KR101696709B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents
기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDFInfo
- Publication number
- KR101696709B1 KR101696709B1 KR1020130114384A KR20130114384A KR101696709B1 KR 101696709 B1 KR101696709 B1 KR 101696709B1 KR 1020130114384 A KR1020130114384 A KR 1020130114384A KR 20130114384 A KR20130114384 A KR 20130114384A KR 101696709 B1 KR101696709 B1 KR 101696709B1
- Authority
- KR
- South Korea
- Prior art keywords
- solvent
- liquid storage
- substrate
- unit
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-220632 | 2012-10-02 | ||
| JP2012220632A JP5939118B2 (ja) | 2012-10-02 | 2012-10-02 | 基板処理装置、基板処理方法及び記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140043674A KR20140043674A (ko) | 2014-04-10 |
| KR101696709B1 true KR101696709B1 (ko) | 2017-01-16 |
Family
ID=50652087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130114384A Active KR101696709B1 (ko) | 2012-10-02 | 2013-09-26 | 기판 처리 장치, 기판 처리 방법 및 기억 매체 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5939118B2 (enExample) |
| KR (1) | KR101696709B1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202314405A (zh) * | 2021-06-15 | 2023-04-01 | 美商蘭姆研究公司 | 用於晶圓中的乾式顯影副產物揮發的乾式顯影設備及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005019969A (ja) * | 2003-06-06 | 2005-01-20 | Tokyo Electron Ltd | 基板の処理膜の表面荒れを改善する方法及び基板の処理装置 |
| JP2005259862A (ja) * | 2004-03-10 | 2005-09-22 | Mitsui Eng & Shipbuild Co Ltd | レジスト除去方法、レジスト除去剤噴射装置、およびレジスト除去装置 |
| JP2012087983A (ja) * | 2010-10-19 | 2012-05-10 | Tokyo Electron Ltd | 流体加熱装置及び基板処理装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04328667A (ja) | 1991-04-27 | 1992-11-17 | Nec Corp | 2ポートramデータ送受方式及び装置 |
| JP2004031750A (ja) * | 2002-06-27 | 2004-01-29 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
| JP5278469B2 (ja) * | 2011-03-03 | 2013-09-04 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
-
2012
- 2012-10-02 JP JP2012220632A patent/JP5939118B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-26 KR KR1020130114384A patent/KR101696709B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005019969A (ja) * | 2003-06-06 | 2005-01-20 | Tokyo Electron Ltd | 基板の処理膜の表面荒れを改善する方法及び基板の処理装置 |
| JP2005259862A (ja) * | 2004-03-10 | 2005-09-22 | Mitsui Eng & Shipbuild Co Ltd | レジスト除去方法、レジスト除去剤噴射装置、およびレジスト除去装置 |
| JP2012087983A (ja) * | 2010-10-19 | 2012-05-10 | Tokyo Electron Ltd | 流体加熱装置及び基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014075391A (ja) | 2014-04-24 |
| JP5939118B2 (ja) | 2016-06-22 |
| KR20140043674A (ko) | 2014-04-10 |
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