KR101692065B1 - 미세패턴롤을 제조하는 방법 및 장치 - Google Patents
미세패턴롤을 제조하는 방법 및 장치 Download PDFInfo
- Publication number
- KR101692065B1 KR101692065B1 KR1020160070437A KR20160070437A KR101692065B1 KR 101692065 B1 KR101692065 B1 KR 101692065B1 KR 1020160070437 A KR1020160070437 A KR 1020160070437A KR 20160070437 A KR20160070437 A KR 20160070437A KR 101692065 B1 KR101692065 B1 KR 101692065B1
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- Prior art keywords
- roll
- sheet
- pattern
- clithe
- tension control
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 230000003247 decreasing effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000007779 soft material Substances 0.000 claims description 2
- 230000003362 replicative effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000003754 machining Methods 0.000 description 9
- 238000003848 UV Light-Curing Methods 0.000 description 7
- 239000004927 clay Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 4
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- 238000009713 electroplating Methods 0.000 description 3
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- 238000005299 abrasion Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 210000003029 clitoris Anatomy 0.000 description 1
- 238000010367 cloning Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 230000000284 resting effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
- H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160070437A KR101692065B1 (ko) | 2016-06-07 | 2016-06-07 | 미세패턴롤을 제조하는 방법 및 장치 |
PCT/KR2017/005579 WO2017213370A1 (fr) | 2016-06-07 | 2017-05-29 | Procédé de fabrication de rouleau à micromotif et dispositif de préparation de rouleau à micromotif associé |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160070437A KR101692065B1 (ko) | 2016-06-07 | 2016-06-07 | 미세패턴롤을 제조하는 방법 및 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101692065B1 true KR101692065B1 (ko) | 2017-01-03 |
Family
ID=57797058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160070437A KR101692065B1 (ko) | 2016-06-07 | 2016-06-07 | 미세패턴롤을 제조하는 방법 및 장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101692065B1 (fr) |
WO (1) | WO2017213370A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200024565A (ko) * | 2018-08-28 | 2020-03-09 | 건국대학교 산학협력단 | 롤투롤을 활용한 플렉시블 대면적 온도 센서 제작 시스템 |
KR20210000992A (ko) | 2019-06-26 | 2021-01-07 | 한국기계연구원 | 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
KR20210000991A (ko) | 2019-06-26 | 2021-01-07 | 한국기계연구원 | 실시간 정렬이 가능한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100937211B1 (ko) * | 2009-05-15 | 2010-01-20 | 한국기계연구원 | 롤 임프린트 장치 |
KR101024376B1 (ko) | 2008-06-09 | 2011-03-23 | 한국기계연구원 | 미세 패턴 형성 방법 |
KR101037903B1 (ko) * | 2010-12-09 | 2011-05-30 | 한국기계연구원 | 롤프린팅/롤임프린팅용 롤 제조방법 |
KR20130135198A (ko) * | 2012-05-31 | 2013-12-10 | 주식회사 엘지화학 | 클리쉐 및 이를 포함하는 인쇄 장치 |
KR101408741B1 (ko) * | 2013-04-30 | 2014-06-18 | (주)새한나노텍 | 임프린트 장치 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101590102B1 (ko) * | 2009-05-07 | 2016-01-29 | 삼성전자 주식회사 | 롤투롤 패터닝 장치 및 이를 갖춘 패터닝 시스템 |
-
2016
- 2016-06-07 KR KR1020160070437A patent/KR101692065B1/ko active IP Right Grant
-
2017
- 2017-05-29 WO PCT/KR2017/005579 patent/WO2017213370A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101024376B1 (ko) | 2008-06-09 | 2011-03-23 | 한국기계연구원 | 미세 패턴 형성 방법 |
KR100937211B1 (ko) * | 2009-05-15 | 2010-01-20 | 한국기계연구원 | 롤 임프린트 장치 |
KR101037903B1 (ko) * | 2010-12-09 | 2011-05-30 | 한국기계연구원 | 롤프린팅/롤임프린팅용 롤 제조방법 |
KR20130135198A (ko) * | 2012-05-31 | 2013-12-10 | 주식회사 엘지화학 | 클리쉐 및 이를 포함하는 인쇄 장치 |
KR101408741B1 (ko) * | 2013-04-30 | 2014-06-18 | (주)새한나노텍 | 임프린트 장치 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200024565A (ko) * | 2018-08-28 | 2020-03-09 | 건국대학교 산학협력단 | 롤투롤을 활용한 플렉시블 대면적 온도 센서 제작 시스템 |
KR20210000992A (ko) | 2019-06-26 | 2021-01-07 | 한국기계연구원 | 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
KR20210000991A (ko) | 2019-06-26 | 2021-01-07 | 한국기계연구원 | 실시간 정렬이 가능한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
KR102267473B1 (ko) * | 2019-06-26 | 2021-06-22 | 한국기계연구원 | 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
KR102384120B1 (ko) * | 2019-06-26 | 2022-04-07 | 한국기계연구원 | 실시간 정렬이 가능한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법 |
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Publication number | Publication date |
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WO2017213370A1 (fr) | 2017-12-14 |
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