WO2017213370A1 - Procédé de fabrication de rouleau à micromotif et dispositif de préparation de rouleau à micromotif associé - Google Patents

Procédé de fabrication de rouleau à micromotif et dispositif de préparation de rouleau à micromotif associé Download PDF

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Publication number
WO2017213370A1
WO2017213370A1 PCT/KR2017/005579 KR2017005579W WO2017213370A1 WO 2017213370 A1 WO2017213370 A1 WO 2017213370A1 KR 2017005579 W KR2017005579 W KR 2017005579W WO 2017213370 A1 WO2017213370 A1 WO 2017213370A1
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WO
WIPO (PCT)
Prior art keywords
roll
cliché
sheet
fine pattern
manufacturing
Prior art date
Application number
PCT/KR2017/005579
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English (en)
Korean (ko)
Inventor
권신
강동우
우규희
장윤석
이승현
이택민
Original Assignee
한국기계연구원
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Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Publication of WO2017213370A1 publication Critical patent/WO2017213370A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
    • H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique

Definitions

  • the present invention relates to a method for manufacturing a micropattern and a device for manufacturing a micropattern roll therefor, and more particularly, to manufacturing a micropattern roll for forming a cliché sheet on which a micropattern is formed and manufacturing a cliché roll using the cliché sheet.
  • the present invention relates to a method for manufacturing a fine pattern roll and a method therefor.
  • Conventional ROLL PRINTING apparatus includes a blanket roll to which the printing composition is applied and a cliché roll in contact with the blanket roll to change the printing composition applied to the blanket roll into a specific pattern.
  • the fine pattern is embossed on the cliché roll, and the part of the printing composition in contact with the fine pattern is transferred to the cliché roll, and the specific pattern to be printed is left on the cranket roll.
  • the laser is irradiated on the roll to form a flaw on the surface of the roll, and then the etching process is performed by immersing the roll in an acid solution to corrode the flaw to form a fine pattern on the roll surface.
  • a roll machining method using a machine, a laser machining method using a laser on a roll surface, and a method of forming a fine pattern on a roll surface by etching after deposition of E-beam evaporation (E-BEAM) were used.
  • an object of the present invention in view of the above point is easy to fine pattern depth control and shape control, economical by reducing the processing time, it is possible to form micro-pattern fine pattern, expensive equipment is required To provide a method for producing a fine pattern roll and a manufacturing apparatus for a fine pattern roll for this.
  • Method of manufacturing a micro pattern roll of an embodiment of the present invention for achieving the above object the step of producing a master plate embossed with a fine pattern on the surface through a semiconductor process, by replicating the master plate is engraved fine pattern Manufacturing the prepared cliché sheet, and attaching the cliché sheet to the roll surface.
  • the master flat plate may be imprinted to produce a cliché sheet of synthetic resin material in which a fine pattern is engraved.
  • the UV cured resin may be applied to the roll surface, and after attaching the cliché sheet to the roll surface, the UV cured resin may be cured and the cliché sheet may be separated from the roll surface.
  • the master plate in the step of manufacturing the cliché sheet, can be plated by electroplating to produce a pre-plated cliché sheet in which a fine pattern is engraved.
  • the tension control dancer to control the tension of the roll mounting portion, the roll mounting portion moving in the longitudinal direction, and the cliché sheet attached to the roll located on one side of the roll mounting portion A, based on the image of the cliché sheet obtained by the camera provided on one side of the roll, the cliché sheet can be wound to the set position.
  • Apparatus for producing a micropattern roll of an embodiment of the present invention for achieving the above object is, the citrate sheet portion is mounted and the cliché sheet unrolled from the citrate sheet is wound around A tension control dancer positioned between the roll holding portion on which the losing pattern roll is mounted, the crolling sheet portion and the roll holding portion, and contacting the cliché sheet moving from the sea troll toward the pattern roll to apply tension to the cliché sheet; And an idle roller having a height difference from the tension control dancer and positioned at the front and rear sides of the tension control dancer.
  • a driving device for rotating the pattern roll in the roll mounting portion may be provided.
  • both longitudinal ends of the tension control dancer may be inserted into the height movement guide perpendicular to the tension control dancer, respectively, and an actuator may be built in the height movement guide to move the longitudinal end of the tension control dancer in height.
  • marks are formed on both sides in the width direction of the cliché sheet at equal intervals along the length direction of the cliché sheet, and a camera is provided on one side of the roll mounting portion, and the pattern is based on the image signal detected by the camera.
  • the roll can move in the longitudinal direction.
  • the roll mounting portion, the fixing member which is fixed to the center axis bar is fixed to the pattern roll, the central axis bar, both sides of the longitudinal axis of the center axis bar is inserted, the lower end of the fixing member, the image signal detected by the camera It may include a left and right moving device for moving the fixing member in the longitudinal direction of the central axis bar on the basis.
  • an adhesive film or an adhesive solution for fixing the cliché sheet to the pattern roll may be applied to the pattern roll.
  • the roll mounting portion may be provided with a pressure roller for pressing the cliché sheet toward the pattern roll.
  • both ends of the pressing roller in the longitudinal direction may be provided with a pressure generating device for driving each of them separately, and to adjust the distance between the pressing roller and the pattern roll.
  • UV curable resin may be applied to the pattern roll.
  • the master plate is manufactured through the semiconductor process, fine pattern depth control and shape control are easy, and micro-unit fine pattern formation is possible.
  • FIG. 1 is a flowchart illustrating a method of manufacturing a fine pattern roll according to an embodiment of the present invention.
  • 2A to 2C are process diagrams illustrating a method of manufacturing the fine pattern roll of FIG. 1.
  • FIG. 3 is a flowchart illustrating a method of manufacturing a fine pattern roll according to another embodiment of the present invention.
  • 4A to 4C are process diagrams illustrating a method of manufacturing the fine pattern roll of FIG. 3.
  • FIG. 5 is a perspective view illustrating an apparatus for manufacturing a fine pattern roll for the method of manufacturing the fine pattern roll of FIGS. 1 and 3.
  • FIG. 6 is a schematic diagram schematically showing an apparatus for manufacturing a fine pattern roll of FIG. 5.
  • 7A to 7D are process diagrams illustrating a state in which resin is applied to a pattern roll of the apparatus for manufacturing a fine pattern roll of FIG. 5.
  • control unit 110 control circuit 100: control unit 110: control
  • mark 200 roll mounting portion
  • pattern roll 220 camera
  • FIG. 1 is a flowchart illustrating a method of manufacturing a fine pattern roll according to an embodiment of the present invention.
  • 2A to 2C are process diagrams illustrating a method of manufacturing the fine pattern roll of FIG. 1.
  • the method for manufacturing a fine pattern roll according to the present embodiment, the step of producing a master plate (P1) embossed with a fine pattern on the surface through a semiconductor process (S100) And duplicating the master plate P1 to produce a cliché sheet C having a fine pattern engraved therein (S200), and attaching the cliché sheet C to the surface of the pattern roll 210 (S300). do.
  • the cliché sheet C of the synthetic resin material having the fine pattern engraved by imprinting the master plate P1 is produced.
  • the master plate (P1) is produced through a semiconductor process, a fine pattern can be produced in a very fine size of a micro unit.
  • the surface of the semiconductor material can be polished or cut, even if an error occurs during the production of the master plate (P1) it can be easily overcome.
  • a UV cured resin is formed on the surface of the pattern roll 210. Applying (G) (S210) may be further performed.
  • the cliché sheet C After attaching the cliché sheet C to the surface of the pattern roll 210 (S300), the cliché sheet C is pressed, the UV cured resin G is cured, and the cliché sheet C is patterned. Separating step S310 from the surface of the roll 210 is further performed, and cliché rolls may be produced.
  • an inverse phase pattern that is inverse to the fine pattern formed on the cliché sheet C is formed on the surface of the pattern roll 210.
  • the master plate P1 produced through the semiconductor process is likely to be worn and deformed by an external force.
  • the roll roll 200 is mounted on the pattern roll 210, and the roll roll portion 200 is moved in the longitudinal direction.
  • the tension control dancer 300 which is positioned at and controls the tension of the cliché sheet C attached to the pattern roll 210, is obtained by the camera 220 provided on one side of the pattern roll 210. Based on the image of C), the cliché sheet C is induced to be wound at the set position.
  • the cliché sheet C is accurately wound on the pattern roll 210 by the roll mounting unit 200 and the tension control dancer 300.
  • FIG. 3 is a flowchart illustrating a method of manufacturing a fine pattern roll according to another embodiment of the present invention.
  • 4A to 4C are process diagrams illustrating a method of manufacturing the fine pattern roll of FIG. 3.
  • the master plate (P1) in the step of manufacturing the cliché sheet (S210), the master plate (P1) may be reproduced by electroplating to produce an electroplated cliché sheet C in which a fine pattern is engraved.
  • the seed layer L is applied to the master plate P1 before the step S200 of fabricating the electroplating cliché sheet C is performed. ) Is formed.
  • the surface which is not in contact with the master flat plate P1 among both surfaces of the electroplating cliché sheet C is not smooth and has a large possibility of being bumpy.
  • the cliché sheet C manufactured by the method for manufacturing the micropattern roll described with reference to FIGS. 1 to 4C is the pattern roll 210 by the apparatus for manufacturing the micropattern roll, as shown in FIGS. 5 to 7D. It is used to form a fine pattern in.
  • FIG. 5 is a perspective view illustrating an apparatus for manufacturing a fine pattern roll for the method of manufacturing the fine pattern roll of FIGS. 1 and 3.
  • FIG. 6 is a schematic diagram schematically showing an apparatus for manufacturing a fine pattern roll of FIG. 5.
  • 7A to 7D are process diagrams illustrating a state in which resin is applied to a pattern roll of the apparatus for manufacturing a fine pattern roll of FIG. 5.
  • the apparatus for manufacturing fine pattern rolls includes: a situ control unit 100 on which a situ 110 on which a cliché sheet C of a soft material is wound is mounted, and a situ 110.
  • Cliché sheet (C) released from the roll roll portion 200 is placed between the pattern roll 210 is wound on the surface, and the seat control portion 100 and the roll placement portion 200, the sheet A tension control dancer 300 in the form of a roll for applying tension to the cliché sheet C by contacting the cliché sheet C moving from the roll 110 toward the pattern roll 210, and the tension control dancer 300; It includes an idle roller 400 having a height difference and located in the front and rear of the tension control dancer (300).
  • the apparatus for manufacturing a fine pattern roll is provided with a driving device for rotating the pattern roll 210 on the roll placement unit 200.
  • Both ends extending in the longitudinal direction of the tension control dancer 300 are inserted into the height movement guide 310 perpendicular to the tension control dancer 300, respectively.
  • the height movement guide 310 has a built-in actuator 320 for moving the one end extending in the longitudinal direction of the tension control dancer 300 in height.
  • the tension generated in the cliché sheet C moving from the sea troll 110 to the pattern roll 210 is added or subtracted.
  • the tension control dancer 300 moves high and the crest sheet C is formed so as to accurately wind the pattern roll 210 by adding or subtracting the tension generated in the cliché sheet C. Induce C).
  • the tension control dancer 300 induces the tension in the cliché sheet (C) to reduce the tension in the longitudinal direction of the cliché sheet (C).
  • Marks 111 are formed on both sides in the width direction of the cliché sheet C at equal intervals along the longitudinal direction of the cliché sheet C, respectively.
  • the camera 220 for detecting the mark 111 is provided at one side of the roll fixing unit 200, and the pattern roll 210 is moved in the longitudinal direction based on the image signal detected by the camera 220.
  • the cliché sheet C can move (meander) with a deviation in the width direction by the tension or the frictional force generated in the cliché sheet C. Therefore, the pattern roll 210 is moved in the rotation axis direction so that the meandering cliché sheet C can be accurately wound on the surface of the pattern roll 210.
  • the roll mounting unit 200 includes a center shaft bar 230 on which the pattern roll 210 is fixed, a fixing member 240 perpendicular to the center shaft bar 230, and both sides of the center shaft bar 230 in the longitudinal direction are inserted. And, located on the bottom of the fixing member 240, and includes a left and right moving device 250 for moving the fixing member 240 in the longitudinal direction of the central axis bar 230 based on the image signal detected by the camera 220 do.
  • the left and right moving device 250 According to the image signal sensed by the camera 220, the left and right moving device 250 to move the fixing member 240 left and right. Thereby, the meandering cliché sheet C is uniformly seated on the surface of the pattern roll 210.
  • an adhesive film or an adhesive solution for fixing the cliché sheet C to the pattern roll 210 is applied to the pattern roll 210.
  • the cliché sheet C seated on the pattern roll 210 by an adhesive film or an adhesive solution is fixed to the pattern roll 210.
  • the roll mounting unit 200 is provided with a pressure roller 260 for pressing the cliché sheet C toward the pattern roll 210. As the pressure roller 260 presses the cliché sheet C, the cliché sheet C is firmly attached to the pattern roll 210.
  • the pressure generator 261 is provided to drive each of the pressure rollers 260 and the distance between the pressure roller 260 and the pattern roll 210. According to the tension applied to the cliché sheet C, a greater force may be applied to the cliché sheet C seated on either side of the pattern roll 210.
  • the pressure roller 260 presses or depressurizes any one side of both sides of the cliché sheet C in the width direction.
  • the cliché sheet C is guided by the pressure roller 260 to be attached to the pattern roll 210 with a uniform force along the width direction.
  • UV cured resin (G) may be applied.
  • the cliché sheet C is pressed onto the UV curing resin G by the pressure roller 260 and seated thereon. After the UV curing resin G is cured, the cliché sheet C is separated from the pattern roll 210. In this case, as described above, an inverse pattern that is inverse to the fine pattern formed in the cliché sheet C is formed on the surface of the pattern roll 210.
  • the master plate (P1) is produced through a semiconductor process, it is easy to control the fine pattern depth and shape, and fine in the micro unit Pattern formation is possible.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

Cette invention concerne un dispositif de fabrication de rouleau à micromotif et un dispositif de fabrication de rouleau à micro-motif associé. Le procédé de fabrication de rouleau à micromotif comprend les étapes de : la fabrication d'une plaque plane maîtresse ayant un micromotif gravé en relief sur sa surface par l'intermédiaire d'un processus à semi-conducteur ; la fabrication d'une feuille de cliché ayant un micromotif gravé en creux sur celle-ci par la réplication de la plaque plane maîtresse ; et la fixation de la feuille de cliché à la surface du rouleau. En conséquence, la plaque plane maîtresse est fabriquée par un procédé à semi-conducteur, facilitant ainsi la commande de la profondeur et de la forme du micromotif, et permettant la formation d'un micromotif dans une micro-unité.
PCT/KR2017/005579 2016-06-07 2017-05-29 Procédé de fabrication de rouleau à micromotif et dispositif de préparation de rouleau à micromotif associé WO2017213370A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0070437 2016-06-07
KR1020160070437A KR101692065B1 (ko) 2016-06-07 2016-06-07 미세패턴롤을 제조하는 방법 및 장치

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WO2017213370A1 true WO2017213370A1 (fr) 2017-12-14

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WO (1) WO2017213370A1 (fr)

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KR102145957B1 (ko) * 2018-08-28 2020-08-19 건국대학교 산학협력단 롤투롤을 활용한 플렉시블 대면적 온도 센서 제작 시스템
KR102267473B1 (ko) 2019-06-26 2021-06-22 한국기계연구원 실시간 장력제어를 이용한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법
KR102384120B1 (ko) 2019-06-26 2022-04-07 한국기계연구원 실시간 정렬이 가능한 미세패턴 롤 제작시스템, 및 이를 이용한 미세패턴 롤 제작방법

Citations (5)

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Publication number Priority date Publication date Assignee Title
KR100937211B1 (ko) * 2009-05-15 2010-01-20 한국기계연구원 롤 임프린트 장치
US20100282162A1 (en) * 2009-05-07 2010-11-11 Samsung Electronics Co., Ltd. Roll-to-roll patterning apparatus and patterning system having the same
KR101037903B1 (ko) * 2010-12-09 2011-05-30 한국기계연구원 롤프린팅/롤임프린팅용 롤 제조방법
KR20130135198A (ko) * 2012-05-31 2013-12-10 주식회사 엘지화학 클리쉐 및 이를 포함하는 인쇄 장치
KR101408741B1 (ko) * 2013-04-30 2014-06-18 (주)새한나노텍 임프린트 장치

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Publication number Priority date Publication date Assignee Title
KR101024376B1 (ko) 2008-06-09 2011-03-23 한국기계연구원 미세 패턴 형성 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100282162A1 (en) * 2009-05-07 2010-11-11 Samsung Electronics Co., Ltd. Roll-to-roll patterning apparatus and patterning system having the same
KR100937211B1 (ko) * 2009-05-15 2010-01-20 한국기계연구원 롤 임프린트 장치
KR101037903B1 (ko) * 2010-12-09 2011-05-30 한국기계연구원 롤프린팅/롤임프린팅용 롤 제조방법
KR20130135198A (ko) * 2012-05-31 2013-12-10 주식회사 엘지화학 클리쉐 및 이를 포함하는 인쇄 장치
KR101408741B1 (ko) * 2013-04-30 2014-06-18 (주)새한나노텍 임프린트 장치

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