KR101602973B1 - 접착 필름 유지 기구 - Google Patents

접착 필름 유지 기구 Download PDF

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Publication number
KR101602973B1
KR101602973B1 KR1020110004208A KR20110004208A KR101602973B1 KR 101602973 B1 KR101602973 B1 KR 101602973B1 KR 1020110004208 A KR1020110004208 A KR 1020110004208A KR 20110004208 A KR20110004208 A KR 20110004208A KR 101602973 B1 KR101602973 B1 KR 101602973B1
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KR
South Korea
Prior art keywords
holding
work
suction
adhesive film
unit
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KR1020110004208A
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English (en)
Korean (ko)
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KR20110092213A (ko
Inventor
준 사토
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20110092213A publication Critical patent/KR20110092213A/ko
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Publication of KR101602973B1 publication Critical patent/KR101602973B1/ko

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  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110004208A 2010-02-08 2011-01-14 접착 필름 유지 기구 KR101602973B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010025792A JP5461218B2 (ja) 2010-02-08 2010-02-08 接着フィルム保持機構
JPJP-P-2010-025792 2010-02-08

Publications (2)

Publication Number Publication Date
KR20110092213A KR20110092213A (ko) 2011-08-17
KR101602973B1 true KR101602973B1 (ko) 2016-03-11

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ID=44596173

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110004208A KR101602973B1 (ko) 2010-02-08 2011-01-14 접착 필름 유지 기구

Country Status (2)

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JP (1) JP5461218B2 (ja)
KR (1) KR101602973B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6068256B2 (ja) * 2013-05-15 2017-01-25 株式会社ディスコ 被加工物の切削方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066798A (ja) 2003-08-27 2005-03-17 Disco Abrasive Syst Ltd 加工装置のチャックテーブル
JP2006281434A (ja) 2005-03-11 2006-10-19 Disco Abrasive Syst Ltd ウェーハの保持機構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229115A (ja) * 1997-02-14 1998-08-25 Sumitomo Metal Ind Ltd ウェハ用真空チャック
JPH10305420A (ja) 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
JPH1167882A (ja) * 1997-08-22 1999-03-09 Nikon Corp 基板吸着装置及び基板吸着方法
JP4109823B2 (ja) 2000-10-10 2008-07-02 株式会社東芝 半導体装置の製造方法
JP2002134597A (ja) * 2000-10-27 2002-05-10 Ushio Inc ステージ装置
JP2009212155A (ja) * 2008-02-29 2009-09-17 Sekigahara Seisakusho:Kk 石材構造物
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
JP2011066114A (ja) * 2009-09-16 2011-03-31 Toshiba Corp チップ加工装置およびチップ加工方法
JP5466964B2 (ja) * 2010-02-08 2014-04-09 株式会社ディスコ ワーク保持機構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066798A (ja) 2003-08-27 2005-03-17 Disco Abrasive Syst Ltd 加工装置のチャックテーブル
JP2006281434A (ja) 2005-03-11 2006-10-19 Disco Abrasive Syst Ltd ウェーハの保持機構

Also Published As

Publication number Publication date
KR20110092213A (ko) 2011-08-17
JP2011165828A (ja) 2011-08-25
JP5461218B2 (ja) 2014-04-02

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