KR101688756B1 - 전자 부품 및 그 제조 방법 - Google Patents

전자 부품 및 그 제조 방법 Download PDF

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Publication number
KR101688756B1
KR101688756B1 KR1020157020118A KR20157020118A KR101688756B1 KR 101688756 B1 KR101688756 B1 KR 101688756B1 KR 1020157020118 A KR1020157020118 A KR 1020157020118A KR 20157020118 A KR20157020118 A KR 20157020118A KR 101688756 B1 KR101688756 B1 KR 101688756B1
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KR
South Korea
Prior art keywords
alloy
plated film
copper
based compound
plating
Prior art date
Application number
KR1020157020118A
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English (en)
Korean (ko)
Other versions
KR20150099850A (ko
Inventor
도루 이모리
다카시 오우치
루이 난바
Original Assignee
제이엑스금속주식회사
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Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20150099850A publication Critical patent/KR20150099850A/ko
Application granted granted Critical
Publication of KR101688756B1 publication Critical patent/KR101688756B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/04—Electrophoretic coating characterised by the process with organic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020157020118A 2013-07-24 2014-07-23 전자 부품 및 그 제조 방법 KR101688756B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-153341 2013-07-24
JP2013153341 2013-07-24
PCT/JP2014/069435 WO2015012306A1 (ja) 2013-07-24 2014-07-23 電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
KR20150099850A KR20150099850A (ko) 2015-09-01
KR101688756B1 true KR101688756B1 (ko) 2016-12-21

Family

ID=52393339

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157020118A KR101688756B1 (ko) 2013-07-24 2014-07-23 전자 부품 및 그 제조 방법

Country Status (3)

Country Link
JP (1) JP6192181B2 (ja)
KR (1) KR101688756B1 (ja)
WO (1) WO2015012306A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020060677A (ja) * 2018-10-10 2020-04-16 株式会社リコー 加熱装置、定着装置及び画像形成装置
JP7216906B2 (ja) 2018-12-07 2023-02-02 株式会社リコー 温度検知部材、加熱装置、定着装置及び画像形成装置
JP6791276B2 (ja) * 2019-01-29 2020-11-25 ダイキン工業株式会社 冷媒配管の検査方法および冷媒配管
JP7289535B2 (ja) 2020-05-19 2023-06-12 株式会社アパード アキシャルギャップモータ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04193994A (ja) * 1990-11-28 1992-07-14 Nikko Kyodo Co Ltd 封孔処理液及び方法
JPH04193990A (ja) 1990-11-28 1992-07-14 Nikko Kyodo Co Ltd 封孔処理液及び方法
JPH04193982A (ja) 1990-11-28 1992-07-14 Nikko Kyodo Co Ltd 封孔処理液及び方法
JPH05311490A (ja) 1991-12-25 1993-11-22 Nikko Kinzoku Kk 金めっき材の封孔処理方法
JPH05311491A (ja) 1991-12-25 1993-11-22 Nikko Kinzoku Kk 金めっき材封孔処理法
JPH07173678A (ja) * 1993-12-21 1995-07-11 Nikko Kinzoku Kk リフローめっき材の表面処理方法
JP2717062B2 (ja) 1994-03-24 1998-02-18 日鉱金属株式会社 金めっき材の封孔処理方法
JP2717063B2 (ja) * 1994-03-24 1998-02-18 日鉱金属株式会社 金めっき材の封孔処理方法
JP2804452B2 (ja) * 1995-03-24 1998-09-24 日鉱金属株式会社 金めっき材の封孔処理方法
JPH11260981A (ja) * 1998-03-13 1999-09-24 Matsushita Electric Works Ltd リードフレームの製造方法
JP2001181890A (ja) * 1999-12-21 2001-07-03 Nippon Mining & Metals Co Ltd 金または金合金めっき材の封孔処理方法
JP2002231357A (ja) 2001-02-06 2002-08-16 Nagano Fujitsu Component Kk 電気接点およびコネクタ
JP3870225B2 (ja) 2001-10-19 2007-01-17 ユケン工業株式会社 金めっき封孔処理剤と方法
JP2010044983A (ja) * 2008-08-18 2010-02-25 Alps Electric Co Ltd 接触子及びその製造方法、ならびに前記接触子を備える接続装置及びその製造方法
JP5740727B2 (ja) * 2010-05-17 2015-06-24 ユケン工業株式会社 封孔処理剤および封孔処理方法

Also Published As

Publication number Publication date
JP6192181B2 (ja) 2017-09-13
WO2015012306A1 (ja) 2015-01-29
JPWO2015012306A1 (ja) 2017-03-02
KR20150099850A (ko) 2015-09-01

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