KR101619149B1 - 칩온글래스 본딩 검사장치 - Google Patents

칩온글래스 본딩 검사장치 Download PDF

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Publication number
KR101619149B1
KR101619149B1 KR1020140007705A KR20140007705A KR101619149B1 KR 101619149 B1 KR101619149 B1 KR 101619149B1 KR 1020140007705 A KR1020140007705 A KR 1020140007705A KR 20140007705 A KR20140007705 A KR 20140007705A KR 101619149 B1 KR101619149 B1 KR 101619149B1
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KR
South Korea
Prior art keywords
imaging device
inspection
inspection object
scanning direction
image
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Application number
KR1020140007705A
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English (en)
Korean (ko)
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KR20150087575A (ko
Inventor
김선중
이윤기
이성록
Original Assignee
주식회사 브이원텍
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Application filed by 주식회사 브이원텍 filed Critical 주식회사 브이원텍
Priority to KR1020140007705A priority Critical patent/KR101619149B1/ko
Priority to CN201410220535.XA priority patent/CN104792800B/zh
Priority to TW104132659A priority patent/TWI582412B/zh
Priority to TW103118721A priority patent/TWI509237B/zh
Publication of KR20150087575A publication Critical patent/KR20150087575A/ko
Application granted granted Critical
Publication of KR101619149B1 publication Critical patent/KR101619149B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Operations Research (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020140007705A 2014-01-22 2014-01-22 칩온글래스 본딩 검사장치 KR101619149B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020140007705A KR101619149B1 (ko) 2014-01-22 2014-01-22 칩온글래스 본딩 검사장치
CN201410220535.XA CN104792800B (zh) 2014-01-22 2014-05-23 玻璃上芯片接合检验设备
TW104132659A TWI582412B (zh) 2014-01-22 2014-05-29 玻璃上晶片之接合檢驗設備
TW103118721A TWI509237B (zh) 2014-01-22 2014-05-29 玻璃上晶片之接合檢驗設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140007705A KR101619149B1 (ko) 2014-01-22 2014-01-22 칩온글래스 본딩 검사장치

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020150088390A Division KR20150087829A (ko) 2015-06-22 2015-06-22 칩온글래스 본딩 검사장치
KR1020150182940A Division KR20160003608A (ko) 2015-12-21 2015-12-21 칩온글래스 본딩 검사장치

Publications (2)

Publication Number Publication Date
KR20150087575A KR20150087575A (ko) 2015-07-30
KR101619149B1 true KR101619149B1 (ko) 2016-05-10

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Family Applications (1)

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KR1020140007705A KR101619149B1 (ko) 2014-01-22 2014-01-22 칩온글래스 본딩 검사장치

Country Status (3)

Country Link
KR (1) KR101619149B1 (zh)
CN (1) CN104792800B (zh)
TW (2) TWI582412B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105259178B (zh) * 2015-11-20 2019-03-15 云南卡索实业有限公司 一种剪切类线性痕迹激光检测系统
KR102008224B1 (ko) * 2018-05-29 2019-08-07 에스엔유 프리시젼 주식회사 곡면 검사가 가능한 검사시스템
KR20210042194A (ko) * 2019-10-08 2021-04-19 삼성디스플레이 주식회사 표시 장치의 제조 방법, 및 표시 장치의 제조 장치
KR102326328B1 (ko) * 2020-03-05 2021-11-15 주식회사 앱소 비전 검사 장치 및 방법
CN116013803B (zh) * 2023-03-30 2023-06-20 深圳新控半导体技术有限公司 一种芯片粘贴用温感式检测装置及其检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101019831B1 (ko) 2010-09-02 2011-03-04 주식회사 투아이스펙트라 유리기판의 에지 검사시스템

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006184021A (ja) * 2004-12-24 2006-07-13 Saki Corp:Kk 外観検査装置
KR101002441B1 (ko) * 2008-12-18 2010-12-17 세광테크 주식회사 Ｃｏｇ 접합부 검사장치
EP2609419A1 (en) * 2010-08-24 2013-07-03 Nanda Technologies GmbH Methods and systems for inspecting bonded wafers
JP6004517B2 (ja) * 2011-04-19 2016-10-12 芝浦メカトロニクス株式会社 基板検査装置、基板検査方法及び該基板検査装置の調整方法
TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法
CN103376259A (zh) * 2012-04-11 2013-10-30 百励科技股份有限公司 元件内部缺陷的检测装置及方法
JP5958808B2 (ja) * 2012-06-04 2016-08-02 株式会社Ｊｏｌｅｄ 表示パネルの製造方法、その検査装置及び検査方法
TWM469621U (zh) * 2013-06-21 2014-01-01 昇佳電子股份有限公司 光學感測裝置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101019831B1 (ko) 2010-09-02 2011-03-04 주식회사 투아이스펙트라 유리기판의 에지 검사시스템

Also Published As

Publication number Publication date
CN104792800B (zh) 2018-04-17
TWI509237B (zh) 2015-11-21
CN104792800A (zh) 2015-07-22
TWI582412B (zh) 2017-05-11
TW201602561A (zh) 2016-01-16
TW201530123A (zh) 2015-08-01
KR20150087575A (ko) 2015-07-30

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