KR101596098B1 - 인쇄회로기판의 제조방법 - Google Patents

인쇄회로기판의 제조방법 Download PDF

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Publication number
KR101596098B1
KR101596098B1 KR1020130144026A KR20130144026A KR101596098B1 KR 101596098 B1 KR101596098 B1 KR 101596098B1 KR 1020130144026 A KR1020130144026 A KR 1020130144026A KR 20130144026 A KR20130144026 A KR 20130144026A KR 101596098 B1 KR101596098 B1 KR 101596098B1
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KR
South Korea
Prior art keywords
base substrate
photosensitive resist
resist film
conductive
film
Prior art date
Application number
KR1020130144026A
Other languages
English (en)
Korean (ko)
Other versions
KR20150061108A (ko
Inventor
정광춘
윤광백
한영구
Original Assignee
주식회사 잉크테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Priority to KR1020130144026A priority Critical patent/KR101596098B1/ko
Priority to CN201410688274.4A priority patent/CN104661439B/zh
Publication of KR20150061108A publication Critical patent/KR20150061108A/ko
Application granted granted Critical
Publication of KR101596098B1 publication Critical patent/KR101596098B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
KR1020130144026A 2013-11-25 2013-11-25 인쇄회로기판의 제조방법 KR101596098B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020130144026A KR101596098B1 (ko) 2013-11-25 2013-11-25 인쇄회로기판의 제조방법
CN201410688274.4A CN104661439B (zh) 2013-11-25 2014-11-25 印刷电路板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130144026A KR101596098B1 (ko) 2013-11-25 2013-11-25 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20150061108A KR20150061108A (ko) 2015-06-04
KR101596098B1 true KR101596098B1 (ko) 2016-02-29

Family

ID=53251995

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130144026A KR101596098B1 (ko) 2013-11-25 2013-11-25 인쇄회로기판의 제조방법

Country Status (2)

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KR (1) KR101596098B1 (zh)
CN (1) CN104661439B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170309565A1 (en) * 2016-04-25 2017-10-26 Infineon Technologies Ag Method of manufacturing semiconductor devices
JP6961453B2 (ja) * 2017-10-13 2021-11-05 キヤノン株式会社 貫通基板の加工方法および液体吐出ヘッドの製造方法
CN112689391B (zh) * 2020-10-21 2022-08-19 高绍兵 一种单层线路板与多层线路板制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114286A (ja) 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095117A (en) * 1963-12-26 1967-12-13 Matsushita Electric Ind Co Ltd Method of making printed circuit board
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPH01303789A (ja) * 1988-06-01 1989-12-07 Hitachi Ltd セラミック配線基板の部分厚付け金被覆膜形成方法
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
KR100922810B1 (ko) * 2007-12-11 2009-10-21 주식회사 잉크테크 흑화 전도성 패턴의 제조방법
KR20100029431A (ko) * 2008-09-08 2010-03-17 삼성전기주식회사 양면 인쇄회로기판 제조방법
KR20120003458A (ko) * 2009-04-24 2012-01-10 스미토모 덴키 고교 가부시키가이샤 프린트 배선판용 기판, 프린트 배선판, 및 그들의 제조방법
KR101505049B1 (ko) * 2012-01-04 2015-04-07 주식회사 잉크테크 양면 인쇄회로기판의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114286A (ja) 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法

Also Published As

Publication number Publication date
CN104661439A (zh) 2015-05-27
CN104661439B (zh) 2018-02-02
KR20150061108A (ko) 2015-06-04

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