KR101567908B1 - 다이싱 장치, 다이싱 장치 유닛 및 다이싱 방법 - Google Patents
다이싱 장치, 다이싱 장치 유닛 및 다이싱 방법 Download PDFInfo
- Publication number
- KR101567908B1 KR101567908B1 KR1020100032255A KR20100032255A KR101567908B1 KR 101567908 B1 KR101567908 B1 KR 101567908B1 KR 1020100032255 A KR1020100032255 A KR 1020100032255A KR 20100032255 A KR20100032255 A KR 20100032255A KR 101567908 B1 KR101567908 B1 KR 101567908B1
- Authority
- KR
- South Korea
- Prior art keywords
- work
- blade
- dicing
- spindle
- cutting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 118
- 230000007246 mechanism Effects 0.000 claims abstract description 102
- 238000012423 maintenance Methods 0.000 claims abstract description 33
- 238000003754 machining Methods 0.000 claims abstract description 31
- 238000012546 transfer Methods 0.000 claims description 19
- 239000003595 mist Substances 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 28
- 235000012431 wafers Nutrition 0.000 description 27
- 238000005259 measurement Methods 0.000 description 12
- 238000012790 confirmation Methods 0.000 description 11
- 238000005498 polishing Methods 0.000 description 11
- 238000005461 lubrication Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000003921 oil Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007514 turning Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009107128 | 2009-04-24 | ||
JPJP-P-2009-107128 | 2009-04-24 | ||
JP2010027799A JP5495832B2 (ja) | 2009-04-24 | 2010-02-10 | ダイシング装置、ダイシング装置ユニット及びダイシング方法 |
JPJP-P-2010-027799 | 2010-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100117510A KR20100117510A (ko) | 2010-11-03 |
KR101567908B1 true KR101567908B1 (ko) | 2015-11-10 |
Family
ID=42995310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100032255A KR101567908B1 (ko) | 2009-04-24 | 2010-04-08 | 다이싱 장치, 다이싱 장치 유닛 및 다이싱 방법 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101567908B1 (zh) |
CN (1) | CN101870142B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5802072B2 (ja) * | 2011-07-26 | 2015-10-28 | 株式会社岡本工作機械製作所 | 円筒状インゴットブロックを四角柱状ブロックに加工する切断方法 |
JP6600267B2 (ja) * | 2016-03-15 | 2019-10-30 | 株式会社ディスコ | 被加工物の切削方法 |
JP6490158B2 (ja) * | 2017-07-19 | 2019-03-27 | ファナック株式会社 | 真直度確認方法 |
JP6938087B2 (ja) * | 2017-09-21 | 2021-09-22 | 株式会社ディスコ | 切削ブレードの装着機構 |
CN108400208B (zh) * | 2018-03-22 | 2019-01-29 | 上海雅宸照明电器有限公司 | 一种半导体发光二极管制作设备 |
CN108461585B (zh) * | 2018-03-22 | 2019-02-15 | 佛山市安林电子有限公司 | 一种半导体发光二极管制作设备 |
CN109333284B (zh) * | 2018-10-23 | 2024-04-05 | 福建冠维汽车零部件有限公司 | 差速器十字轴轴颈自动磨床 |
CN110854011A (zh) * | 2019-09-30 | 2020-02-28 | 芯盟科技有限公司 | 堆叠键合晶圆的处理方法 |
CN114571616A (zh) * | 2022-02-18 | 2022-06-03 | 华虹半导体(无锡)有限公司 | 晶片去环装置和去环方法 |
CN114953230A (zh) * | 2022-06-30 | 2022-08-30 | 青岛高测科技股份有限公司 | 一种多线切割机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003124155A (ja) | 2001-10-12 | 2003-04-25 | Disco Abrasive Syst Ltd | 切削装置 |
JP2003163178A (ja) | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2008112884A (ja) | 2006-10-31 | 2008-05-15 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4083351A (en) * | 1977-01-21 | 1978-04-11 | Harold Jack Greenspan | Fluted diamond drill |
JP3485816B2 (ja) * | 1998-12-09 | 2004-01-13 | 太陽誘電株式会社 | ダイシング装置 |
WO2005037509A1 (ja) * | 2003-10-16 | 2005-04-28 | Neomax Co., Ltd. | ワーク切断装置およびワーク切断方法 |
CN1807012A (zh) * | 2005-01-19 | 2006-07-26 | 顺心企业股份有限公司 | 具工件交换台的加工机 |
-
2010
- 2010-04-08 KR KR1020100032255A patent/KR101567908B1/ko active IP Right Grant
- 2010-04-21 CN CN201010153303.9A patent/CN101870142B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003124155A (ja) | 2001-10-12 | 2003-04-25 | Disco Abrasive Syst Ltd | 切削装置 |
JP2003163178A (ja) | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP3765265B2 (ja) | 2001-11-28 | 2006-04-12 | 株式会社東京精密 | ダイシング装置 |
JP2008112884A (ja) | 2006-10-31 | 2008-05-15 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101870142B (zh) | 2015-04-01 |
KR20100117510A (ko) | 2010-11-03 |
CN101870142A (zh) | 2010-10-27 |
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