KR101600172B1 - 가스 실드 아크 용접용 플럭스 내장 와이어 - Google Patents

가스 실드 아크 용접용 플럭스 내장 와이어 Download PDF

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Publication number
KR101600172B1
KR101600172B1 KR1020140034167A KR20140034167A KR101600172B1 KR 101600172 B1 KR101600172 B1 KR 101600172B1 KR 1020140034167 A KR1020140034167 A KR 1020140034167A KR 20140034167 A KR20140034167 A KR 20140034167A KR 101600172 B1 KR101600172 B1 KR 101600172B1
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South Korea
Prior art keywords
mass
content
wire
compounds
compound
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KR1020140034167A
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English (en)
Korean (ko)
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KR20140116821A (ko
Inventor
게이토 이시자키
다카유키 고이케
나오히데 후루카와
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가부시키가이샤 고베 세이코쇼
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Publication of KR20140116821A publication Critical patent/KR20140116821A/ko
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Publication of KR101600172B1 publication Critical patent/KR101600172B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3026—Mn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053—Fe as the principal constituent
    • B23K35/3093—Fe as the principal constituent with other elements as next major constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/325—Ti as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/16—Arc welding or cutting making use of shielding gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01003—Lithium [Li]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01009—Fluorine [F]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01016—Sulfur [S]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01083—Bismuth [Bi]

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Arc Welding In General (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
KR1020140034167A 2013-03-25 2014-03-24 가스 실드 아크 용접용 플럭스 내장 와이어 KR101600172B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013062929A JP6085205B2 (ja) 2013-03-25 2013-03-25 ガスシールドアーク溶接用フラックス入りワイヤ
JPJP-P-2013-062929 2013-03-25

Publications (2)

Publication Number Publication Date
KR20140116821A KR20140116821A (ko) 2014-10-06
KR101600172B1 true KR101600172B1 (ko) 2016-03-04

Family

ID=51592128

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KR1020140034167A KR101600172B1 (ko) 2013-03-25 2014-03-24 가스 실드 아크 용접용 플럭스 내장 와이어

Country Status (3)

Country Link
JP (1) JP6085205B2 (ja)
KR (1) KR101600172B1 (ja)
CN (2) CN104070305A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6509007B2 (ja) * 2015-03-30 2019-05-08 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤの製造方法
JP2016187828A (ja) * 2015-03-30 2016-11-04 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤ
JP6746338B2 (ja) * 2016-03-25 2020-08-26 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009190042A (ja) 2008-02-12 2009-08-27 Nippon Steel & Sumikin Welding Co Ltd ２電極すみ肉ガスシールドアーク溶接方法
JP2012218065A (ja) * 2011-04-13 2012-11-12 Nippon Steel & Sumikin Welding Co Ltd ２電極水平すみ肉ｃｏ２ガスシールドアーク溶接用フラックス入りワイヤ

Family Cites Families (14)

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JP2667635B2 (ja) * 1994-03-31 1997-10-27 株式会社神戸製鋼所 ステンレス鋼フラックス入りワイヤ
JPH09314383A (ja) * 1996-05-24 1997-12-09 Nippon Steel Corp 高速水平すみ肉ガスシールドアーク溶接方法
JP4425756B2 (ja) 2004-09-28 2010-03-03 日鐵住金溶接工業株式会社 水平すみ肉溶接用フラックス入りワイヤ
JP4531617B2 (ja) * 2005-04-07 2010-08-25 日鐵住金溶接工業株式会社 ガスシールドアーク溶接用フラックス入りワイヤ
JP4986562B2 (ja) * 2006-10-02 2012-07-25 株式会社神戸製鋼所 チタニヤ系ガスシールドアーク溶接用フラックス入りワイヤ
JP4838100B2 (ja) * 2006-11-06 2011-12-14 日鐵住金溶接工業株式会社 耐候性鋼用水平すみガスシールドアーク溶接用フラックス入りワイヤ
JP4776508B2 (ja) * 2006-11-20 2011-09-21 株式会社神戸製鋼所 エレクトロガスアーク溶接用フラックス入りワイヤ
CN101396774B (zh) * 2007-09-30 2010-12-08 苏派特金属（昆山）有限公司 药芯焊丝
EP2289661B1 (en) * 2009-08-27 2014-04-02 Nippon Steel & Sumikin Welding Co., Ltd. Flux cored wire for gas shielded arc welding of high strength steel
JP4949449B2 (ja) 2009-09-18 2012-06-06 株式会社神戸製鋼所 溶接用フラックス入りワイヤ
JP5450293B2 (ja) * 2010-07-01 2014-03-26 株式会社神戸製鋼所 すみ肉溶接継手およびガスシールドアーク溶接方法
CN102554497B (zh) * 2010-12-21 2014-06-04 中冶建筑研究总院有限公司 一种细晶粒高强度钢筋co2电弧焊用药芯焊丝
JP5669684B2 (ja) * 2011-07-12 2015-02-12 日鐵住金溶接工業株式会社 水平すみ肉ガスシールドアーク溶接用フラックス入りワイヤ
CN102873468B (zh) * 2012-09-18 2014-10-01 武汉铁锚焊接材料股份有限公司 一种高速平角焊药芯焊丝及其制备与应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009190042A (ja) 2008-02-12 2009-08-27 Nippon Steel & Sumikin Welding Co Ltd ２電極すみ肉ガスシールドアーク溶接方法
JP2012218065A (ja) * 2011-04-13 2012-11-12 Nippon Steel & Sumikin Welding Co Ltd ２電極水平すみ肉ｃｏ２ガスシールドアーク溶接用フラックス入りワイヤ

Also Published As

Publication number Publication date
JP2014184481A (ja) 2014-10-02
JP6085205B2 (ja) 2017-02-22
CN110153593A (zh) 2019-08-23
CN104070305A (zh) 2014-10-01
KR20140116821A (ko) 2014-10-06

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