KR101545372B1 - 무한 길이 웨브의 연속 소결 방법 - Google Patents

무한 길이 웨브의 연속 소결 방법 Download PDF

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Publication number
KR101545372B1
KR101545372B1 KR1020107028184A KR20107028184A KR101545372B1 KR 101545372 B1 KR101545372 B1 KR 101545372B1 KR 1020107028184 A KR1020107028184 A KR 1020107028184A KR 20107028184 A KR20107028184 A KR 20107028184A KR 101545372 B1 KR101545372 B1 KR 101545372B1
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South Korea
Prior art keywords
web
roll
delete delete
metal
shell
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Expired - Fee Related
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KR1020107028184A
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English (en)
Korean (ko)
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KR20110021895A (ko
Inventor
다니엘 제이 테이스
브라이언 케이 넬슨
제임스 엔 도브스
사무엘 키단
로날드 피 스완슨
다니엘 에이치 칼슨
그랜트 에프 티펜브룩
칼 케이 스텐스바드
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20110021895A publication Critical patent/KR20110021895A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1020107028184A 2008-05-20 2009-05-20 무한 길이 웨브의 연속 소결 방법 Expired - Fee Related KR101545372B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5452208P 2008-05-20 2008-05-20
US61/054,522 2008-05-20

Publications (2)

Publication Number Publication Date
KR20110021895A KR20110021895A (ko) 2011-03-04
KR101545372B1 true KR101545372B1 (ko) 2015-08-18

Family

ID=40873419

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028184A Expired - Fee Related KR101545372B1 (ko) 2008-05-20 2009-05-20 무한 길이 웨브의 연속 소결 방법

Country Status (6)

Country Link
US (1) US8720052B2 (enExample)
EP (1) EP2298047B1 (enExample)
JP (1) JP2011521476A (enExample)
KR (1) KR101545372B1 (enExample)
CN (1) CN102037794B (enExample)
WO (1) WO2009143206A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2729308B1 (en) 2011-06-30 2017-10-11 3M Innovative Properties Company Apparatus and method for microcontact printing on indefinite length webs
RU2586956C2 (ru) * 2011-11-22 2016-06-10 Пикосан Ой Реактор атомно-слоевого осаждения для обработки партии подложек и способ обработки партии подложек
FI125906B (en) 2012-01-30 2016-03-31 Stora Enso Oyj A method and arrangement for transferring electrically conductive material in fluid form onto a printable substrate
BR112016010214A2 (pt) 2013-11-06 2017-08-08 3M Innovative Properties Co ?estampas de impressão por microcontato com características funcionais?
SE539800C2 (en) * 2015-05-26 2017-12-05 Stora Enso Oyj Method and arrangement for producing electrically conductive patterns on substrates
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
CN114829986B (zh) 2019-12-02 2025-05-16 3M创新有限公司 光学超表面膜
EP4084913B1 (en) * 2019-12-31 2024-02-28 3M Innovative Properties Company Die coating on air supported shell

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006506784A (ja) 2002-11-15 2006-02-23 ヴィー・エー・テー・オートモーティヴ・システムス・アクチェンゲゼルシャフト 被覆された導体と導体が形成されるヒータ
JP2006295141A (ja) 2005-04-07 2006-10-26 Samsung Electronics Co Ltd 加熱装置及びその駆動方法
JP2006328479A (ja) * 2005-05-26 2006-12-07 Sumitomo Metal Mining Co Ltd 巻取式複合真空表面処理装置及びフィルムの表面処理方法

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US2914996A (en) * 1953-06-03 1959-12-01 Sprague Electric Co Electrostatic unit for producing printed circuits
US3519253A (en) * 1966-10-11 1970-07-07 Xerox Corp Selective xerographic fuser
US3529129A (en) * 1968-02-23 1970-09-15 Xerox Corp Reflection type flash fuser
US3944783A (en) * 1974-10-18 1976-03-16 Xerox Corporation High efficiency non-cavity radiant method and apparatus
NL7510463A (nl) * 1975-09-05 1977-03-08 Akzo Nv Inrichting en werkwijze voor het verwarmen van draden, alsmede aldus behandelde draden.
US4444487A (en) * 1979-07-02 1984-04-24 Xerox Corporation Multiple-flash fuser
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
JPS5750427A (en) * 1980-09-12 1982-03-24 Ushio Inc Annealing device and annealing method
DE4117388C2 (de) * 1991-05-28 1994-04-28 Koenig & Bauer Ag Walze zum Führen einer Warenbahn
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
JPH09127810A (ja) * 1995-10-27 1997-05-16 Minolta Co Ltd 誘導加熱定着装置
JP3720152B2 (ja) * 1996-10-16 2005-11-24 トクデン株式会社 誘導発熱ローラ装置
GB2319583B (en) * 1996-11-25 1999-09-22 Ricoh Kk Device with induction heating roller
US6641513B1 (en) * 1999-04-09 2003-11-04 Martin Automatic Inc. Web-handling roller
US6725010B1 (en) * 1999-05-10 2004-04-20 Xerox Corporation Fusing apparatus having an induction heated fuser roller
JP3515095B2 (ja) * 1999-12-28 2004-04-05 東芝テック株式会社 加熱ローラを誘導加熱して記録媒体上の現像剤像を定着させる定着装置を有する画像形成装置
JP3578976B2 (ja) * 2000-06-21 2004-10-20 トクデン株式会社 誘導発熱ローラ装置
JP2002210510A (ja) * 2001-01-15 2002-07-30 Mitsubishi Heavy Ind Ltd 圧延ロールの誘導加熱装置および誘導加熱方法
US7194234B2 (en) * 2001-11-01 2007-03-20 Matsushita Electric Industrial Co., Ltd. Electromagnetic induction heat generating roller, heating device, and image forming apparatus
US6933479B2 (en) * 2002-03-27 2005-08-23 Harison Toshiba Lighting Corp. Induction heating roller apparatus and image formation apparatus
BR0318165A (pt) * 2003-03-05 2006-02-21 Intune Circuits Oy método para fabricar um padrão eletricamente condutor
US20070215039A1 (en) * 2006-03-14 2007-09-20 Chuck Edwards Roll-to-roll manufacturing of electronic and optical materials
CN101039532A (zh) * 2007-03-07 2007-09-19 潍坊共达电讯有限公司 耐回流焊驻极体传声器pcb加厚焊盘及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006506784A (ja) 2002-11-15 2006-02-23 ヴィー・エー・テー・オートモーティヴ・システムス・アクチェンゲゼルシャフト 被覆された導体と導体が形成されるヒータ
JP2006295141A (ja) 2005-04-07 2006-10-26 Samsung Electronics Co Ltd 加熱装置及びその駆動方法
JP2006328479A (ja) * 2005-05-26 2006-12-07 Sumitomo Metal Mining Co Ltd 巻取式複合真空表面処理装置及びフィルムの表面処理方法

Also Published As

Publication number Publication date
US8720052B2 (en) 2014-05-13
EP2298047A1 (en) 2011-03-23
WO2009143206A1 (en) 2009-11-26
CN102037794A (zh) 2011-04-27
US20110067234A1 (en) 2011-03-24
CN102037794B (zh) 2013-02-13
JP2011521476A (ja) 2011-07-21
EP2298047B1 (en) 2020-02-05
KR20110021895A (ko) 2011-03-04

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