KR101696709B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

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Publication number
KR101696709B1
KR101696709B1 KR1020130114384A KR20130114384A KR101696709B1 KR 101696709 B1 KR101696709 B1 KR 101696709B1 KR 1020130114384 A KR1020130114384 A KR 1020130114384A KR 20130114384 A KR20130114384 A KR 20130114384A KR 101696709 B1 KR101696709 B1 KR 101696709B1
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South Korea
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solvent
liquid storage
substrate
unit
heating
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KR1020130114384A
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Korean (ko)
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KR20140043674A (ko
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켄이치 우에다
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도쿄엘렉트론가부시키가이샤
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020130114384A 2012-10-02 2013-09-26 기판 처리 장치, 기판 처리 방법 및 기억 매체 Active KR101696709B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-220632 2012-10-02
JP2012220632A JP5939118B2 (ja) 2012-10-02 2012-10-02 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
KR20140043674A KR20140043674A (ko) 2014-04-10
KR101696709B1 true KR101696709B1 (ko) 2017-01-16

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KR1020130114384A Active KR101696709B1 (ko) 2012-10-02 2013-09-26 기판 처리 장치, 기판 처리 방법 및 기억 매체

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JP (1) JP5939118B2 (enExample)
KR (1) KR101696709B1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202314405A (zh) * 2021-06-15 2023-04-01 美商蘭姆研究公司 用於晶圓中的乾式顯影副產物揮發的乾式顯影設備及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019969A (ja) * 2003-06-06 2005-01-20 Tokyo Electron Ltd 基板の処理膜の表面荒れを改善する方法及び基板の処理装置
JP2005259862A (ja) * 2004-03-10 2005-09-22 Mitsui Eng & Shipbuild Co Ltd レジスト除去方法、レジスト除去剤噴射装置、およびレジスト除去装置
JP2012087983A (ja) * 2010-10-19 2012-05-10 Tokyo Electron Ltd 流体加熱装置及び基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04328667A (ja) 1991-04-27 1992-11-17 Nec Corp 2ポートramデータ送受方式及び装置
JP2004031750A (ja) * 2002-06-27 2004-01-29 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP5278469B2 (ja) * 2011-03-03 2013-09-04 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019969A (ja) * 2003-06-06 2005-01-20 Tokyo Electron Ltd 基板の処理膜の表面荒れを改善する方法及び基板の処理装置
JP2005259862A (ja) * 2004-03-10 2005-09-22 Mitsui Eng & Shipbuild Co Ltd レジスト除去方法、レジスト除去剤噴射装置、およびレジスト除去装置
JP2012087983A (ja) * 2010-10-19 2012-05-10 Tokyo Electron Ltd 流体加熱装置及び基板処理装置

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JP2014075391A (ja) 2014-04-24
JP5939118B2 (ja) 2016-06-22
KR20140043674A (ko) 2014-04-10

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