KR101570732B1 - 화학-기계적 평탄화 패드 - Google Patents

화학-기계적 평탄화 패드 Download PDF

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Publication number
KR101570732B1
KR101570732B1 KR1020107015202A KR20107015202A KR101570732B1 KR 101570732 B1 KR101570732 B1 KR 101570732B1 KR 1020107015202 A KR1020107015202 A KR 1020107015202A KR 20107015202 A KR20107015202 A KR 20107015202A KR 101570732 B1 KR101570732 B1 KR 101570732B1
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South Korea
Prior art keywords
chemical agent
polishing pad
polishing
chemical
polyvinyl alcohol
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KR1020107015202A
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English (en)
Korean (ko)
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KR20100110325A (ko
Inventor
오스카 케이. 수
폴 르페브르
마크 씨. 진
존 에릭 알데보흐
데이비드 아담 웰스
Original Assignee
에프엔에스테크 주식회사
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Publication of KR101570732B1 publication Critical patent/KR101570732B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020107015202A 2007-12-31 2008-12-31 화학-기계적 평탄화 패드 Active KR101570732B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1787207P 2007-12-31 2007-12-31
US61/017,872 2007-12-31

Publications (2)

Publication Number Publication Date
KR20100110325A KR20100110325A (ko) 2010-10-12
KR101570732B1 true KR101570732B1 (ko) 2015-11-20

Family

ID=40799064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107015202A Active KR101570732B1 (ko) 2007-12-31 2008-12-31 화학-기계적 평탄화 패드

Country Status (5)

Country Link
US (1) US8172648B2 (enExample)
EP (1) EP2242615A4 (enExample)
JP (1) JP2011508462A (enExample)
KR (1) KR101570732B1 (enExample)
WO (1) WO2009088945A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG173547A1 (en) * 2009-02-12 2011-09-29 Innopad Inc Three-dimensional network in cmp pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2002066908A (ja) * 2000-08-29 2002-03-05 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法

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US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5958288A (en) 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US5759917A (en) 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6503418B2 (en) 1999-11-04 2003-01-07 Advanced Micro Devices, Inc. Ta barrier slurry containing an organic additive
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
JP2002075934A (ja) * 2000-08-29 2002-03-15 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP2003124166A (ja) * 2001-10-18 2003-04-25 Toray Ind Inc 研磨パッドおよびそれを用いた研磨装置及び研磨方法
US6841480B2 (en) * 2002-02-04 2005-01-11 Infineon Technologies Ag Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
KR100741984B1 (ko) * 2006-02-17 2007-07-23 삼성전자주식회사 화학기계적 연마 장치의 연마 패드 및 그의 제조방법
US7754611B2 (en) * 2006-02-28 2010-07-13 Macronix International Co., Ltd. Chemical mechanical polishing process
JP4990543B2 (ja) * 2006-03-23 2012-08-01 富士フイルム株式会社 金属用研磨液

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2002066908A (ja) * 2000-08-29 2002-03-05 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法

Also Published As

Publication number Publication date
US8172648B2 (en) 2012-05-08
JP2011508462A (ja) 2011-03-10
US20090170410A1 (en) 2009-07-02
EP2242615A4 (en) 2013-10-30
KR20100110325A (ko) 2010-10-12
EP2242615A1 (en) 2010-10-27
WO2009088945A1 (en) 2009-07-16

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