JP2011508462A - 化学的機械的平坦化パッド - Google Patents

化学的機械的平坦化パッド Download PDF

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Publication number
JP2011508462A
JP2011508462A JP2010541541A JP2010541541A JP2011508462A JP 2011508462 A JP2011508462 A JP 2011508462A JP 2010541541 A JP2010541541 A JP 2010541541A JP 2010541541 A JP2010541541 A JP 2010541541A JP 2011508462 A JP2011508462 A JP 2011508462A
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Japan
Prior art keywords
pad
chemical agent
polishing
polishing pad
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010541541A
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English (en)
Japanese (ja)
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JP2011508462A5 (enExample
Inventor
オスカー ケイ． ス
ポール ロフェヴル
マーク シー． ジン
ジョン エリック アルデボー
デイヴィッド アダム ウェルズ
Original Assignee
イノパッド，インコーポレイテッド
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Application filed by イノパッド，インコーポレイテッド filed Critical イノパッド，インコーポレイテッド
Publication of JP2011508462A publication Critical patent/JP2011508462A/ja
Publication of JP2011508462A5 publication Critical patent/JP2011508462A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010541541A 2007-12-31 2008-12-31 化学的機械的平坦化パッド Pending JP2011508462A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1787207P 2007-12-31 2007-12-31
PCT/US2008/088669 WO2009088945A1 (en) 2007-12-31 2008-12-31 Chemical-mechanical planarization pad

Publications (2)

Publication Number Publication Date
JP2011508462A true JP2011508462A (ja) 2011-03-10
JP2011508462A5 JP2011508462A5 (enExample) 2012-02-16

Family

ID=40799064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010541541A Pending JP2011508462A (ja) 2007-12-31 2008-12-31 化学的機械的平坦化パッド

Country Status (5)

Country Link
US (1) US8172648B2 (enExample)
EP (1) EP2242615A4 (enExample)
JP (1) JP2011508462A (enExample)
KR (1) KR101570732B1 (enExample)
WO (1) WO2009088945A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012517715A (ja) * 2009-02-12 2012-08-02 イノパッド，インコーポレイテッド Ｃｍｐパッドにおける３次元ネットワーク
JP2020124801A (ja) * 2015-10-16 2020-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2002066908A (ja) * 2000-08-29 2002-03-05 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP2002075934A (ja) * 2000-08-29 2002-03-15 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP2003124166A (ja) * 2001-10-18 2003-04-25 Toray Ind Inc 研磨パッドおよびそれを用いた研磨装置及び研磨方法
US20050153643A1 (en) * 2002-02-04 2005-07-14 Simpson Alexander W. Polyelectrolyte dispensing polishing pad
JP2007537050A (ja) * 2004-05-11 2007-12-20 フロイデンバーグ ノンウォウブンズ 研磨用パッド

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5958288A (en) 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US5759917A (en) 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6503418B2 (en) 1999-11-04 2003-01-07 Advanced Micro Devices, Inc. Ta barrier slurry containing an organic additive
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
KR100741984B1 (ko) * 2006-02-17 2007-07-23 삼성전자주식회사 화학기계적 연마 장치의 연마 패드 및 그의 제조방법
US7754611B2 (en) * 2006-02-28 2010-07-13 Macronix International Co., Ltd. Chemical mechanical polishing process
JP4990543B2 (ja) * 2006-03-23 2012-08-01 富士フイルム株式会社 金属用研磨液

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047357A (ja) * 1999-04-13 2001-02-20 Freudenberg Nonwovens Lp 研磨剤粒子を含むスラリーにより基板を化学機械研磨するために使用される研磨パッド
JP2002066908A (ja) * 2000-08-29 2002-03-05 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP2002075934A (ja) * 2000-08-29 2002-03-15 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
JP2003124166A (ja) * 2001-10-18 2003-04-25 Toray Ind Inc 研磨パッドおよびそれを用いた研磨装置及び研磨方法
US20050153643A1 (en) * 2002-02-04 2005-07-14 Simpson Alexander W. Polyelectrolyte dispensing polishing pad
JP2007537050A (ja) * 2004-05-11 2007-12-20 フロイデンバーグ ノンウォウブンズ 研磨用パッド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012517715A (ja) * 2009-02-12 2012-08-02 イノパッド，インコーポレイテッド Ｃｍｐパッドにおける３次元ネットワーク
JP2020124801A (ja) * 2015-10-16 2020-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置
JP7009542B2 (ja) 2015-10-16 2022-01-25 アプライド マテリアルズ インコーポレイテッド 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置

Also Published As

Publication number Publication date
US8172648B2 (en) 2012-05-08
US20090170410A1 (en) 2009-07-02
EP2242615A4 (en) 2013-10-30
KR101570732B1 (ko) 2015-11-20
KR20100110325A (ko) 2010-10-12
EP2242615A1 (en) 2010-10-27
WO2009088945A1 (en) 2009-07-16

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