾等的有機驗;氫氧化四甲基敍、氫氧化四乙基 錢等的有機鹽氫氧化物;f醇鈉、乙醇納' 第三丁醇納' 第三丁醇鉀等的金屬醇化物;氫化鈉、氫化鈣等的金屬氫 化物;氫氧化鈉、氫氧化鉀等的金屬氫氧化物;碳酸鈉、 碳酸卸、碳㈣等的金屬碳酸鹽:碳酸氫鈉、碳酸氣卸等 的金屬碳酸氫鹽等。 該等之中,使用的觸媒,以酸觸媒為佳’以無機酸更 佳。 觸媒的使用量,對矽烷化合物的總莫耳量,通常為 〇·1ιη〇1%〜10mol% ’以 1([1〇1%〜5111〇1%的範圍。 使用之溶劑,可按照矽烷化合物的種類等,適宜選擇 。:舉例如··水 '苯、甲苯、二曱苯等的芳香煙類二酸 甲酯、醋酸乙酯、醋酸丙酯、丙酸曱酯等的酯類;丙鲖、 甲乙自同 '甲基異丁酮、帛己酮等酮類;甲醇、乙醇、正丙 醇、異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇等的 醇類等。該溶劑可以一種單獨,或混合兩種以上使用。, 21 201139560 該等之中’以水、芳香烴、及該等之混合溶劑為佳,以 水與曱苯的混合溶劑特別佳’使用水與甲苯時,水與甲笨的 比例(容積比),以1 ·· 9〜9 ·· 1為佳,以7 : 3〜3 : 7更佳。 溶劑的使用量,溶劑1公升當量,石夕烧化合物的總莫耳 量通常為O.lmol〜l〇m〇l,以成為O5m〇1〜1〇m〇1之量更佳。 使矽烷化合物縮合(反應)之溫度,通常為〇t至使用之 溶劑之沸點之溫度範圍’以2〇11〇吖之範圍為佳。反應 溫度過低則縮合反應的進行有不充分的情形。另一方面, 反應溫度過高則難以抑制凝膠化。反應,通常在3〇分至 小時完成。 反應結束後’使用酸觸媒時,藉由對反應溶液添加碳 酸氫納等的驗性水溶液,使用驗觸媒時,對反應溶液添加 鹽酸等的酸進行"”此時將產生的鹽藉由過遽或水洗等 去除’可得目的之矽烷化合物工具物。 (B)環氧化合物 本發明之硬化性組成物,含有環氧化合物(以下,「環 氧化合物(B)」。)作為(B)成分。 本發明之硬化性組成物,由於含有環氧化合物⑻ 作為%虱化合物(B),只要於分子内具有環氧基之化合 物即可,惟具有2個以上的環氧基之化合物為佳。 具有2個以上環氧基之環氧化合物,可舉: 雙酚A、雙酚F、間笨二酚、酚醛、甲 的縮水甘油醚;丁二醇、聚乙二醇、聚丙 縮水甘油醚;鄰苯二甲酸、間笨二甲酸、 齡酸、等的酚類 一醇等的醇類之 對笨二曱酸等的 22 201139560 羧酸之縮水甘油醚;藉由將包含具有碳_碳雙箭之脂環構造 之化合物之該雙鍵鍵結氧化而導入環氧基之所謂脂環式二 氧化合物; & 雙酚六型%氧樹脂、雙酚f型環氧樹脂、雙酚5型環氣樹 脂、脂環式環氧樹脂、曱㈣搭型環氧樹脂、紛㈣型環 氧樹脂、聯苯型環氧樹脂、縮水甘油胺型環氧樹脂、縮: 甘油醚型環氧樹脂、乙内型環氧樹脂、丙晞酸變性環氧樹 脂(丙烯酸環氧酯)、含有磷之環氧樹脂、二苯乙烯型環氧 樹脂、對苯二盼型環氧樹脂、萘骨架型環氧樹脂、四:笨 基乙院型環氧樹脂、DPP(鄰苯二甲酸二正戊醋)型環氧樹脂 、三經基苯基甲院環氧樹脂、二環戊二稀㈣環氧樹脂、曰 含石夕環氧樹脂、雙盼A乙稀氧化物加成之二縮水甘_、雔 齡A型丙稀氧化物加成之二縮水甘油喊、環己燒二曱醇二= 水甘油輕、脂肪族多元醇之聚縮水甘油鍵、多元酸之聚縮 水甘油醚、及該等之齒化物(漠化環氧樹脂等)或加氫物等 的環氧樹脂等。該等可以-種單獨或組合兩種以上使用。 該等之中,即使在於高溫亦可得到具有高接著力之硬 化物之觀點,使用脂環式環氧樹脂化合物為佳。脂環式产 氧樹脂化合物,可舉於分子内具有2個 θ ^衣 衣氧裱,以下式 )表不之3, 4-環氧基環己烷羧酸3, 4_環 ΚΧ 乳衣己基曱酯、乙 婦基環己烯二環氧化物等。該等之中, 烷綾酸3, 4-環氧環己基甲酯特別佳。 ’ %乳基%己 23 201139560Among these, as D, a hardened material having a high adhesion is obtained, preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having a carbon number of 66, and an anthracene group or a sub Ethyl is especially preferred. In the formula (ιιΜιιι), r2 represents an alkyl group having a carbon number or a phenyl group which may have a substituent. 'Alkyl group having 1 to 2 carbon atoms represented by R, and may be methyl, ethyl, n-propyl, isopropyl, n-butyl, t-butyl, isobutyl, t-butyl, or Amyl, n-hexyl, n-octyl, isooctyl, n-decene, n-decyl, n-dodecyl and the like. The substituent of the phenyl group which may have a substituent represented by R may be a group of a gas atom such as an isobutyl group or an isooctyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, and a second group. Butyl butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, alkyl; methoxy, [alkoxy such as oxy; halogen atom of a deficient atom, etc.). Specific examples of the phenyl group which may have a substituent represented by R2 include a phenyl group, a 2-chlorophenyl group, a 4-methylphenyl group, a 3-ethylphenyl group, a 24-dimethylphenyl group, and a 2- Alkoxyphenyl and the like. In the decane compound copolymer (A), the ratio of the group represented by the formula: Rl_CH(xe)_b (the ratio of [1?1411(}〇咄]) to the amount of RZ ([1?2]), The heart is called D]: [55:45~25:75 is better. In this range, the cured product is excellent in transparency and adhesion, and 1 is excellent in heat resistance and can be suppressed even after being placed at a high temperature. The reduction in the nature of the group represented by the formula: V-CHUq-D- and the amount of R2 can be quantified, for example, by measuring the NMR spectrum of the decane compound copolymer (A). Unit of the decane compound copolymer (A) The structural arrangement is not particularly limited, and examples thereof include a random copolymer, a block copolymer, a graft copolymer, and an interpolymer copolymer, and are particularly preferably a random copolymer. The weight average molecular weight of the compound compound (A) of Shi Xiyuan compound (Mw) is in the range of 1,000 to 30,000, and is in the range of uood'ooo. In this range, a cured product having excellent handleability and excellent adhesion and heat resistance can be obtained. Weight average molecular weight (Mw), which can be converted, for example, by standard polystyrene in gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent. The molecular weight distribution (Mw/Mn) of the Shixi-sinter compound copolymer (A) is not limited to 201139560, and is usually in the range of H3.0, which is preferably in the range of i. A cured product having excellent adhesion and heat resistance can be obtained. The decane compound copolymer (Α) can be used singly or in combination of two or more kinds. The decane compound copolymer (Α) is a ladder-type structure of poly-semi-oxygen. The polytetradecyloxy compound has a ladder structure, and can be confirmed, for example, by infrared absorption spectrum measurement, x-ray diffraction measurement, or nmR measurement of the reaction product. In the curable composition of the present invention, the above ( The component decane compound copolymer (A) may also comprise: a decane compound represented by the formula (1): R丨-CH(X0)-D-Si(OR3)P(X 丨)3-p (1) At least one of the formula (2): a mixture of at least one decane compound of at least one of the decane compounds (2) represented by R2Si(0R4)q(X2)3-q, having a weight average molecular weight of 1, 〇〇 〇~3〇, a decane compound copolymer (hereinafter, referred to as "decane compound" In the case of the copolymer (A,)", the decane compound copolymer (A) is preferably a decane compound copolymer (A,). [Hydrane compound (1)] decane compound (1), which is a formula (丨) ). The compound represented by t-CHCXO-D-SiCORqpa1)31. By using the compound compound (1), it is possible to obtain a decane compound copolymer which is excellent in transparency and adhesion after curing. 201139560 In the formula (1), R1, X. And D and 俨 丨 / 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 R represents a carbon number of 1 to 6 such as a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a t-butyl group, an isobutyl group, a t-butyl group, a n-butyl group, a pentyl group or a n-hexyl group. alkyl. X1 represents a halogen atom such as a fluorine atom, a gas atom, a bromine atom or an iodine atom. And p represents an integer of 0 to 3. When P is 2 or more, 0R3 may be the same or may be the same, and when (3-p) is 2 or more, X1 may be the same or different from each other. Specific examples of the decane compound (1) include gas methyl trimethoxy decane, bromomethyl triethoxy decane, 2- gas ethyl tripropoxy decane, and 2-bromoethyl tributoxy group.矽 ' '3-chloropropyltrimethoxy decane, 3 _ propyl propyl triethoxy sulphur, 3- propyl propyl tripropoxy ketone, 3 _ propyl propyl tributoxide XI Xi, 3- desert Propyltrimethoxy I, 3, propyl triethoxy money, 3_ propylpropyl tripropoxy ke m tributyloxyl, 3 _ propyl trimethoxy decane, 3- fluoropropyl tri Ethoxy decane, 3-fluoropropyltripropoxydecane, 3-fluoropropyltributoxydecane, 3-iodopropyltrimethoxydecane, 2-oxoethyltrimethoxyoxydecane, 3- Gas propyl trimethoxy decane, 4 - butyl butyl trimethoxy oxysulfan, 5-air pentyl trimethoxy decane, 2 - propyl propyl trimethoxy decane, 3- gas - 3-ethyl propyl propyl Trimethoxy decane, 3_gas _3_ decyloxy Ik propyl dimethyl methoxy shixi, o (2- gas ethyl) phenyl tripropoxy zebra, m (2-air ethyl) Phenyltripropoxypyrene, p-(2-chloroethyl)phenyltripropoxydecane, p-(2-fluoroethyl)benzene Χ0 15 201139560, such as tripropoxy oxime, is a compound of the three atoms of the halogen atom, a gas-based trioxane, bromodecyl bromide, and 2-chloroethyldimethoxycarbonyl.矽炫*, 2-bromoethyl di-ethoxyethoxy oxime, 3-chloropropyl tri-gas sulphate, 3-a- propyl tribromo sulphate, 3- propyl propyl dimethoxy methoxy Burned, 3-apropyl propyl dichloroethoxy decane, 3-chloropropyl gas dimethoxy decane, 3-gas propyl gas diethoxy decane, 3-bromopropyl dichloro ethoxy decane, 3-bromopropyltribromodecane, 3-bromopropyltrioxane, 3-bromopropyldimethoxydecane, 3-fluoropropyltrioxane, 3-fluoropropyldimethoxydecane , 3-fluoropropyl dioxymethoxy decane, 3-fluoropropyl gas diethoxy decane, 3-iodopropyl trigas sulphate, 4 - butyl butyl diethoxy; , 3-chloro-n-butyl gas diethoxy decane, 3- gas-3-acetamidopropyl dichloroethoxy decane, 3- gas-3-decyloxypropyl propyl sulphate, etc. The X ° is a halogenated fossil compound of the functional atom; cyano decyl trimethoxy sylvestre, cyanomethyl triethyl Basestone, 1-cyanoethyltrimethoxy decane, 2-cyanoethyltrimethoxydecane, 2-cyanoethyltriethoxy sulphur, 2-cyanoethyltripropoxylate Xishao, 3-cyanopropyltrimethoxyxanthine*, 3-cyanopropyltriethoxy-Xiyuan, 3-air-propylpropylpropoxylate, 3-cyanopropyl Butoxylate, 4-cyanobutyltrimethoxydecane, 5-cyanopentyltrimethoxydecane, 2-cyanopropyltrimethoxydecane, 2-(cyanomethoxy)B Trimethoxy decane, 2-(2-cyanoethoxy)ethyltrimethoxy decane, o-(cyanomethyl) phenyl tripropoxy decane, m-(cyanomethyl)phenyl trimethyl a decyloxydecane compound having a cyano group such as oxydecane, p-(cyanomethyl)phenyltriethoxydecane, p-(2-cyanoethyl)phenyltrimethoxydecane or the like; 16 201139560 Murine-based methyl two-gas stone smoldering, chaotic sulfhydryl dimethoate, 2-cyanoethyl dichloromethoxy decane, 2-cyanoethyl diethoxy ethoxy decane, 3_ Cyanopropyl trioxane, 3-cyanopropyltribromodecane, 3_ Propyl dichloromethoxy decane, 3-cyanopropyl diethoxy ethoxy decane ' 3 cyanopropyl gas dimethoxy decane, 3-cyanopropyl gas diethoxy decane, 4 _Cyanobutyl dimethyl dimethoxy decane, 3-cyano-n-butyl chlorodiethoxy decane, 2-(2-cyanoethyl)phenyl trichloro decane, 2-(2-cyanoethyl) Ethyl bromide diethoxy zebra, 2-(2-cyanoethyl)ethyl dichloropropoxy decane, o-(2-cyanoethyl)-based two-gas smoldering, inter- (2 - Cyanoethyl)phenyl di-oxo-molybdenite, p-(2-ranylethyl)phenyl dimethoxy oxy-stone, p-(2-cyanoethyl) phenyl bromide X11 is a cyano functional decane compound; 3-ethoxypropyl propyl trimethoxy decane, 3 ethoxypropyl propyl triethoxy decane, 3-ethoxy propyl propyl tripropyl Oxydecane, 3_ethoxypropyl propyl tributoxy decane, 3-propoxy propyl tributoxy decane, 3- propyl methoxy propyl triethoxy decane, 3 - awkward醯oxypropyl trimethoxy decane, 3-benzyl methoxy propyl triethoxy decane, 3 _ alkoxy propyl three Propoxy decane, 3-phenyl methoxypropyl tributoxy decane, 2 - trimethyl decyl oxyethyl trimethyl sulphate, 3-triethyl methoxy propyl triethoxy decane , 3-(2-tetrahydroη-pyranyloxy)propyltripropoxydecane, 3-(2-tetrahydroxyloxy)propyltritoxylate, 3-methoxyf-oxypropane Trimethoxy ethoxy ethoxylate triethoxy ethoxy ethoxymethyl propyl triethoxy sulphur, 3 - (ι ethoxyethoxy oxy) propyl tripropoxy hydroxy, 3 _ (third butoxy Alkyloxy)propyltrimethoxy aspartate, 3_t-butoxypropyltrimethoxyindolizine 3_ethoxypropyltriethoxydecane, 3-3-triphenylmethoxypropane三三ethoxy 矽 17 201139560 Aβ such as alkane is the above formula: the base of the three oxy decane compounds represented by 0G; 3-ethoxypropyl propyl trioxane, 3-ethoxypropyl propyl Tribromodecane, 3-ethoxypropyl propyl dimethoxy methoxy decane, 3 ethoxypropyl propyl dichloroethoxy decane, 3-ethyl methoxy propyl dimethoxy decane, 3 _Ethyloxypropyl gas diethoxy decane, 3-phenyl methoxy propyl trioxane, 3 曱 曱矽 丙基 methoxy methoxy dimethoxy decane ' 3 — triethyl methoxy propyl di methoxy decane, 3-(2-tetrahydropyranyloxy) propyl chlorodiethoxy decane, 3-(2-tetrahydrofuranyloxy)propyl dioxyethoxysilane, 3-methoxymethyloxypropyltribromodecane, 3-methoxyethoxymethyloxypropyltrichloromethane, 3 -(1-ethoxyethyl propyl) propyl gas dimethoxy decane, 3 _ 3 -butoxy methoxy propyl dichloro methoxy oxa oxime & 3 - Z butyloxypropyl X such as gas two-gas ethoxy decane, 3-triphenyl methoxypropyl di-glycol decane, 3-hydroxypropyl propyl sulphate (tetra). It is the above formula: the fossil compound shown in QG, etc. These decane compounds (1) may be used alone or in combination of two or more. Among these, the decane compound (1) is obtained by having a more excellent cured product, X. It is preferably a trialkoxy decane compound of a dentate atom, a dialkoxy decane compound of which X is a cyano group, or a dialkoxy decane compound of the above formula: a tris-oxyxanthene compound having a 3-chloropropyl group, a tri-yard oxy group having a 3-methoxypropyl group, a : compound, a trialkoxy group having a 2-cyanoethyl group The decane compound is preferably a triacyloxydecane compound having a 3-cyanopropyl group. [decane compound (2)] 201139560 decane compound (2), decane compound. In the formula (2) represented by the formula (2): K2Si(〇R4)q(x2)3q, a specific example of R2 may be exemplified as the R2 compound of the calcined compound copolymer (A). R24 represents the base of the carbon number of the above (4). X2 represents the same Nantin atom as the above χ1. The q system represents any integer of 〇~3. When Q is 2 or more, 〇R4 may be the same or different from each other. Further, when (3-〇 is 2 or more, X2 may be the same or different from each other. Specific examples of the decane compound (2) include methyltrimethoxydecane, methyldiethoxydecane, and B. Tris-decyloxydecane, ethyltriethoxydecane, n-propyltrimethoxyoxane, n-butyltriethoxydecane, isobutyldimethoxydecane, n-pentyltriethoxydecane An alkane such as n-hexyltrimethoxydecane, isooctyltriethoxydecane, dodecyltrimethoxydecane, decyldimethoxyethoxysilane, methyldiethoxymethoxydecane or the like a binary gas based stone compound compound; methyl dimethoxy decane, methyl dichloro decyl decane, methyl gas diethoxy decane, ethyl gas dimethoxy decane, ethyl dioxane An alkyl iodized alkoxy decane such as oxysulfonium, n-propyl dimethyl dimethoxy decane or n-propyl dichloro decyloxy decane; decyl trichloro decane, decyl tribromo decane, ethyl Trichlorodecane, ethyldi> Smelly smelting, n-propyl triclosan, etc. Alkane, 4-methoxyphenyl trimethoxy decane, 2- 19 201139560 gas phenyl trimethoxy decane, phenyl triethoxy decane, 2-methoxy phenyl thiophene sylvestre, benzene a phenyltrialkoxy decane compound which may have a substituent such as phenyl ethoxy ethoxy ethoxylate, phenyl diethoxy decyl oxane or the like; phenyl gas dimethoxy decane, phenyl two A phenyl functional alkoxy group having a substituent such as methoxymethoxydecane, phenyl methoxyethoxy oxime, phenyl diethoxy oxime, phenyl diethoxy ethoxy a quinone compound; a phenyl trioxane, a phenyl tribromodecane, a 4-mercaptophenyl trigas sulphate, a 2-gas phenyl trioxane, a 2-ethoxyphenyl trioxane, etc. a stupid compound of a decyl compound having a substituent. The compound (2)' may be used singly or in combination of two or more. [A mixture of a compound of a smelting compound] for producing a decane compound copolymer (A) , a mixture of decane compounds, which can be a mixture of decane compound (1) and decane compound (2) The step may also be a mixture of other cerium compounds (丨) and a mixture of decane compounds (2), which may not be hindered by the object of the present invention. The compound of the compound (1) and Shi Xi The ratio of the compound of the compound (2) to the molar ratio of [decane compound (1)]: [decane compound (2)] = 55: 45~25: 5 is preferred. The mixture of the above-mentioned compound of the stone compound is condensed. The method of the invention is not particularly limited, and the decane compound (1), the decane compound (2), and other desired decane compounds are dissolved in a solvent, and a predetermined amount of catalyst is added to stir at a predetermined temperature of 20 201139560. Method: The catalyst used can be any one of the phthalic acid catalyst and the touch test #. The medium can be a mineral acid such as hydrochloric acid, sulfuric acid, nitric acid or squaric acid; A Shuo I, difluoromethanesulfonic acid, benzenesulfonic acid, An organic acid such as benzenesulfonic acid, acetic acid or trifluoroacetic acid. Alkali catalyst, can be exemplified by - 甲 - in - 甘 雔 - 竿 - methylamine, diethylamine, diisopropylamino lithium - (methylene methyl fluorenyl) amine lithium ... pyridine, I 8 ~ Diazabicyclo[5. 4. °] anti- 7-aniline, picoline, 1,4-diazabicyclo[2. 2. 2] physic pit, taste saliva, etc.; tetramethyl hydroxide Organic salt hydroxides such as tetraethylammonium hydroxide; metal alkoxides such as sodium alkoxide, sodium ethoxide, third butanol, potassium butoxide; metal hydrides such as sodium hydride and calcium hydride A metal hydroxide such as sodium hydroxide or potassium hydroxide; a metal carbonate such as sodium carbonate, carbonic acid, or carbon (tetra): a metal hydrogencarbonate such as sodium hydrogencarbonate or carbonic acid gas. Among these, the catalyst used is preferably an acid catalyst, and the inorganic acid is more preferable. The amount of catalyst used, the total molar amount of the decane compound, usually 〇·1ιη〇1%~10mol% 'to 1 ([1〇1%~5111〇1% range. Solvent used, according to decane The type of the compound, etc., is suitably selected. For example, an aromatic tobacco such as methyl benzene, toluene or diphenylbenzene, an ester of methyl acetate, ethyl acetate, propyl acetate or decyl propionate;鲖, A and B from the same as 'methyl isobutyl ketone, ketohexanone and other ketones; methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol, third butanol, etc. Alcohols, etc. The solvent may be used singly or in combination of two or more. 21 201139560 Among these, 'water, aromatic hydrocarbons, and the like are preferred, and a mixed solvent of water and benzene is particularly preferred. 'When using water and toluene, the ratio of water to stupid (volume ratio) is preferably 1 ··9~9 ··1, more preferably 7:3~3: 7. Solvent usage, solvent 1 liter The amount of the total molar amount of the compound of the smelting compound is usually from 0.1 mol to 1 〇m 〇 l, preferably to be O5 m 〇 1 〜 1 〇 m 〇 1 . The temperature of the reaction (reaction) is usually in the range of 〇t to the boiling point of the solvent to be used, which is preferably in the range of 2〇11〇吖. When the reaction temperature is too low, the condensation reaction proceeds insufficiently. When the reaction temperature is too high, it is difficult to suppress gelation. The reaction is usually completed in 3 minutes to an hour. After the completion of the reaction, when an acid catalyst is used, an aqueous test solution such as sodium hydrogencarbonate is added to the reaction solution, and the test is used. In the case of a catalyst, an acid such as hydrochloric acid is added to the reaction solution. "At this time, the salt to be produced is removed by hydrazine or water washing, etc." The desired decane compound tool is obtained. (B) Epoxy compound Hardening of the present invention The composition of the present invention contains an epoxy compound (hereinafter referred to as "epoxy compound (B)") as the component (B). The curable composition of the present invention contains the epoxy compound (8) as the % ruthenium compound (B) as long as it contains The compound having an epoxy group in the molecule may be a compound having two or more epoxy groups. The epoxy compound having two or more epoxy groups may, for example, be bisphenol A or bisphenol F or Styrene, phenol Aldehyde, glycidyl ether of methyl, butanediol, polyethylene glycol, polyglycidyl ether; alcohols such as phthalic acid, meta-dicarboxylic acid, aged acid, etc. 22 201139560, a glycidyl ether of a carboxylic acid; a so-called alicyclic dioxy compound which is introduced into an epoxy group by oxidizing the double bond containing a compound having a carbon-carbon double arrow alicyclic structure; & Bisphenol type 6% oxygen resin, bisphenol f type epoxy resin, bisphenol type 5 ring gas resin, alicyclic epoxy resin, bismuth (four) lapped epoxy resin, bis (tetra) epoxy resin, biphenyl type Epoxy resin, glycidylamine epoxy resin, condensation: glyceryl ether epoxy resin, B-type epoxy resin, acrylic acid modified epoxy resin (epoxy acrylate), phosphorus-containing epoxy resin, two Styrene epoxy resin, benzophenone epoxy resin, naphthalene skeleton epoxy resin, four: stupid base epoxy resin, DPP (di-n-pentyl phthalate) epoxy resin, Epoxy resin, dicyclopentadiene (tetra) epoxy resin, bismuth-containing epoxy resin, double A dilute oxide addition of condensed water _, 雔 age A type propylene oxide addition of diglycidyl shunt, cyclohexane bismuth diol 2 = water glycerin light, polyglycol polyglycerol bond An epoxy resin such as a polyglycidyl ether of a polybasic acid, or a toothing compound (such as an epoxy resin) or a hydrogenated product. These may be used alone or in combination of two or more. Among these, even in the case of high temperature, a cured product having a high adhesion can be obtained, and an alicyclic epoxy resin compound is preferably used. The alicyclic oxygen generating resin compound may have two θ ^ clothes oxime in the molecule, and the following formula) 3, 4-epoxycyclohexanecarboxylic acid 3, 4 ring ΚΧ 乳 己Anthracene ester, ethyl 4-cyclohexene diepoxide, and the like. Among these, 3,4-epoxycyclohexylmethyl alkanoate is particularly preferred. ’ %乳基%已 23 201139560

(c)硬化劑 本發明之硬化性組成物’作為成分,包含具有羧基 之脂%式酸酐’及含有其他脂肪式酸酐之硬化劑(以下,有 稱為「硬化劑(c)」之情形。)。 本發明之硬化性組成物,由於含有硬化劑,可得耐 熱性優良的硬化物。 具有羧基之脂環式酸酐,係至少具有一個羧基取代之 脂環式酸酐。 脂環式酸酐之具體例,可舉壬二酸酐、3_甲基 -1,2’3, 6-四氫鄰苯二甲酸酐、4_甲基4,2,3,6 一四氫鄰二 二甲酸針、四氫鄰苯二甲酸酐、3_甲基_六氫鄰苯二甲酸野 、"基-六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基納 迪克H 5-雙環庚稀_2,3_雙竣酸軒、雙環庚稀义^雔 竣酸酐、甲基_5_庚稀_2,3_雙缓酸野、甲基_稀乂3、錐^ 酸酐等。 又羧 羧丞,可取代於脂 %八敗町的脂環構造 取代位置絲代之m基數並無特別限定 該等之中,於六氫鄰苯二甲酸軒取 -1,2,4-三羧酸-1>2酐、 1己烷 ,以環己烧41酸二㈣],2軒為佳 ,,—羧酸-1,2酐特別佳。該化合物, 在立體異構物,且任一異構物均可。 存 具有缓基之脂環式酸肝,可以一種單獨,或組合兩種 24 201139560 以上使用。 其他的脂環式酸酐,係不具有缓基之脂環式酸n 他的脂環式酸針,可舉於上述具有叛基之脂環式酸軒所例 不之脂環式酸針同樣者。其中,3_甲基_六氫鄰苯二甲酸野 、"基-六氫鄰苯二甲酸酐為#,以卜甲基—六氫鄰笨二 甲酸酐特別佳。 — 其他的脂環式酸肝’可以-種單獨,或組合兩種以上 使用。 在於硬化物⑹,具有竣基之脂環式酸肝與其他的脂環 酸酐之使用比例,以具有㈣之脂環式酸野與其他的脂環 酸野之質里比’以(具有m基之脂環式酸酐):(其他的脂環 酸酐)=50 : 50〜10 : 90為佳。 本發明之硬化性組成物,將上述(A)、⑻、及⑹成分 ,以⑴與[(BH(c)kf 量比 1(a):[⑻+ (c)] =⑽: 2〇〜l〇0:6G之比例使用,使上述(A,)、(B)、及⑹成分, 以(A,mUBH⑹]之質量比,以(A,:[⑻+ (c)M〇〇 .2〇〜1〇〇: 60之比例使用。⑻+ (〇的比例較20少則,無法 得到充分的接著力,較60多則’與⑴成分或(a,)成分之 相溶性變差,而無法得到優良的透明性。 再者’(B)、(C)成分之使用比例,以質量比(b): (〇 = 4 :6〜6 : 4為佳,以5 : 5特別佳。 藉由以如此之比例使用各成分,可得長期透明性、耐 熱性優良’即使在高溫亦具有报高的接著力的硬化物之硬 化性組成物。 25 201139560 本發明之硬化性組成物,於上述成分,進一步包含防 止在加熱時之氧化之氧化防止劑為佳。 •氧化防止劑,可舉磷系氧化防止劑、酚系氧化防止劑、 硫系氧化防止劑等’該等之中,以磷系氧化防止劑為佳。 磷m氧化防止劑,可舉:磷酸三苯酯、磷酸二苯基異 癸§日、磷酸苯基二異癸酯、磷酸三(壬基苯基)酯、磷酸二 異癸基異戊四醇酯、磷酸三(2,4_二第三丁基笨基)酯、磷 裒辛戊燒四基雙(十八院基)酯、碟酸環辛戊烧四基雙 (2’4-一第三丁基苯基)酯、磷酸環辛戊烷四基雙(2, 4 —二第 —丁基4-甲基苯基)酯、雙[2_第三丁基_6一曱基一4_丨2一( 十烷氧基羧基)乙基}苯基]氫化磷等的磷酸鹽類、9,1〇_ 二氫-9-氧雜-10_磷雜菲_1〇_氧化物、1〇_(3,5_二第三丁基 4羥苄基)-9’ 10-二氫_9_氧雜_1〇 —磷雜菲_1〇_氧化物1〇一 癸氧基_9’1〇_二氫.氧雜-10-磷雜菲-10-氧化物等的氧 雜碟雜菲氧化物類。 酚糸氧化防止劑,可舉:2, 6-二第三丁基-對甲酚、 基經基甲苯、丁基化經基笨甲喊、2, 二第三丁基對 土酚硬月日&万-(3,5-二第三丁基_4_經基苯基)丙酸醋 的早酚類;2, 2’ -亞甲基雙(4_甲基+第三丁基酚) 2,2,-亞甲基雙(4_乙基+第三丁基酚)、4,4, _硫代 (3-甲基-6-第三丁基酚)、44,_亞丁基雙甲基.第-土紛)3,9雙[1,卜二甲基第三丁基—4一窥』 +甲基㈤丙烯醯氧基)乙基比U,10-四氧螺[5,5J十一 院等的雙紛類’飞1,3-三(M基+經基-5-第三丁基苯邊 26 201139560 )丁烷、1,3,5-三曱基 _2,4 6—三(3 芊其「 一 , 一第—丁基_4~羥基 V基)本、四[亞甲基_3_(3’,5, _二第三丁基 : 基)丙酸酉旨]甲燒、雙[3,3, _雙(4, _經基_3, _第三2本 基)丁酸]二醇自旨、—三(3, ·,5, _二第三·;,基笨(c) Hardening Agent The curable composition of the present invention contains, as a component, a fat % acid anhydride having a carboxyl group and a curing agent containing another aliphatic acid anhydride (hereinafter referred to as "hardening agent (c)". ). Since the curable composition of the present invention contains a curing agent, a cured product excellent in heat resistance can be obtained. An alicyclic acid anhydride having a carboxyl group is an alicyclic acid anhydride having at least one carboxyl group. Specific examples of the alicyclic acid anhydride include azelaic anhydride, 3-methyl-1,2'3,6-tetrahydrophthalic anhydride, and 4-methyl-4,2,3,6-tetrahydrogen Dicarboxylic acid needle, tetrahydrophthalic anhydride, 3-methyl-hexahydrophthalic acid, "yl-hexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl nadic H 5-bicycloheptadose _2,3_bismuthic acid bismuth, double ring heptose bismuth anhydride, methyl _5_glycide _2, 3_ bis-acid acid field, methyl _ 乂 3, cone ^ Anhydride, etc. Further, the carboxy carboxy hydrazine can be substituted for the alicyclic structure of the fat-free Baqian-cho. The number of m-substituted positions is not particularly limited. In the case of hexahydrophthalic acid, the 1,2-,4-three is taken. Carboxylic acid-1 > 2 anhydride, 1 hexane, cyclohexene 41 acid di(tetra)], 2 ct. is preferred, and carboxylic acid-1,2 anhydride is particularly preferred. The compound may be in a stereoisomer and may be any of the isomers. The alicyclic acid liver having a slow-acting base may be used alone or in combination of two types. Other alicyclic acid anhydrides are alicyclic acid needles which do not have a slow-group alicyclic acid, and may be exemplified by the above-mentioned alicyclic acid needles which are not described in the alicyclic acid ring . Among them, 3-methyl-hexahydrophthalic acid field and "yl-hexahydrophthalic anhydride are #, and particularly preferred is methyl-hexahydro-o-benzoic anhydride. — Other alicyclic sour livers ‘ can be used alone or in combination of two or more. In the hardened material (6), the ratio of the use of the alicyclic alicyclic acid liver to other alicyclic anhydrides is such that (4) the alicyclic acid field and the other alicyclic acid field are in the ratio of 'with m base' The alicyclic anhydride): (other alicyclic anhydride) = 50: 50 to 10: 90 is preferred. In the curable composition of the present invention, the components (A), (8), and (6) are (1) and [(BH(c)kf ratio 1 (a): [(8) + (c)] = (10): 2 〇 〜 L〇0: The ratio of 6G is used to make the above (A,), (B), and (6) components, with the mass ratio of (A, mUBH(6)], to (A,:[(8)+ (c)M〇〇.2 〇~1〇〇: The ratio of 60 is used. (8)+ (The ratio of 〇 is less than 20, and sufficient adhesion cannot be obtained. If it is more than 60, the compatibility with the component (1) or (a) is worse. Excellent transparency is not obtained. The ratio of the use of 'B) and (C) is in mass ratio (b): (〇= 4:6~6:4 is better, and 5:5 is especially good. When each component is used in such a ratio, it is possible to obtain a curable composition having a long-term transparency and heat resistance, and having a high adhesion strength even at a high temperature. 25 201139560 The curable composition of the present invention is as described above. The component further includes an oxidation preventing agent which prevents oxidation during heating. • The oxidation preventing agent may be a phosphorus-based oxidation preventing agent, a phenolic oxidation preventing agent, a sulfur-based oxidation preventing agent, etc. The phosphorus-based oxidation preventing agent is preferable. The phosphorus-m oxidation preventing agent may, for example, be triphenyl phosphate, diphenylisophthalic acid, phenyl diisodecyl phosphate or tris(nonylphenyl) phosphate. Diisodecyl isopentenyl phosphate, tris(2,4-di-tert-butylphenyl) phosphate, tetramethyl bis(octadecyl) ester of phosphonium octoxide, cyclooctane octanoate Tetrakis(2'4-monobutylphenyl)ester, cyclooctylpentanyltetrakis(2,4-di-butyl-4-methylphenyl) phosphate, double [2_ Phosphate such as tributyl-6-indenyl- 4-nonyl-2-(decaloxycarboxy)ethyl}phenyl]hydrogen phosphate, 9,1 〇_dihydro-9-oxa-10 Phosphenanthrene-1〇_oxide, 1〇_(3,5_di-t-butyl 4-hydroxybenzyl)-9' 10-dihydro_9_oxa-1〇-phosphaphenanthrene _Oxide 1 〇 癸 癸 _ ' ' 9 9 9 9 二 二 -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- -10- 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物 氧化物: 2, 6-di-tert-butyl-p-cresol, benzyl-based toluene, butylated, thiophene, 2, di-tert-butyl-p-phenol, hard moon, & 10,000-(3,5 - two third butyl _4_ base Early phenols of propionic acid vinegar; 2, 2'-methylenebis(4-methyl+t-butylphenol) 2,2,-methylenebis(4_ethyl+t-butyl Phenol), 4,4, _ thio (3-methyl-6-tert-butyl phenol), 44, _butylene bismethyl. s - sylvestre 3, 9 bis [1, bis dimethyl Third butyl - 4 glimpse + methyl (5) propylene oxime) ethyl ratio U, 10-tetraoxa snail [5, 5J eleven hospitals, etc., fly 1,3-three (M-based + mercapto-5-tert-butylbenzene 26 201139560) butane, 1,3,5-trimethyl 2,4 6-three (3 芊 "one, one - butyl _4 ~ hydroxy V-based) Ben, tetra [methylene_3_(3',5,_di-t-butylidene:yl)propionic acid ]]]甲烧,双[3,3, _双(4, _经基_ 3, _ third 2 base) butyric acid] diol from the purpose, - three (3, ·, 5, _ two third;;

Mwm2,4,6_(1H,3H,5w、M_4^ 子型酚類》 巧》 硫系氧化防止劑,可舉:二月桂基_33, _ 酸酯、二肉杜玆1 〇 0, 八―内烯 且寇基—3, 3 —硫代二丙酸酯、二硬脂基_3, 3, 硫代一丙稀酸醋等。 氧化防止劑,可以一種單獨,亦可組合兩種以上使用。 ,氧化防止劑的使用量,對矽烷化合物共聚物(八)或 (Α )100質量部,以0. 01〜10質量部。 本發明之硬化性組成物,以不阻礙本發明之目的的範 圍,亦可進一步含有其他的成分。 其他的成分,可舉:紫外線吸收劑、光安定劑、稀釋 劑等。 紫外線吸收劑,係以提升所得硬化物之耐光性之目的 而添加。 紫外線吸收劑,可舉例如:柳酸苯酯、柳酸對第三丁 基笨酯、柳酸對辛基苯酯等的柳酸類;2, 4-羥基二笨甲酮 ' 2-羥基-4-甲氧基二苯曱酮、2-羥基辛氧基二苯甲酮 、2 -經基-4-十二烧氧基二笨甲酮、2, 2’ -二經基-4-曱氧 基二苯甲酮、2,2,-二羥基-4,4’ -二曱氧基二苯甲酿I、2-經基-4-甲氧基-5-項酸二苯甲嗣、2-(2’ -經基-5’ -曱基 27 201139560 本基)本並三n坐、2~(2, 唑、2-(2’ _羥基—3,,5 2-(2’ -羥基-3’ -第三· 唑、2-(2’ -羥基-3,,5, 。坐、2-(2’ -經基-3,,5, 2-{(2’ -羥基-3’ ,3,, 經基-5’ -第三丁基苯基)苯並三 ~ —第三丁基苯基)苯並三《坐、 基~5’ -甲基苯基)一 5_氣苯並三 ''二第三丁基苯基)-5-氣苯並三 ''一第三戊基苯基)苯並三〇坐、 ’ 4,,,5’ ,,6’ ,_ 四氫鄰苯 二甲醯亞胺甲基)-5, 四甲基-4 -〇底咬基)癸 甲基笨基}苯並三唑、雙(2, 2, 6, 6- 二酸醋、雙(1,2,2,6,6,-五曱基-4- 哌啶基)癸 酸酯 、雙(1’ 2, 2, 6, 6,-五甲基—4-哌啶基 )[{3’5-雙(l’l-一曱基乙基)羥基苯基丨甲基]丁基丙二 酸酯等的受阻胺類等。 用 該等紫外線吸收劑可以 一種單獨’或組合兩種以上使 紫外線吸收劑的使用眚,番+ 用置對矽烷化合物共聚物(A)或 (A, )100質量部,以〇.〇卜1〇質量部為佳。 光女疋劑’係為提升所;f異石由/μ >^ 上 丌所侍硬化物之耐光性之目的而添 加。 光安定劑,可舉例如: 胺基-1,3,5 -三唤_2, 4 -二基 )亞胺基丨六亞曱基{(2, 2, 6, 等的受阻胺類。 聚[丨6-(1,1,3, 3-四甲基丁基) Η(2, 2, 6, 6-四曱基_4-哌啶基 四甲基-4-哌啶基)亞胺基)] 或組合兩種以上使用。 該等的光安定劑可以一種單獨Mwm2,4,6_(1H,3H,5w, M_4^ Sub-type phenols) Qiao》 Sulfur-based oxidation inhibitor, can be given as: dilauryl _33, _ acid ester, two meat Duz 1 〇 0, eight An alkene and a decyl- 3,3-thiodipropionate, a distearyl _3, 3, a thio-acrylic acid vinegar, etc. The oxidation inhibitor may be used alone or in combination of two or more. The amount of the oxidation preventing agent used is 0.1 to 10 parts by mass of the decane compound copolymer (8) or (Α) 100 parts by mass. The curable composition of the present invention does not hinder the object of the present invention. The other components may further include other components, such as an ultraviolet absorber, a light stabilizer, a diluent, etc. The ultraviolet absorber is added for the purpose of improving the light resistance of the obtained cured product. For example, phenyl ruthenate, salicylic acid, tributyl butyl ester, salicylic acid, p-octyl phenyl ester, etc.; 2, 4-hydroxydibenzophenone ' 2-hydroxy-4-methoxy Dibenzophenone, 2-hydroxyoctyloxybenzophenone, 2-propenyl-4-dodecyloxydimercaptoketone, 2,2'-dipyridyl-4-decyloxy Benzophenone, 2,2,-dihydroxy-4,4'-dimethoxyoxydiphenyl, I, 2-amino-4-methoxy-5-carboxylic acid, diphenylformamidine, 2-( 2'-transcarbyl-5'-mercapto 27 201139560 base) Bens three n sit, 2~(2, oxazole, 2-(2' _hydroxy-3,5 2-(2'-hydroxy-3) '-Third·azole, 2-(2'-hydroxy-3,,5,. Sodium, 2-(2'-carbyl-3,,5,2-{(2'-hydroxy-3',3 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ''Di-tert-butylphenyl)-5-gasbenzotris-'-tripentylphenyl)benzotriazine, '4,,,5',,6',_tetrahydroortylene Dimethyl hydrazide methyl)-5, tetramethyl-4 - fluorene base 癸 methyl phenyl} benzotriazole, bis (2, 2, 6, 6-diacetic acid, double (1 , 2,2,6,6,-pentamethyl-4-piperidinyl) phthalate, bis(1' 2, 2, 6, 6,-pentamethyl-4-piperidinyl) [{3 a hindered amine such as '5-bis(l'l-monodecylethyl)hydroxyphenyl hydrazinemethyl]butylmalonate or the like. The ultraviolet absorbing agent can be used alone or In combination with two or more types of ultraviolet absorbers, it is preferable to use 100 parts of the para-oxane compound copolymer (A) or (A, ), and the mass part is preferably 〇. It is a lifting place; the f-stone is added for the purpose of light resistance of the cured material of /μ >^. For the light stabilizer, for example, amine-1,3,5-three-call _2, 4-diyl)imidopyridinium hexamethylene {{2, 2, 6, etc. hindered amines. Poly[丨6-(1,1,3,3-tetramethylbutyl)phosphonium (2, 2, 6, 6-tetradecyl- 4-piperidinyltetramethyl-4-piperidinyl) Amino)] or a combination of two or more. The light stabilizers can be a single

紫外線吸收劑的使用量,對钱化合物共聚物(Α)或 )100質量部’以0.01〜10質量部為佳。 28 201139560 稀釋劑’係為調整 龍劍n 之黏度而添加。 稀釋劑,可舉例如:甘油 η /田—輛水甘油醚'丁二 水甘油醚、二縮水甘、、ά其 一醇一縮 ” 甘油基本胺、辛戊二醇縮水甘油醚、環 己::甲醇二縮水甘油酸、亞燒基二縮水甘油鍵、聚二醇 甘油_、聚丙二醇二縮水甘油醚、三經甲基丙烧三 縮水甘油誕、甘油三縮水甘油喊、4_乙烯基環己稀環氧化 物、二氧化環己烯乙烯、甲基化二氧化環己烯乙烯等。 該等的稀釋劑可以—種單獨’或組合兩種以上使用。 本發明之硬化性組成物,例如將上述(α)4(α,)、(Β) (C)成为,以及根據期望之氧化防止劑及其他的成分以既 定比例調合,以習知之方法混合、脫泡而得。 以如以上所得之本發明之硬化性組成物,可得即使照射 面月b量的光時或尚溫狀態,並不會著色或降低透明性,可長 期具有優良的透明性,且具有很高的接著力之硬化物。 因此’本發明之硬化性組成物,可良好地使用於作為 光學零件或成形體之原料、接著劑、鍍敷劑等。特別是, 可以解決隨著光元件之高亮度化,關於光元件固定材之惡 化之問題’本發明之硬化性組成物,可良好地使用於作為 光元件固定材用組成物。 2)硬化物 本發明之第2,係硬化本發明之硬化性組成物之硬化 物。 使本發明之硬化性組成物硬化之方法可舉加熱硬化。 硬化時之加熱溫度,通常為100~20(TC,加熱時間通常為10 29 201139560 分至20小時,以30分至10小時為佳。 本發明之硬化物’得即使照射高能量的光時或高溫狀 態,並不會著色或降低透明性,可長及具有優良的透明性 ’且具有报高的接著力之硬化物。 因此’本發明之硬化物,可良好地使用於光學零件或 成形體、接著層、鍍敷層等。特別是,以解決隨著光元件 之高亮度化,關於光元件固定材之惡化之問題,本發明之 硬化性組成物,可良好地使用於作為光元件固定材用組成 物。 本發明之硬化物具有很高的接著力,例如可藉由如_The amount of the ultraviolet absorber to be used is preferably 0.01 to 10 parts by mass per 100 parts by mass of the copolymer of the money compound. 28 201139560 The thinner ' is added to adjust the viscosity of the dragon sword n. The diluent may, for example, be glycerol η / field - glyceryl ether ' dicole diglyceride ether , diglycidyl alcohol , thioglycol monocondensate glycerol base amine, octyl glycol glycidyl ether, cyclohexane: : Methanol diglycidyl acid, alkylidene diglycidyl bond, polyglycol glycerol _, polypropylene glycol diglycidyl ether, trimethoprim triglycidyl, glycerol triglycidide shout, 4_ vinyl ring A dilute epoxide, a cyclohexene oxide ethylene, a methylated cyclohexene ethylene, etc. These diluents may be used alone or in combination of two or more. The curable composition of the present invention, for example, The above (α) 4 (α,), (Β) (C), and the desired oxidation inhibitor and other components are blended in a predetermined ratio, and mixed and defoamed by a conventional method. According to the curable composition of the present invention, even when the amount of light of the surface b is irradiated or the temperature is maintained, the coloring property is not colored or the transparency is lowered, and excellent transparency can be obtained for a long period of time, and the adhesiveness is high. Hardened material. Therefore 'curability of the present invention The product can be suitably used as a raw material, an adhesive, a plating agent, or the like as an optical component or a molded body. In particular, it is possible to solve the problem of deterioration of the fixing member of the optical component with the increase in brightness of the optical element. The curable composition of the present invention can be suitably used as a composition for a fixing member for an optical element. 2) Cured material The second embodiment of the present invention is a cured product of the curable composition of the present invention. The method of hardening the composition may be heat hardening. The heating temperature at the time of hardening is usually 100 to 20 (TC, and the heating time is usually 10 29 201139560 minutes to 20 hours, preferably 30 minutes to 10 hours. The cured product of the present invention. 'When it is irradiated with high-energy light or in a high-temperature state, it does not color or reduce transparency, and can have a cured product having excellent transparency and having a high adhesion force. Therefore, the cured product of the present invention, It can be suitably used for an optical component or a molded body, an adhesive layer, a plating layer, etc. In particular, the present invention solves the problem of deterioration of an optical component fixing material in accordance with the increase in luminance of the optical element. Curable composition, can be favorably used as an optical element fixed to the sheet. Hardened material of the present invention has a high bonding strength with the composition, as for example by _

之接著力測定確認。即,對矽晶片的鏡面塗佈硬化性組J 物,將塗佈面載置於被著體上壓接,加熱處理使之硬化 將此,放置於預先加熱為既定溫度(例如23t)之接著測售 機的測定台上放置30秒,由被著體5〇Mm的高度的位置q 接著面施以水平方法(剪斷方向)之應力,測定試驗片與术 著體之接著力。 硬化物之接著力,在於23tj^u〇N/2mm[:]以上為佳。 上述硬化物透明性優良,可藉㈣定光穿透率確認。 硬化物之光穿透率’在波長45〇nm之光,以8〇%以上為佳 以8 5 %以上更佳。 上述硬化物之長期耐埶性優自 ”,、Γ馒良,可藉由將硬化物長時 間放置於高溫下後透明性的轡仆The force is confirmed by the measurement. That is, the mirror-coated curable group J of the tantalum wafer is placed on the object to be pressed by the coated surface, heat-treated to be hardened, and placed in advance to a predetermined temperature (for example, 23 t). The measurement machine was placed on the measuring table for 30 seconds, and the stress of the horizontal method (cutting direction) was applied from the position q of the height of the object 5 〇Mm, and the adhesion between the test piece and the surgical body was measured. The adhesion of the hardened material is preferably 23tj^u〇N/2mm[:] or more. The cured product is excellent in transparency and can be confirmed by (4) fixed light transmittance. The light transmittance of the cured product is preferably 8 8% or more, more preferably 85% or more, at a wavelength of 45 Å. The long-term smash resistance of the above-mentioned hardened material is superior to that of ” ,, which can be transparent by placing the hardened material at a high temperature for a long time.

旳變化小而確認。透明性,以15C °C放置300小時後’波長45〇n之穿 <芽透率為初期穿透率之80% 以上。 30 201139560旳 Change is small and confirmed. Transparency, after being placed at 15 ° C for 300 hours, the wavelength of 45 〇 n is < the bud penetration rate is 80% or more of the initial transmittance. 30 201139560

方法。 硬化性組成物,使用於 元件固定材用封裝劑之 光元件,可舉led、 LD等的發光元件、感光元件、複合 光元件、光積體電路等。 〈光元件固定材用接著劑〉 本發明之硬化性組成物,可良好地使用於作為光元件 固定材用接著劑。 將本發明之硬化性組成物使用於作為光元件固定用接 著劑之方法,可舉於接著對象之材料(光元件與其基板等) 之一方或雙方的接著劑面塗佈該組成物,壓接後使之加 熱硬化’使接著對象之材料相互牢固地接著之方法。 接著光元件之主要的基板材料,可舉:鈉玻璃、耐熱 性硬質玻璃等的玻璃類;陶瓷、鐵、銅 '鋁、金、銀、鉑 、路、鈦、及該等金屬之合金;不銹鋼(SUS3〇2、SUS3〇4 、SUS304L、SUS309等)等的金屬類;聚對苯二甲酸乙二醇 酉曰、聚對本二曱酸丁二醇酯、聚萘酸乙二醇酯、乙烯_醋酸 乙酯共聚物、聚笨乙烯、聚碳酸酯、聚甲基戊烯、聚砜、 聚酿1、聚醚砜、聚笨硫醚、聚醚亞胺、聚亞醯胺、聚 酿胺、丙婦酸樹脂、降冰片烯系樹脂、環烯烴樹脂、玻璃 環氧樹脂等的合成樹脂。 加熱硬化時之加熱溫度,雖依硬化性組成物等,通常 為10 0〜200°C。加熱時間,通常為10分鐘至20小時,以30分 31 201139560 鐘至l 〇小時為佳。 (光元件固定材用封裝劑) 本發明之硬化性組成物,可良好地使用於作為光元件 封裝體之封裝劑。 將本發明之硬化性組成物使用於作為光元件固定材封 裝劑之方法,可舉例如,將該組成物成形為所期望的形狀 得j内匕光元件之成形體之後,將其加熱硬化而製造光 元件封裝體之方法等。 將本發明之硬化性組成物成形為所期望的形狀之方法 ,並無特別限定,可採用通常的轉注成形法,或注模法等 習知之成形法。 加熱硬化時之加熱溫度,雖依使用之硬化性組成物, 通常為100〜200t:。加熱時間通常為10分鐘至2〇小時,以3〇 分鐘至10小時為佳。 所得光元件封裝體,由於使用本發明之硬化性組成物 ,故即使在光元件,使用白色或藍光LED等的發光波峰波長 為400〜490nm之短波長者,亦不會因熱或光而著色惡化且 透明性、耐熱性優良。 [實施例] 其次以實施例及比較例更詳細地說明本發明,惟本發 明並非受限於下述實施例者。 (重量平均分子量測定) 以製造例所得之矽烷化合物共聚物之重量平均分子 量(Mw) ’係以標準聚苯乙烯換算值,以如下裳置及條件則 32 201139560 定。 裝置名:HLC-8220GPC T0S0公司製 管柱:將TSKgelGMHXL、 TSKgelGMHXL及TSKgel2000HXL 依序連接者。 溶劑:四氫吱喃 注入量:80 // 1 測定溫度:40°C 流速:1 m 1 /分 感測器:示差折射計 (IR光譜之測定) 以製造例所得之矽烷化合物共聚物之IR光譜矽使用如 下裝置測定。 傅立葉轉換紅外線光譜儀(Spectruml 00,珀金埃爾默 公司製) (製造例1) 於300ml之水滴瓶’放入苯基三曱氧基矽烷(東京化成 工業公司製)16. 7g(84mmol)作為矽烷化合物(2) ’ 3-乙醯氧 基丙基二曱氧基石夕烧(AZMAX公司製)8. 〇g(36mmol)作為石夕 炫&gt; 化合物(1)’作為洛劑放入曱苯12 0 m 1,蒸顧水6 〇 m 1後, 邊攪拌’加入磷酸(關東化學公司製)〇. 15g(l. 5mmol)作為 觸媒,以室溫進一步攪拌1 6小時。 反應結束後’對反應混合物加入1 0 0 m 1醋酸乙酯,以飽 和碳酸氫納水溶液中和。靜置一陣子之後,將水去除以蒸 餾水清洗有機層2次後’以無水硫酸鎂乾燥。過濾硫酸鎂後 33 201139560 ,將濾、液以減壓濃縮機濃縮至5 〇 m 1,將此滴入多量的正己 烷中使之再沉澱,將沉澱物以傾析分離。將所得沉澱物溶 解於甲乙酮(MEK)回收,以減壓濃縮機將溶劑減壓餾除,藉 由真空乾燥,得到矽烷化合物共聚物(A1)14. 7g。 石夕院化合物共聚物(A1)之重量平均分子量(Mw)為 2,500,分子量分佈為(—/^為丨^。 此外,將矽烷化合物共聚物(A1)之IR光譜資料表示如 下。method. The curable composition is an optical element used for an encapsulant for a component fixing material, and examples thereof include a light-emitting element such as a led or LD, a photosensitive element, a composite optical element, and an optical unit circuit. <Binder for optical element fixing material> The curable composition of the present invention can be suitably used as an adhesive for an optical element fixing material. The curable composition of the present invention is used as a method for fixing an optical element, and the composition is applied to one or both of the following materials (such as an optical element and a substrate thereof), and the composition is applied. It is then heat-hardened to make the materials of the subsequent objects firmly adhere to each other. Next, the main substrate material of the optical element may be glass such as soda glass or heat-resistant hard glass; ceramics, iron, copper 'aluminum, gold, silver, platinum, road, titanium, and alloys of the metals; stainless steel Metals such as (SUS3〇2, SUS3〇4, SUS304L, SUS309, etc.); polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, ethylene_ Ethyl acetate copolymer, polystyrene, polycarbonate, polymethylpentene, polysulfone, polystyrene 1, polyethersulfone, polyphenylene sulfide, polyetherimide, polyamine, polyamine, A synthetic resin such as a bupropion resin, a norbornene resin, a cycloolefin resin, or a glass epoxy resin. The heating temperature at the time of heat curing is usually from 10 0 to 200 ° C depending on the curable composition or the like. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes 31 201139560 minutes to 1 hour. (Encapsulant for Optical Element Fixing Material) The curable composition of the present invention can be suitably used as an encapsulant for an optical element package. When the curable composition of the present invention is used as a method for encapsulating an optical element fixing material, for example, the composition is molded into a desired shape to obtain a molded body of the calender element in j, and then heated and cured. A method of manufacturing an optical element package or the like. The method of forming the curable composition of the present invention into a desired shape is not particularly limited, and a conventional transfer molding method or a conventional molding method such as injection molding can be employed. The heating temperature at the time of heat curing is usually 100 to 200 t: depending on the curable composition used. The heating time is usually from 10 minutes to 2 hours, preferably from 3 minutes to 10 hours. In the obtained optical element package, since the curable composition of the present invention is used, even if a short wavelength of a light-emitting peak wavelength of 400 to 490 nm such as a white or blue LED is used in the optical element, coloring does not deteriorate due to heat or light. It is excellent in transparency and heat resistance. [Examples] Next, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples. (Measurement of weight average molecular weight) The weight average molecular weight (Mw) of the decane compound copolymer obtained in the production example is based on a standard polystyrene value, and is set as follows according to the following conditions and conditions 32 201139560. Device name: HLC-8220GPC T0S0 company Pipe column: TSKgelGMHXL, TSKgelGMHXL and TSKgel2000HXL are connected in sequence. Solvent: tetrahydrofuran injection amount: 80 // 1 Measurement temperature: 40 ° C Flow rate: 1 m 1 /min Sensor: differential refractometer (measurement of IR spectrum) IR of the decane compound copolymer obtained in the production example The spectrum was measured using the following apparatus. Four-phase conversion infrared spectrometer (Spectruml 00, manufactured by PerkinElmer) (manufacturing example 1) 16.7 g (84 mmol) was added as a phenyl trimethoxy decane (manufactured by Tokyo Chemical Industry Co., Ltd.) in a 300 ml water bottle.矽 化合物 化合物 ( 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( After the steaming was carried out at a temperature of 6 mm1, 15 g (1.5 mmol) of a phosphoric acid (manufactured by Kanto Chemical Co., Ltd.) was added as a catalyst, and further stirred at room temperature for 16 hours. After the end of the reaction, 100 ml of ethyl acetate was added to the reaction mixture, and the mixture was neutralized with a saturated aqueous solution of sodium hydrogencarbonate. After standing for a while, the water was removed by washing the organic layer twice with distilled water, and dried over anhydrous magnesium sulfate. After filtering magnesium sulfate 33 201139560, the filtrate and the liquid were concentrated to 5 〇 m with a reduced pressure concentrator, and this was added dropwise to a large amount of n-hexane to reprecipitate, and the precipitate was separated by decantation. The decane compound copolymer (A1) 14. 7g. The decane compound copolymer (A1) was obtained by a vacuum distillation to give a decane compound copolymer (A1) 14. 7g. The Si Xiyuan compound copolymer (A1) has a weight average molecular weight (Mw) of 2,500 and a molecular weight distribution of (-/^ is 丨^. Further, the IR spectrum data of the decane compound copolymer (A1) is expressed as follows.

Si-Ph : 699 cm·1,741 cm.1,Si-Ο : 1132 cnf1,-c〇 : 1738 cm1 (製造例2) 於製造例1 ’使苯基三甲氧基矽烷之使用量為 14.3g(72mmol) ’ 3-乙醯氧基丙基三曱氧基石夕院 10.7g(48mmol)以外,以與製造例1同樣地得到矽烷化合物 共聚物(A2)15. 9g。 矽烷化合物共聚物(A2)之重量平均分子量(Μ\〇為 2, 600,分子量分佈(Mw/Mn)為1. 51。 此外,將矽烷化合物共聚物(A2)之IR光譜資料表示如 下。Si-Ph: 699 cm·1,741 cm.1, Si-Ο: 1132 cnf1, -c〇: 1738 cm1 (Production Example 2) In Production Example 1, 'the amount of phenyltrimethoxydecane used was 14.3 g. 9 g。 The decane compound copolymer (A2) 15.9 g was obtained in the same manner as in Production Example 1. (1. 7 g). The weight average molecular weight of the decane compound copolymer (A2) (?? is 2,600, and the molecular weight distribution (Mw/Mn) is 1.51. Further, the IR spectrum data of the decane compound copolymer (A2) is expressed as follows.

Si-Ph : 699 cm.1,741 cnf1,Si-Ο : 1132 cm.1,-c〇 : 1738 cm'1 (製造例3) 於製造例1,使苯基三曱氧基矽烷之使用量為 11.9g(60mmol) ,3-乙醯氧基丙基三甲氧基矽院 34 201139560 13. 3g( 6 0mmo 1)以外,以與製造例1同樣地得到石夕烧化合物 共聚物(A3)15. 3g。 石夕烧化合物共聚物(A3)之重量平均分子量(Mw)4 2,600,分子量分佈(Mw/Mn)為1.60。 此外,將矽烷化合物共聚物(A3)之IR光譜資料表示如 下。Si-Ph: 699 cm.1, 741 cnf1, Si-Ο: 1132 cm.1, -c〇: 1738 cm'1 (Production Example 3) In Production Example 1, the amount of phenyltrimethoxydecane used was used. In the same manner as in Production Example 1, except that 11.9 g (60 mmol) of 3-ethoxymethoxypropyltrimethoxy fluorene 34 201139560 13. 3g (60 mmo 1) was obtained, the scouring compound copolymer (A3) 15 was obtained. .3g. The weight-average molecular weight (Mw) of the ceramsite compound copolymer (A3) was 4,600, and the molecular weight distribution (Mw/Mn) was 1.60. Further, the IR spectrum data of the decane compound copolymer (A3) is expressed as follows.

Si-Ph : 700 cm—1,742 cm—1,Si-Ο : 1132 cm·1,-c〇 : 1738 cm'1 (製造例4) 於製造例1,使苯基三曱氧基矽烷之使用量為 16. 7g(84mmol),取代3-乙醯氧基丙基三曱氧基矽燒 8. 0g(36mmol) ’使用笨基三曱氧基矽烷(東京化成工業公司 製)11. 9g(60mmol)及3-甘油酸丙基三曱氧基矽完(東京化 成工業公司製)14.2(60mmol)以外,以與製造例1同樣地得 到石夕烧化合物共聚物(A 4) 16. 3 g。 矽烷化合物共聚物(A4)之重量平均分子量(Mw)為 2,800,分子量分佈(Mw/Mn)為1.56。 此外,將石夕炫化合物共聚物(A 4)之IR光譜資料表示如 下。Si-Ph: 700 cm-1,742 cm-1, Si-Ο: 1132 cm·1, -c〇: 1738 cm'1 (Production Example 4) In Production Example 1, phenyltrimethoxy decane was used. The use amount is 16.7 g (84 mmol), and the 3-methoxypropyl propyl trimethoxy oxime is used in an amount of 8. 0 g (36 mmol). In the same manner as in Production Example 1, except that (60 mmol) and 3-glycolic acid propyl tridecyloxy oxime (manufactured by Tokyo Chemical Industry Co., Ltd.) 14.2 (60 mmol), the compound (A 4) was obtained in the same manner as in Production Example 1. g. The decane compound copolymer (A4) had a weight average molecular weight (Mw) of 2,800 and a molecular weight distribution (Mw/Mn) of 1.56. Further, the IR spectrum data of the Shi Xixuan compound copolymer (A 4) is expressed as follows.

Si-Ph : 700 cm-1 ’ 742 cm-1 ’ Si-Ο : 1132 cm-1,環氧 基:1254 cnf1 (製造例5) 於300ml之水滴瓶,放入苯基三甲氧基矽烷(東京化成 工業公司製)11. 9g(60mmol)作為矽烷化合物(2),3-氣丙基 35 201139560 三曱氧基矽烷(東京化成工業公司製)119g(60mm〇1)作為 矽烷化合物(1),作為溶劑放入甲苯6〇ml,蒸餾水3〇(111後’ 邊攪拌,加入磷酸(關東化學公司製)015g(15mm〇1)作為 觸媒’以室溫進一步搜拌1 6小時。 反應結束後’以飽和碳酸氫鈉水溶液中和。對此加入 醋酸乙酯100ml ’攪拌一陣子.將此靜置之後,將水去除以 蒸餾水清洗有機層2次後,以無水硫酸鎂乾燥。過濾硫酸鎂 後,將此滴入多量的正己烷中使之再沉澱,去除己烷將沉 澱物取出。將所得沉澱物溶解於甲乙酮(MEK)回收,以減壓 濃縮機將溶劑減壓餾除,藉由真空乾燥’得到矽烷化合物 共聚物(A5)12. 9g。 石夕烧化合物共聚物(A5)之重量平均分子量(Mw)為 3, 600 ’分子量分佈為(Mw/Mn)為1. 63。 此外,將矽烷化合物共聚物(A5)之11?光譜資料表示如 下。Si-Ph : 700 cm-1 ' 742 cm-1 ' Si-Ο : 1132 cm-1, epoxy group: 1254 cnf1 (Production Example 5) In a 300 ml water drop bottle, phenyltrimethoxydecane (Tokyo) 11.9g (60mmol) as decane compound (2), 3-air propyl 35 201139560 tridecyloxy decane (manufactured by Tokyo Chemical Industry Co., Ltd.) 119g (60mm 〇1) as decane compound (1), Into the solvent, 6 〇ml of toluene and 3 liters of distilled water were added (after stirring with 111, 015 g (15 mm 〇1) of phosphoric acid (manufactured by Kanto Chemical Co., Ltd.) was added as a catalyst', and further mixing was carried out for 16 hours at room temperature. 'The mixture was neutralized with a saturated aqueous solution of sodium hydrogencarbonate. To this was added ethyl acetate (100 ml) and stirred for a while. After standing, the organic layer was washed twice with distilled water and dried over anhydrous magnesium sulfate. The precipitate was poured into a large amount of n-hexane to reprecipitate, and the precipitate was taken out by removing hexane. The obtained precipitate was dissolved in methyl ethyl ketone (MEK), and the solvent was distilled off under reduced pressure by a vacuum condenser. Drying 'to obtain a decane compound copolymer (A5) 12. 9g. Copolymer composition (A5) of the weight average molecular weight (Mw) of 3, 600 'molecular weight distribution (Mw / Mn) is 1. 63. Further, the alkoxy silicon compound copolymer (A5) of the 11? Spectral information represented as follows.

Si-Ph : 700 cuT1,741 cm-1,Si-Ο : 1133 cnfi,-C1 : 648 cm'1 (製造例6) 於製造例5,使苯基三曱氧基矽烷之使用量為 16.7g(84_ol),3-氣丙基三甲氧基石夕院之使用量為 7.15g(36mmol)以外,以與製造例5同樣地得到矽烷化合物 共聚物(A6)13. 4g。 矽院化合物共聚物(A6)之重量平均分子量(mw)為 3,300,分子量分佈(Mw/Mn)為1.59。 36 201139560 此外,將矽烧化合物共聚物(A6)之IR光譜資料表示如 下。Si-Ph: 700 cuT1, 741 cm-1, Si-Ο: 1133 cnfi, -C1 : 648 cm'1 (Production Example 6) In Production Example 5, the amount of phenyltrimethoxydecane used was 16.7 g. The decane compound copolymer (A6) 13.4 g was obtained in the same manner as in Production Example 5 except that the amount of the decane compound copolymer (A6) was 13.4 g. The broth compound copolymer (A6) had a weight average molecular weight (mw) of 3,300 and a molecular weight distribution (Mw/Mn) of 1.59. 36 201139560 Further, the IR spectrum data of the terpene-based compound copolymer (A6) is expressed as follows.

Si-Ph : 700 cnf1,742 cm—1,Si-Ο : 1133 cm·1,-C1 : 648 cm1 (製造例7) 於製造例5,使苯基三曱氧基矽烷之使用量為 14. 3g(72mmol),3-氣丙基三甲氧基矽烷之使用量為 9 · 54g(48mmo 1)以外,以與製造例5同樣地得到石夕燒化合物 共聚物(A7)13. lg。 矽烷化合物共聚物(A7)之重量平均分子量(Mw)為 3,400,分子量分佈(Mw/Mn)為1.61。 此外,將矽烷化合物共聚物(A7)之IR光譜資料表示如 下。Si-Ph: 700 cnf1, 742 cm-1, Si-Ο: 1133 cm·1, -C1: 648 cm1 (Manufacturing Example 7) In Production Example 5, the amount of phenyltrimethoxydecane used was 14. The galvanic compound copolymer (A7) 13. lg was obtained in the same manner as in Production Example 5 except that 3 g (72 mmol) and 3- propyl propyl trimethoxy decane were used in an amount of 9 · 54 g (48 mmo 1). The decane compound copolymer (A7) had a weight average molecular weight (Mw) of 3,400 and a molecular weight distribution (Mw/Mn) of 1.61. Further, the IR spectrum data of the decane compound copolymer (A7) is shown below.

Si-Ph : 699 cm·1,741 cnf1,Si-Ο : 1132 cnf1,-C1 : 648 cm'1 (製造例8) 於製造例5,取代3-氣丙基三曱氧基矽烷11. 9g使用2-氰基乙基三甲氧基矽烷(AZMAX公司製)10· 5g(60nnnol)以外 ’以與製造例5同樣地得到矽烷化合物共聚物(A8)12. 3g。 矽烷化合物共聚物(A8)之重量平均分子量(Mw)為 3, 500,分子量分佈(Mw/Mn)為1.61。 此外,將矽烷化合物共聚物(A8)之IR光譜資料表示如 下。The singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the sulphate. 3克。 The decane compound copolymer (A8) 12.3g was obtained in the same manner as in Production Example 5, using 2-cyanoethyltrimethoxydecane (manufactured by AZMAX Co., Ltd.) in an amount of 10. 5 g (60 nnnol). The decane compound copolymer (A8) had a weight average molecular weight (Mw) of 3,500 and a molecular weight distribution (Mw/Mn) of 1.61. Further, the IR spectrum data of the decane compound copolymer (A8) is shown below.

Si-Ph : 700 cm—1,742 cnf1,Si-0 : 1133 cnf1,-CN : 37 201139560 2252cm (製造例9) 於製造例8,使苯基三曱氧基矽烷之使用量為 16. 7g(84mmol),2-氰基乙基三曱氧基矽烷之使用量為 6.31g(36mmol)以外,以與製造例8同樣地得到矽烷化合物 共聚物(A9)13. 3g。 矽烷化合物共聚物(A9)之重量平均分子量(Mw)為 3, 200,分子量分佈(Mw/Mn)為1· 64。 此外,將矽烷化合物共聚物(A9)之IR光譜資料表示如 下。The amount of the phenyl trimethoxy decane is 16.7 g. The amount of the phenyl tridecyloxy decane is 16.7 g, the amount of the phenyl trimethoxy decane is 16.7 g. The decane compound copolymer (A9) 13.3 g was obtained in the same manner as in Production Example 8, except that the amount of the decane compound (A9) was 13.3 g. The decane compound copolymer (A9) had a weight average molecular weight (Mw) of 3,200 and a molecular weight distribution (Mw/Mn) of 1.66. Further, the IR spectrum data of the decane compound copolymer (A9) is shown below.

Si-Ph : 699 cm1,742 cnf1,Si-Ο : 1131 cm-1,-CN : 2253 cm'1 (製造例10) 於製造例8,使苯基三甲氧基矽烷之使用量為 14· 3g(72mmol),2 -氰基乙基三甲氧基矽烷之使用量為 7_01g(48mmol)以外,以與製造例8同樣地得到矽烷化合物 共聚物(A10)12. 9g。 矽烷化合物共聚物(A10)之重量平均分子量(Mw)為 3,300,分子量分佈(Mw/Mn)為1.62。 此外,將矽烷化合物共聚物(A10)之IR光譜資料表示如 下。Si-Ph: 699 cm1, 742 cnf1, Si-Ο: 1131 cm-1, -CN: 2253 cm'1 (Production Example 10) In Production Example 8, the amount of phenyltrimethoxydecane used was 14.3 g. The decane compound copolymer (A10) 12.9 g was obtained in the same manner as in Production Example 8, except that the amount of the decane compound copolymer (A10) was 12. 9 g. The decane compound copolymer (A10) had a weight average molecular weight (Mw) of 3,300 and a molecular weight distribution (Mw/Mn) of 1.62. Further, the IR spectrum data of the decane compound copolymer (A10) is shown below.

Si-Ph : 699 cm-1,742 cnT1,Si-Ο : 1131 cm·1,-CN : 2253 cm&quot;1 (實施例1) 38 201139560 % 於製造例1所得之矽烷化合物共聚物(Al)lOg’作為(B) 成分加入3, 4 -環氧基環己烧叛酸3, 4-環氧環己基甲酯(西 克瑪艾爾迪希公司製)1.5g,作為(C)成分加入具有幾·基之 脂環式酸酐之環己院-1,2, 4 -三缓酸-1,2-酐(三菱瓦斯化 學公司製)0.15g,及其他的脂環式酸酐之4-甲基環己烷 -1,2-二羧酸酐(東京化成公司製)丨.35g,將全容充分混合 ’脫泡,得到硬化性組成物。 (實施例2〜8 ) 於實施例1 ’將矽烷化合物共聚物、(B)成分、及(C) 成分使用下述第1表-1所述之種類及調合量之外,以與實施 例1同樣地,得到硬化性組成物(2) ~ (8)。 (實施例9、10) 於實施例4、5,進一步加入磷系氧化防止劑 IRGAF0S168(Ciba . Japan公司製)〇. 5質量部以外,以與實 施例4、5同樣地,分別得到硬化性組成物(9)、( 1 〇)。 (比較例1、2) 於實施例1 ’將矽烷化合物共聚物、(B)成分、及(C) 成分使用下述第1表-1所述之種類及調合量之外,以與實施 例1同樣地,分別得到硬化性組成物(11 )、( 12)。 (比較例3) 於實施例1 ’取代(C)成分使用脂環式胺系硬化劑(商品 名:EH3895 ’ ADEKA公司製)1. 5g以外,以與實施例1同樣地 ,得到硬化性組成物(13)。 (比較例4) 39 201139560 於實施例1,取代(C)成分使用4—甲基環己烷-1, 2-二羧 酸酐(東京化成公司製)1 ·4 5 g及硬化觸媒之三苯膦(關東化 學公司製)0. 05g以外’以與實施例1同樣地,得到硬化性組 成物(14)。 (比較例5 ) 於實施例3,取代矽烷化合物共聚物(A2)使用製造例4 所得矽烷化合物共聚物(A4) 1 Og以外,以與實施例3同樣地 ,得到硬化性組成物(15)。 (實施例1W6,比較例6〜13) 於實施例1,將矽烷化合物共聚物、(B)成分、及(〇 成分使用下述第1表-2所述之種類及調合量之外,以與實施 例1同樣地’分別得到硬化性組成物(16) ~ (29)。 201139560 7&lt;1 摊 磷系氧化 防止劑 (質量部) 1 1 1 1 1 1 1 1 LO C5 LO 〇* 1 1 1 1 1 三苯膦(硬 媒) (質量部) 1 1 1 1 1 1 1 1 1 t I I LO o cr&gt; 1 胺系 硬化劑 (質量部) 1 1 1 1 1 1 1 1 1 1 f 1 LO 1 1 其他的脂 肪式酸酐 (質量部) 1.35 1.35 LO 〇 〇〇 C5 Η LO CM 1.25 1 _ 里 … ο oo o LO CN1 o 3.15 1 LO ,叫 Ln &lt;=s 具有羧基 之脂肪式 醢酐 (質量部) in »1 〇 LO 〇 LO 〇 CN1 〇 〇 LO oa o 1.25 CD 1—Η 〇 o LO oa o LO CO d 1 1 LO o g (質量部) LO LO LO 〇 03 ◦ οα LO LO CD t&gt;d &lt;=&gt; o oa LO 〇 LO CO LO in LO r^i (Α)άΤ (質量部) 100:30 100:30 100:30 100:40 100:40 100:50 100:50 100:40 100:40 100:40 100:10 100:70 1 1 100:30 矽烷化合物共聚物 (質量部) Ο Ο CD 〇) Ο C3 o &lt;=&gt; o o 〇 種類 r-Η T-—&lt; 硬化性 組成物 CO 寸 LO CO 卜 〇0 0¾ oo CO 寸 in 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 比較例1 比較例2 比較例3 比較例4 比較例5 41 201139560 磷系氧化 防止劑 1 (質量部)| 1 1 1 1 1 1 1 l 1 1 1 1 1 1 三苯膦(硬 化觸媒) 1 (質量部)1 1 1 1 1 1 t 1 1 1 0.05 1 1 1 LO 〇 C3 胺系 硬化劑 (質量部)| 1 1 1 1 1 1 1 1 LO »—H 1 1 1 I 其他的脂 肪式酸酐 1 (質量部)| LO CO 1.35 LO CO 1.35 LO CO 1. 35 0.25 3.15 1 m CNI 〇 3.15 1 1 具有羧基 之脂肪式 _Μ_ I (質量部)| LO &lt;d&gt; 0.15 0.15 0.15 LO o 0. 15 m OJ C5 0.35 1 LO 却 LO CM C3 in CO C3 1 1.45 I (質量部)| LO ^&quot;4 LO LO 1*^ LO LO m LO o LO CO LO LO LO LO CO LO (A):[⑻K 〇] 1_ (質量部) 100:30 100:30 100:30 100:30 100:30 100:30 100:10 100:70 I l 100:10 100:70 1 1 矽烷化合物共聚物 (質量部)| Ο ◦ o &lt;=&gt; C=5 o o o o o o o o o 種類 o Ή o -&lt; o &lt; ◦ o ^&quot;4 &lt;c 硬化性 組成物 CO 卜 oo oa &lt;NI CO oa 寸 (NI LO (Nl CD &lt;NI CO oa Oi CNI 實施例11 實施例12 實施例13 實施例14 實施例15 實施例16 比較例6 比較例7 比較例8 比較例9 比較例10 比較例11 比較例12 比較例13 42 201139560 關於實施例卜1 6及比較例1 ~ 13所得之硬化性組成物 (1)〜(29)之硬化物,如下所述’测定接著力、初期穿透率 、及加熱後之穿透率。 將測定結果示於下述第2表-1、第2表_ (接著力試驗) 對2_四方的矽晶片的鏡面塗佈硬化性組成物成厚度 約2/ζιη,將塗佈面載置於被著體(鍍銀銅板)上壓接。之= ,以180t:加熱處理2小時使之硬化得到附有試驗片之被著 體。將該附有試驗片之被著體,&amp;置於預先加熱為既定、设 度(例如2代、100。〇之接著測試機(SeHes 4〇〇〇,dage = 司製)的測定台上放置3G秒,由被著體5Q# m的高度的位置 ,以速度200 &quot;m/S對接著面施以水平方法(剪斷方向)之應 力,敎在於加及1()代之試驗片與被著體之接著力。〜 (初期穿透率之測定) 將硬化性組成物,灌入模具使之成長25mmn、 厚1ram,以_加熱6小時使之硬化,分別製作試驗片。對 =得試驗片,以分光光度計⑽_3跡島津製作所公司 製)’測定波長450nm之初期穿透率(%)。 (加熱後之穿透率測定) 將測定初期穿透率之各斌給H 昧m$ A °驗片放入15代之烘箱1〇〇小 時及3GN、時,再次,測定波長咖⑽之穿透率(%)。 43 201139560 第2表-1 硬化性 組成物 接著力(N/2mm|ZD 穿透率(%) 23〇C 100°C 初期 150°C 100小時後 150。。 300小時後 實施例1 1 169.2 90.1 86.8 80.9 80.3 實施例2 2 163.1 82.0 89.7 83.3 80.6 實施例3 3 182.8 85.9 88.4 85.1 81.6 實施例4 4 168.3 88.6 89.9 77.8 75.2 實施例5 5 186.5 115.0 89.0 88.6 81.3 實施例6 6 179.1 96.2 90.0 73.7 72.1 實施例7 7 193.5 111. 1 88.3 81.2 72.3 實施例8 8 172.1 104.3 91.3 89.6 83.8 實施例9 9 167.9 88.4 90.2 85.8 85.7 實施例10 10 186.3 114.5 90.8 89.7 89. 6 比較例1 11 104.5 40.9 80.6 78.9 75.0 比較例2 12 208.1 117.9 80.0 58.2 49.6 比較例3 13 95.0 13.5 78.8 0.2 0.0 比較例4 14 63.2 26.1 66.2 41.2 34.4 比較例5 15 173.0 97.7 82.3 77.3 59.3 第2表-2 硬化性 組成物 接著力(N/2mm[H) 穿透率00 23〇C loot: 初期 150°C 100小時後 150°C 300小時後 實施例11 16 158.3 87.4 89.0 85.2 83.3 實施例12 17 167.4 90.2 88.7 86.1 82. 6 實施例13 18 160.3 88.1 89.1 85.5 83.0 實施例14 19 161.1 91.8 90.2 85.9 83.0 實施例15 20 173.5 95.5 89.6 84.8 81.5 實施例16 21 167.2 93.8 90.0 85.1 82.4 比較例6 22 99.7 42.1 89.3 85.2 83.8 比較例7 23 212.7 120.9 81.1 54.7 46.3 比較例8 24 92.2 19.0 77.3 0.5 0.0 比較例9 25 70.4 20.7 83.5 78.3 31.9 比較例10 26 103.5 45.9 89.6 85.4 83. 0 比較例11 27 227.8 131.4 80.4 52.5 44.2 比較例12 28 95.3 22.6 76.9 0.3 0.0 比較例13 29 73.6 27.5 84.0 78.2 29. 9 44 201139560 由第2表1、第2表-2,實施例1〜之硬化物,在於23 °C及lOGt均具有很高的接著力’初期穿透率及加熱後的穿 透率均優良。 另一方面,比較例1、6及1〇之硬化物,接著力差,比 較例2、7及11之硬化物則加熱後的穿透率低,比較例3、4 、8、9、12及13之硬化物接著力差,加熱後的穿透率亦低 。比較力之硬化物,加熱300小時後,穿透率會降低。 【圖式簡單說明】 無 【主要元件符號說明】 無 45Si-Ph: 699 cm-1,742 cnT1, Si-Ο: 1131 cm·1, -CN: 2253 cm&quot;1 (Example 1) 38 201139560 % The decane compound copolymer (Al) lOg obtained in Production Example 1 'As a component (B), 1.5 g of 3,4-epoxycyclohexyloxyl 3,4-epoxycyclohexylmethyl ester (manufactured by Sikma Erdish) was added as a component (C). Cyclohexyl-1,2,4-tris-acid-1,2-anhydride (manufactured by Mitsubishi Gas Chemical Co., Ltd.) 0.15 g of alicyclic anhydride, and 4-methyl group of other alicyclic anhydride Cyclohexane-1,2-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 丨35 g, and fully mixed and defoamed to obtain a curable composition. (Examples 2 to 8) In the first embodiment, the decane compound copolymer, the component (B), and the component (C) were used in the following Table 1 and the blending amount, and examples. In the same manner, the curable compositions (2) to (8) were obtained. (Examples 9 and 10) Further, in the same manner as in Examples 4 and 5, the phosphorus-based oxidation inhibitor IRGAF0S168 (manufactured by Ciba. Japan Co., Ltd.) was added in the same manner as in Examples 4 and 5, and the curability was obtained in the same manner as in Examples 4 and 5. Composition (9), (1 〇). (Comparative Examples 1 and 2) In Example 1, 'the decane compound copolymer, the component (B), and the component (C) were used in the following Table 1 and the amount of the blending amount, and the examples were In the same manner, the curable compositions (11) and (12) were obtained in the same manner. (Comparative Example 3) The curable composition was obtained in the same manner as in Example 1 except that the alicyclic amine-based curing agent (trade name: EH3895 'ADEK Corporation) was used in the same manner as in Example 1 (13). (Comparative Example 4) 39 201139560 In the first embodiment, in place of the component (C), 4-methylcyclohexane-1,2-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 1 · 4 5 g and a curing catalyst were used. Phenylphosphine (manufactured by Kanto Chemical Co., Ltd.) other than 0.05 g. In the same manner as in Example 1, a curable composition (14) was obtained. (Comparative Example 5) A curable composition (15) was obtained in the same manner as in Example 3 except that the decane compound copolymer (A2) was used in the same manner as in Example 3 except that the decane compound copolymer (A2) obtained in Production Example 4 was used. . (Example 1W6, Comparative Examples 6 to 13) In Example 1, the decane compound copolymer, the component (B), and the hydrazine component were used in the following types and blending amounts as described in Table 1-2 below. In the same manner as in the first embodiment, the curable compositions (16) to (29) were obtained. 201139560 7&lt;1 Phosphorus-based oxidation inhibitor (mass portion) 1 1 1 1 1 1 1 1 LO C5 LO 〇* 1 1 1 1 1 Triphenylphosphine (hard medium) (mass part) 1 1 1 1 1 1 1 1 1 t II LO o cr&gt; 1 Amine-based hardener (mass part) 1 1 1 1 1 1 1 1 1 1 f 1 LO 1 1 Other Fatty Acids (Mass) 1.35 1.35 LO 〇〇〇C5 Η LO CM 1.25 1 _ Lane... ο oo o LO CN1 o 3.15 1 LO , called Ln &lt;=s Fatty phthalic anhydride with carboxyl group (mass department) in »1 〇LO 〇LO 〇CN1 〇〇LO oa o 1.25 CD 1—Η 〇o LO oa o LO CO d 1 1 LO og (mass section) LO LO LO 〇03 ◦ οα LO LO CD t&gt ;d &lt;=&gt; o oa LO 〇LO CO LO in LO r^i (Α)άΤ (Quality) 100:30 100:30 100:30 100:40 100:40 100:50 100:50 100: 40 100:40 100:40 100:10 100:70 1 1 100:30 decane compound copolymer (mass section) Ο Ο CD 〇) Ο C3 o &lt;=&gt; oo 〇 type r-Η T--&lt; hardenable composition CO inch LO CO 〇 0 03⁄4 oo CO inch in Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 41 201139560 Phosphorus-based oxidation preventing agent 1 (mass portion ) 1 1 1 1 1 1 1 l 1 1 1 1 1 1 Triphenylphosphine (hardening catalyst) 1 (mass part) 1 1 1 1 1 1 t 1 1 1 0.05 1 1 1 LO 〇C3 Amine hardener (mass department)| 1 1 1 1 1 1 1 1 LO »—H 1 1 1 I Other fatty acid anhydride 1 (mass part) | LO CO 1.35 LO CO 1.35 LO CO 1. 35 0.25 3.15 1 m CNI 〇3.15 1 1 Fat type with carboxyl group _Μ_ I (mass part)| LO &lt;d&gt; 0.15 0.15 0.15 LO o 0. 15 m OJ C5 0.35 1 LO but LO CM C3 in CO C3 1 1.45 I (mass) | LO ^&quot;4 LO LO 1*^ LO LO m LO o LO CO LO LO LO LO LO LO (A): [(8)K 〇] 1_ (Quality) 100:30 100:30 100:30 100:30 100:30 100:30 100:10 100:70 I l 100:10 100:70 1 1 Alkane compound copolymer (mass part)| Ο ◦ o &lt;=&gt; C=5 ooooooooo kind o Ή o -&lt; o &lt; ◦ o ^&quot;4 &lt;c hardening composition CO oo oa &lt; NI CO oa inch (NI LO (Nl CD &lt; NI CO oa Oi CNI Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Comparative Example 11 Comparative Example 12 Comparative Example 13 42 201139560 The cured product of the curable compositions (1) to (29) obtained in Examples 1 to 6 and Comparative Examples 1 to 13 was measured as follows. Permeability, and penetration after heating. The measurement results are shown in Table 2-1 and Table 2 below (continuation force test). The mirror-coated curable composition of the 2-square tetragonal wafer is formed to have a thickness of about 2/ζιη, and the coated surface is placed. Crimp on the body (silver plated copper plate). =, at 180t: heat treatment for 2 hours to harden it to obtain a test piece with a test piece. The subject with the test piece, &amp; is placed on a measuring stand that is preheated to a predetermined degree (for example, 2nd generation, 100th, and the next test machine (SeHes 4〇〇〇, dage = system) After placing 3G seconds, the stress of the horizontal method (cutting direction) is applied to the joint surface by the position of the height of the body 5Q# m at the speed of 200 &quot;m/S, and the test piece is added to the 1 () generation. The adhesion to the body to be placed. ~ (Measurement of initial penetration rate) The curable composition was poured into a mold to grow 25 mmn and 1 ram thick, and was cured by heating for 6 hours to prepare test pieces. A test piece was obtained, and the initial transmittance (%) at a wavelength of 450 nm was measured by a spectrophotometer (10)_3, manufactured by Shimadzu Corporation. (Determination of the penetration rate after heating) The H 昧m$ A ° test piece of the initial penetration rate was placed in the oven of the 15th generation for 1 hour and 3 GN, and again, the wavelength of the coffee (10) was measured. Transmittance (%). 43 201139560 Table 2-1 Curing composition adhesion force (N/2mm|ZD transmittance (%) 23〇C 100°C initial 150°C 100 hours after 150. After 300 hours Example 1 1 169.2 90.1 86.8 80.9 80.3 Example 2 2 163.1 82.0 89.7 83.3 80.6 Example 3 3 182.8 85.9 88.4 85.1 81.6 Example 4 4 168.3 88.6 89.9 77.8 75.2 Example 5 5 186.5 115.0 89.0 88.6 81.3 Example 6 6 179.1 96.2 90.0 73.7 72.1 Example 7 7 193.5 111. 1 88.3 81.2 72.3 Example 8 8 172.1 104.3 91.3 89.6 83.8 Example 9 9 167.9 88.4 90.2 85.8 85.7 Example 10 10 186.3 114.5 90.8 89.7 89. 6 Comparative Example 1 11 104.5 40.9 80.6 78.9 75.0 Comparative Example 2 12 208.1 117.9 80.0 58.2 49.6 Comparative Example 3 13 95.0 13.5 78.8 0.2 0.0 Comparative Example 4 14 63.2 26.1 66.2 41.2 34.4 Comparative Example 5 15 173.0 97.7 82.3 77.3 59.3 Table 2-2 Hardening Composition Next Force (N/2mm[H Permeability 00 23 〇C loot: initial 150 ° C 100 hours after 150 ° C 300 hours after Example 11 16 158.3 87.4 89.0 85.2 83.3 Example 12 17 167.4 90.2 88.7 86.1 82. 6 Example 13 18 160.3 88.1 89.1 85.5 83.0 Example 14 19 161.1 91.8 90.2 85.9 83.0 Example 15 20 173.5 95.5 89.6 84.8 81.5 Example 16 21 167.2 93.8 90.0 85.1 82.4 Comparative Example 6 22 99.7 42.1 89.3 85.2 83.8 Comparative Example 7 23 212.7 120.9 81.1 54.7 46.3 Comparative Example 8 24 92.2 19.0 77.3 0.5 0.0 Comparative Example 9 25 70.4 20.7 83.5 78.3 31.9 Comparative Example 10 26 103.5 45.9 89.6 85.4 83. 0 Comparative Example 11 27 227.8 131.4 80.4 52.5 44.2 Comparative Example 12 28 95.3 22.6 76.9 0.3 0.0 Comparative Example 13 29 73.6 27.5 84.0 78.2 29. 9 44 201139560 From Table 2, Table 2-2, the cured product of Example 1~, at 23 ° C and 10 Gt, both have a high adhesion force 'initial penetration rate and wear after heating The permeability is excellent. On the other hand, the cured products of Comparative Examples 1, 6, and 1 were inferior in force, and the cured products of Comparative Examples 2, 7, and 11 had low transmittance after heating, and Comparative Examples 3, 4, 8, 9, and 12 And the hardened material of 13 and the subsequent force difference, the transmittance after heating is also low. Compared with the hardened material, the penetration rate will decrease after heating for 300 hours. [Simple diagram description] None [Main component symbol description] None 45

Claims (1)

201139560 七、申請專利範圍: 1. 一種硬化性組成物’將(A)於分子内’具有下式(〇、 (ii) 及(iii)所示之反覆單位之中的(i)及(ii)、(i)及 (iii) 、(ii)’及(iii)或(i)、(ii)及(iii)之反覆單位,重 量平均分子量為1,000〜30, 000之矽烷化合物共聚物;(B) 環氧化合物;及(C)具有羧基之脂環酸酐及含有其他的脂j衰 酸酐之硬化劑,以(A) : [(B) + (C)] = 1 00 : 20〜1 00 : 60之比 例(質量比)含有: CH一X0201139560 VII. Patent application scope: 1. A hardening composition '(A) in the molecule' has the following formulas (i) and (ii) among the repetitive units shown in (〇, (ii) and (iii) , (i) and (iii), (ii) 'and (iii) or (i), (ii) and (iii) the repeating unit, a decane compound copolymer having a weight average molecular weight of 1,000 to 30,000 (B) an epoxy compound; and (C) an alicyclic anhydride having a carboxyl group and a hardener containing other lipids, (A): [(B) + (C)] = 1 00 : 20~ 1 00 : 60 ratio (mass ratio) contains: CH-X0 0) (i〇 («Ο 式中’ R1係表示氩原子或碳數1〜6之烷基,χ。係表示幽素 原子、氰基或以式:OG表示之基’式中’ G係表示經基之 保護基,D係表示單鍵結或連接基,R2係表示碳數卜2〇之 院基或可具有取代基之苯基。 2.如申請專利範圍第丨項所述的硬化性組成物其中 上述(A)之矽烷化合物共聚物係以式·· r1_ch(x())_d_表示之 基之存在量([f-CHCX。)-!)])與^之存在量([2 46 201139560 聚物。 3. 一種硬化性組成物,將(A,)使包含以式. r-CHOO-D-叫㈣切&quot;所示之我化合物⑴之至小 -種’及式⑺:⑸⑽^⑵㈠所示之錢化合物⑺: 至少一種之石夕炫化合物之混合物縮合而得,重量平均分子 量為1,GGG~3G,GGG切烧化合物共聚物;(B)環氧化合 物’及⑹具有絲之脂環㈣及含有其他的脂環酸肝之 化劑’以(A, L[(B)+(c)]=1〇〇:2〇〜1〇〇:6〇 量比)含有, 式中,R1係表示氫原子或碳數卜6之烷基,χβ係表示 齒素原子、氰基或以式:QG表示之基,式中,G係表示經 基之保護基,D係表示單鍵結或連接基,R3係表示碳數η 之炫基’ X1係表示i素原子,G〜3之整數;R2係表示碳 數卜20之烷基或可具有取代基之笨基,R4係表示碳數 之燒基’ χ2係表示鹵素原子,q係表示0〜3之整數。 4. 如申請專利範圍第3項所述的硬化性組成物,其中 上述(A )之矽烷化合物共聚物係將矽烷化合物(丨)與矽烷 化合物(2)以莫耳比,[矽烷化合物(〇]:[矽烷化合物 (2门=55: 45〜25 : 75之比例縮合而得之矽烷化合物共聚物。 5. 如申3青專利範圍第1或3項所述的硬化性組成物, 其中上述(C)的硬化劑之質量比為(具有羧基之脂肪酸 軒):(其他的脂肪酸酐)=50 : 50〜10 : 90。 6. 如申請專利範圍第1或3項所述的硬化性組成物, 其中進一步包含氧化防止劑。 47 0 201139560 7.如申請專利範圍第6項所述的硬化性組成物,其中 氧化防止劑係磷系氧化防止劑。 8·如申請專利範圍第1或3項所述的硬化性組成物, 其係光元件固定材用組成物。 9. 一種硬化物’硬化申請專利範圍第1或3項所述的 硬化性組成物而成。 10. 如申4專利範圍第9項所述的硬化物,係光元件固 定材。 U. 一種方法,使用申請專利範圍第1或3項所述的硬 化性組成物’作為光元件固定材用接著劑。 12. 一種方法’使用申請專利益固咕t 兮〜祝圍第1或3項所述的硬 化性組成物,作為光元件固定材用封裝劑。 480) (i〇(«Ο where R1 represents an argon atom or an alkyl group having 1 to 6 carbon atoms, χ. means a spectrin atom, a cyano group or a group represented by the formula: OG. Represents a protecting group of a radical, D represents a single bond or a linking group, and R2 represents a phenyl group of a carbon number or a phenyl group which may have a substituent. 2. Hardening as described in the scope of the patent application The composition of the decane compound of the above (A) is the amount of the group represented by the formula: r1_ch(x())_d_ ([f-CHCX.)-!)]) and the presence amount of ( [2 46 201139560 Polymer. 3. A hardenable composition, which contains (A,) a compound of the formula: r-CHOO-D-called (four) cut &quot; (7): (5) (10) (2) (1) The money compound (7): a mixture of at least one compound of Shi Xi Xuan compound obtained by condensation of a weight average molecular weight of 1, GGG~3G, a GGG-cut compound copolymer; (B) an epoxy compound' and (6) Alkaloids with silk (4) and other agents containing other alicyclic acid livers (A, L[(B)+(c)]=1〇〇:2〇~1〇〇:6〇) Containing, wherein R1 represents hydrogen Or a carbon number of 6 alkyl, χβ system represents a dentate atom, a cyano group or a group represented by the formula: QG, wherein G represents a protecting group of a radical, and D represents a single bond or a linking group, R3 represents a condensing group of carbon number η', X1 represents an atom of an atom, an integer of G~3; R2 represents an alkyl group of carbon number 20 or a stupid group which may have a substituent, and R4 represents a carbon group. ' χ 2 is a halogen atom, and q is an integer of 0 to 3. 4. The hardenable composition according to claim 3, wherein the decane compound copolymer of the above (A) is a decane compound (丨) And decane compound (2) in molar ratio, [decane compound (〇]: [decane compound (2 door = 55: 45~25: 75 ratio of decane compound copolymer obtained. 5. Such as Shen 3 green patent The curable composition according to Item 1 or 3, wherein the mass ratio of the hardener of the above (C) is (a fatty acid having a carboxyl group): (other fatty acid anhydride) = 50: 50 to 10: 90. 6 The hardenable composition according to claim 1 or 3, further comprising an oxidation preventing agent. 47 0 2 The sclerosing agent according to claim 6, wherein the oxidation preventing agent is a phosphorus-based oxidation preventing agent. The hardening composition according to claim 1 or 3, A composition for a fixing member for an optical element. 9. A cured product according to the first or third aspect of the patent application of the hardened article. Optical element fixing material U. A method of using the curable composition described in claim 1 or 3 as an adhesive for an optical element fixing material. 12. A method of using the hardening composition described in Item 1 or 3 as an encapsulant for an optical element fixing material. 48
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