KR101712787B1 - 플럭스 및 솔더 페이스트 - Google Patents

플럭스 및 솔더 페이스트 Download PDF

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Publication number
KR101712787B1
KR101712787B1 KR1020167029054A KR20167029054A KR101712787B1 KR 101712787 B1 KR101712787 B1 KR 101712787B1 KR 1020167029054 A KR1020167029054 A KR 1020167029054A KR 20167029054 A KR20167029054 A KR 20167029054A KR 101712787 B1 KR101712787 B1 KR 101712787B1
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KR
South Korea
Prior art keywords
long
flux
chain dibasic
mass
dibasic acid
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KR1020167029054A
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English (en)
Korean (ko)
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KR20160133558A (ko
Inventor
마사시 우에하타
야스유키 야마가와
가즈야 기타자와
요시노리 다카기
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센주긴조쿠고교 가부시키가이샤
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020167029054A 2014-03-25 2015-02-27 플럭스 및 솔더 페이스트 Active KR101712787B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-062417 2014-03-25
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト
PCT/JP2015/055781 WO2015146473A1 (ja) 2014-03-25 2015-02-27 フラックス及びソルダペースト

Publications (2)

Publication Number Publication Date
KR20160133558A KR20160133558A (ko) 2016-11-22
KR101712787B1 true KR101712787B1 (ko) 2017-03-06

Family

ID=54195004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167029054A Active KR101712787B1 (ko) 2014-03-25 2015-02-27 플럭스 및 솔더 페이스트

Country Status (7)

Country Link
US (1) US9902022B2 (https=)
EP (1) EP3124167B1 (https=)
JP (1) JP5952849B2 (https=)
KR (1) KR101712787B1 (https=)
CN (1) CN106132629B (https=)
TW (1) TWI596154B (https=)
WO (1) WO2015146473A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5962832B1 (ja) * 2015-09-18 2016-08-03 千住金属工業株式会社 フラックス
JP2017130623A (ja) * 2016-01-22 2017-07-27 株式会社村田製作所 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法
JP2017183571A (ja) * 2016-03-31 2017-10-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6536503B2 (ja) * 2016-07-12 2019-07-03 千住金属工業株式会社 フラックス
JP6399242B1 (ja) 2018-01-17 2018-10-03 千住金属工業株式会社 フラックス及びソルダペースト
US12138714B2 (en) 2018-03-09 2024-11-12 Origin Company, Limited Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package
US11833622B2 (en) 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste
US12240061B2 (en) 2020-03-17 2025-03-04 Panasonic Intellectual Property Management Co., Ltd. Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure
JP7620916B2 (ja) 2020-12-17 2025-01-24 パナソニックＩｐマネジメント株式会社 フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001170797A (ja) 1999-10-05 2001-06-26 Tdk Corp はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
JP2002512278A (ja) 1998-04-22 2002-04-23 マルチコア ソルダーズ リミテッド フラックス特性を有する接着性封止材料
WO2007018288A1 (ja) 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. 鉛フリーソルダペーストとその応用
JP2012115871A (ja) 2010-11-30 2012-06-21 Panasonic Corp はんだペースト

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6971163B1 (en) 1998-04-22 2005-12-06 Dow Corning Corporation Adhesive and encapsulating material with fluxing properties
JP4504481B2 (ja) * 1998-11-26 2010-07-14 岡村製油株式会社 長鎖二塩基酸組成物及びこれを用いる電解液
TW527253B (en) * 1999-10-05 2003-04-11 Tdk Corp Soldering flux, soldering paste and soldering process
JP2001219294A (ja) * 1999-12-03 2001-08-14 Tdk Corp 熱硬化性はんだ付け用フラックスおよびはんだ付け方法
WO2001047660A1 (en) * 1999-12-27 2001-07-05 Sumitomo Bakelite Company, Ltd. Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
JP3791403B2 (ja) 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3888573B2 (ja) 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3702418B2 (ja) * 2002-03-07 2005-10-05 株式会社 東京第一商興 ソルダペースト用フラックス及びソルダペースト
WO2006064849A1 (ja) * 2004-12-15 2006-06-22 Tamurakaken Corporation 導電性接着剤、これを用いた導電部及び電子部品モジュール
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
KR20140116216A (ko) 2012-02-24 2014-10-01 히타치가세이가부시끼가이샤 반도체용 접착제, 플럭스제, 반도체 장치의 제조 방법 및 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002512278A (ja) 1998-04-22 2002-04-23 マルチコア ソルダーズ リミテッド フラックス特性を有する接着性封止材料
JP2001170797A (ja) 1999-10-05 2001-06-26 Tdk Corp はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
WO2007018288A1 (ja) 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. 鉛フリーソルダペーストとその応用
JP2012115871A (ja) 2010-11-30 2012-06-21 Panasonic Corp はんだペースト

Also Published As

Publication number Publication date
KR20160133558A (ko) 2016-11-22
EP3124167A4 (en) 2017-09-20
TW201602219A (zh) 2016-01-16
JP5952849B2 (ja) 2016-07-13
WO2015146473A1 (ja) 2015-10-01
EP3124167B1 (en) 2019-05-08
CN106132629A (zh) 2016-11-16
US9902022B2 (en) 2018-02-27
US20170190005A1 (en) 2017-07-06
JP2015182125A (ja) 2015-10-22
EP3124167A1 (en) 2017-02-01
TWI596154B (zh) 2017-08-21
CN106132629B (zh) 2017-10-13

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