KR101604323B1 - 반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프 - Google Patents

반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프 Download PDF

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Publication number
KR101604323B1
KR101604323B1 KR1020157001148A KR20157001148A KR101604323B1 KR 101604323 B1 KR101604323 B1 KR 101604323B1 KR 1020157001148 A KR1020157001148 A KR 1020157001148A KR 20157001148 A KR20157001148 A KR 20157001148A KR 101604323 B1 KR101604323 B1 KR 101604323B1
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KR
South Korea
Prior art keywords
adhesive layer
adhesive
semiconductor wafer
printing
tape
Prior art date
Application number
KR1020157001148A
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English (en)
Korean (ko)
Other versions
KR20150027802A (ko
Inventor
아츠시 히라이즈미
히로미츠 마루야마
노보루 사쿠마
마사미 아오야마
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20150027802A publication Critical patent/KR20150027802A/ko
Application granted granted Critical
Publication of KR101604323B1 publication Critical patent/KR101604323B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020157001148A 2012-07-26 2013-07-24 반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프 KR101604323B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012165936 2012-07-26
JPJP-P-2012-165936 2012-07-26
PCT/JP2013/070040 WO2014017537A1 (ja) 2012-07-26 2013-07-24 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ

Publications (2)

Publication Number Publication Date
KR20150027802A KR20150027802A (ko) 2015-03-12
KR101604323B1 true KR101604323B1 (ko) 2016-03-17

Family

ID=49997346

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157001148A KR101604323B1 (ko) 2012-07-26 2013-07-24 반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프

Country Status (5)

Country Link
JP (1) JP5607843B2 (ja)
KR (1) KR101604323B1 (ja)
CN (1) CN104508798B (ja)
TW (1) TWI545643B (ja)
WO (1) WO2014017537A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5863914B1 (ja) 2014-09-05 2016-02-17 古河電気工業株式会社 半導体加工用テープ及びこれを使用して製造する半導体装置の製造方法
JP6407060B2 (ja) * 2015-02-25 2018-10-17 古河電気工業株式会社 ウエハ加工用テープ
JP7056886B2 (ja) * 2015-09-28 2022-04-19 リンテック株式会社 粘着シート、及び粘着シートの製造方法
JP6967506B2 (ja) * 2016-02-23 2021-11-17 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法
JP6991475B2 (ja) * 2017-05-24 2022-01-12 協立化学産業株式会社 加工対象物切断方法
JP7046586B2 (ja) * 2017-12-14 2022-04-04 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
WO2023281906A1 (ja) * 2021-07-09 2023-01-12 日東電工株式会社 熱硬化性接着シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001214137A (ja) 2000-02-02 2001-08-07 Toyo Ink Mfg Co Ltd 粘着シート及び該シートの製造方法
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法
JP2011137057A (ja) 2009-12-25 2011-07-14 Nitto Denko Corp チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法
JP2011210927A (ja) 2010-03-30 2011-10-20 Lintec Corp シート貼付方法およびウエハ加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112345A (ja) * 1984-11-07 1986-05-30 Toshiba Corp 半導体装置の製造方法
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
WO2011129272A1 (ja) * 2010-04-13 2011-10-20 積水化学工業株式会社 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置
JP5767478B2 (ja) * 2011-01-27 2015-08-19 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001214137A (ja) 2000-02-02 2001-08-07 Toyo Ink Mfg Co Ltd 粘着シート及び該シートの製造方法
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法
JP2011137057A (ja) 2009-12-25 2011-07-14 Nitto Denko Corp チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法
JP2011210927A (ja) 2010-03-30 2011-10-20 Lintec Corp シート貼付方法およびウエハ加工方法

Also Published As

Publication number Publication date
CN104508798A (zh) 2015-04-08
CN104508798B (zh) 2017-03-08
JP5607843B2 (ja) 2014-10-15
JPWO2014017537A1 (ja) 2016-07-11
TW201411709A (zh) 2014-03-16
KR20150027802A (ko) 2015-03-12
WO2014017537A1 (ja) 2014-01-30
TWI545643B (zh) 2016-08-11

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