KR101570626B1 - 웨이퍼 센터 검색 방법 - Google Patents

웨이퍼 센터 검색 방법 Download PDF

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Publication number
KR101570626B1
KR101570626B1 KR1020147005807A KR20147005807A KR101570626B1 KR 101570626 B1 KR101570626 B1 KR 101570626B1 KR 1020147005807 A KR1020147005807 A KR 1020147005807A KR 20147005807 A KR20147005807 A KR 20147005807A KR 101570626 B1 KR101570626 B1 KR 101570626B1
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KR
South Korea
Prior art keywords
wafer
sensors
way
sensor
robot
Prior art date
Application number
KR1020147005807A
Other languages
English (en)
Korean (ko)
Other versions
KR20140042925A (ko
Inventor
크리스 키리
피터 반 데 뮬렌
패트릭 디. 패니즈
포레스트 부잔
폴 이. 포겔
Original Assignee
블루쉬프트 테크놀로지스, 인코포레이티드.
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Application filed by 블루쉬프트 테크놀로지스, 인코포레이티드. filed Critical 블루쉬프트 테크놀로지스, 인코포레이티드.
Publication of KR20140042925A publication Critical patent/KR20140042925A/ko
Application granted granted Critical
Publication of KR101570626B1 publication Critical patent/KR101570626B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Element Separation (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
KR1020147005807A 2006-03-05 2007-03-05 웨이퍼 센터 검색 방법 KR101570626B1 (ko)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US77947806P 2006-03-05 2006-03-05
US77968406P 2006-03-05 2006-03-05
US77946306P 2006-03-05 2006-03-05
US77960906P 2006-03-05 2006-03-05
US77970706P 2006-03-05 2006-03-05
US60/779,684 2006-03-05
US60/779,707 2006-03-05
US60/779,478 2006-03-05
US60/779,463 2006-03-05
US60/779,609 2006-03-05
US78483206P 2006-03-21 2006-03-21
US60/784,832 2006-03-21
US74616306P 2006-05-01 2006-05-01
US60/746,163 2006-05-01
US80718906P 2006-07-12 2006-07-12
US60/807,189 2006-07-12
US82345406P 2006-08-24 2006-08-24
US60/823,454 2006-08-24
PCT/US2007/063345 WO2007103896A2 (fr) 2006-03-05 2007-03-05 Procedes pour identifier le centre d'une plaquette.

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020087024330A Division KR20080111036A (ko) 2006-03-05 2007-03-05 웨이퍼 센터 검색 방법

Publications (2)

Publication Number Publication Date
KR20140042925A KR20140042925A (ko) 2014-04-07
KR101570626B1 true KR101570626B1 (ko) 2015-11-19

Family

ID=39494162

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020087024330A KR20080111036A (ko) 2006-03-05 2007-03-05 웨이퍼 센터 검색 방법
KR1020147005807A KR101570626B1 (ko) 2006-03-05 2007-03-05 웨이퍼 센터 검색 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020087024330A KR20080111036A (ko) 2006-03-05 2007-03-05 웨이퍼 센터 검색 방법

Country Status (4)

Country Link
JP (2) JP5959138B2 (fr)
KR (2) KR20080111036A (fr)
SG (1) SG172675A1 (fr)
WO (3) WO2007103870A2 (fr)

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US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
KR20100137429A (ko) 2008-01-25 2010-12-30 어플라이드 머티어리얼스, 인코포레이티드 입출력 및 챔버 슬릿 밸브를 위한 일체형 로컬 기판 중심 탐지장치를 위한 방법 및 장치
WO2011028597A1 (fr) * 2009-08-26 2011-03-10 Veeco Instruments, Inc. Système de fabrication d'un motif sur des supports d'enregistrement magnétiques
US8406918B2 (en) * 2009-12-21 2013-03-26 WD Media, LLC Master teaching jig
US11587813B2 (en) 2013-12-17 2023-02-21 Brooks Automation Us, Llc Substrate transport apparatus
JP7409800B2 (ja) 2019-08-09 2024-01-09 川崎重工業株式会社 ロボット制御装置、ロボット、及びロボット制御方法
CN110767587B (zh) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
KR102289382B1 (ko) * 2019-12-31 2021-08-12 한국기술교육대학교 산학협력단 반도체 공장용 위치보정방법
US11813757B2 (en) * 2020-10-13 2023-11-14 Applied Materials, Inc. Centerfinding for a process kit or process kit carrier at a manufacturing system
KR20220077384A (ko) 2020-12-02 2022-06-09 에스케이실트론 주식회사 블록 위치 조정장치 및 방법

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JP2002270672A (ja) * 2001-03-09 2002-09-20 Olympus Optical Co Ltd アライメント方法及び基板検査装置
WO2004114739A1 (fr) * 2003-06-24 2004-12-29 Koninklijke Philips Electronics N.V. Methode de deplacement d'un dispositif muni d'un appareil photo a un emplacement voulu au moyen d'un systeme de commande et ledit systeme

Also Published As

Publication number Publication date
SG172675A1 (en) 2011-07-28
WO2007103887A2 (fr) 2007-09-13
JP5689920B2 (ja) 2015-03-25
WO2007103896A3 (fr) 2008-07-10
JP2009529248A (ja) 2009-08-13
JP5959138B2 (ja) 2016-08-02
JP2013231726A (ja) 2013-11-14
WO2007103870A2 (fr) 2007-09-13
WO2007103887A3 (fr) 2008-06-12
KR20140042925A (ko) 2014-04-07
KR20080111036A (ko) 2008-12-22
WO2007103870A3 (fr) 2008-11-27
WO2007103896A2 (fr) 2007-09-13

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