CN102037794B - 在不定长幅材上连续烧结的方法 - Google Patents

在不定长幅材上连续烧结的方法 Download PDF

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Publication number
CN102037794B
CN102037794B CN2009801186522A CN200980118652A CN102037794B CN 102037794 B CN102037794 B CN 102037794B CN 2009801186522 A CN2009801186522 A CN 2009801186522A CN 200980118652 A CN200980118652 A CN 200980118652A CN 102037794 B CN102037794 B CN 102037794B
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CN
China
Prior art keywords
web
conductive pattern
reel
heat
patterning
Prior art date
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Expired - Fee Related
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CN2009801186522A
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English (en)
Chinese (zh)
Other versions
CN102037794A (zh
Inventor
丹尼尔·J·泰斯
布赖恩·K·纳尔逊
詹姆斯·N·多布斯
塞缪尔·基达内
罗纳德·P·斯万松
丹尼尔·H·卡尔森
格兰特·F·蒂芬布鲁克
卡尔·K·斯腾斯瓦德
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN102037794A publication Critical patent/CN102037794A/zh
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Publication of CN102037794B publication Critical patent/CN102037794B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CN2009801186522A 2008-05-20 2009-05-20 在不定长幅材上连续烧结的方法 Expired - Fee Related CN102037794B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5452208P 2008-05-20 2008-05-20
US61/054,522 2008-05-20
PCT/US2009/044603 WO2009143206A1 (en) 2008-05-20 2009-05-20 Method for continuous sintering on indefinite length webs

Publications (2)

Publication Number Publication Date
CN102037794A CN102037794A (zh) 2011-04-27
CN102037794B true CN102037794B (zh) 2013-02-13

Family

ID=40873419

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801186522A Expired - Fee Related CN102037794B (zh) 2008-05-20 2009-05-20 在不定长幅材上连续烧结的方法

Country Status (6)

Country Link
US (1) US8720052B2 (enExample)
EP (1) EP2298047B1 (enExample)
JP (1) JP2011521476A (enExample)
KR (1) KR101545372B1 (enExample)
CN (1) CN102037794B (enExample)
WO (1) WO2009143206A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101937511B1 (ko) 2011-06-30 2019-01-10 쓰리엠 이노베이티브 프로퍼티즈 캄파니 무한 길이 웨브 상에 미세접촉 인쇄하기 위한 장치 및 방법
US20140335267A1 (en) * 2011-11-22 2014-11-13 Picosun Oy Atomic layer deposition reactor for processing a batch of substrates and method thereof
FI125906B (en) * 2012-01-30 2016-03-31 Stora Enso Oyj A method and arrangement for transferring electrically conductive material in fluid form onto a printable substrate
WO2015069538A1 (en) 2013-11-06 2015-05-14 3M Innovative Properties Company Microcontact printing stamps with functional features
SE539800C2 (en) * 2015-05-26 2017-12-05 Stora Enso Oyj Method and arrangement for producing electrically conductive patterns on substrates
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
JP2023503697A (ja) 2019-12-02 2023-01-31 スリーエム イノベイティブ プロパティズ カンパニー 光メタ表面膜
US11865571B2 (en) 2019-12-31 2024-01-09 3M Innovative Properties Company Die coating on air supported shell

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101039532A (zh) * 2007-03-07 2007-09-19 潍坊共达电讯有限公司 耐回流焊驻极体传声器pcb加厚焊盘及其制造方法

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US2914996A (en) * 1953-06-03 1959-12-01 Sprague Electric Co Electrostatic unit for producing printed circuits
US3519253A (en) * 1966-10-11 1970-07-07 Xerox Corp Selective xerographic fuser
US3529129A (en) * 1968-02-23 1970-09-15 Xerox Corp Reflection type flash fuser
US3944783A (en) * 1974-10-18 1976-03-16 Xerox Corporation High efficiency non-cavity radiant method and apparatus
NL7510463A (nl) * 1975-09-05 1977-03-08 Akzo Nv Inrichting en werkwijze voor het verwarmen van draden, alsmede aldus behandelde draden.
US4444487A (en) * 1979-07-02 1984-04-24 Xerox Corporation Multiple-flash fuser
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
JPS5750427A (en) * 1980-09-12 1982-03-24 Ushio Inc Annealing device and annealing method
DE9116251U1 (de) * 1991-05-28 1992-07-16 Koenig & Bauer AG, 8700 Würzburg Walze zum Führen einer Warenbahn
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
JPH09127810A (ja) * 1995-10-27 1997-05-16 Minolta Co Ltd 誘導加熱定着装置
JP3720152B2 (ja) * 1996-10-16 2005-11-24 トクデン株式会社 誘導発熱ローラ装置
GB2319583B (en) * 1996-11-25 1999-09-22 Ricoh Kk Device with induction heating roller
WO2000061481A1 (en) * 1999-04-09 2000-10-19 Martin Automatic Inc. Improved web-handling roller
US6725010B1 (en) * 1999-05-10 2004-04-20 Xerox Corporation Fusing apparatus having an induction heated fuser roller
WO2001048558A1 (fr) * 1999-12-28 2001-07-05 Toshiba Tec Kabushiki Kaisha Appareil de formation d'image comportant un dispositif pour fixer du revelateur sur un support d'enregistrement par chauffage par induction d'un rouleau chauffant
JP3578976B2 (ja) * 2000-06-21 2004-10-20 トクデン株式会社 誘導発熱ローラ装置
JP2002210510A (ja) * 2001-01-15 2002-07-30 Mitsubishi Heavy Ind Ltd 圧延ロールの誘導加熱装置および誘導加熱方法
US7194234B2 (en) * 2001-11-01 2007-03-20 Matsushita Electric Industrial Co., Ltd. Electromagnetic induction heat generating roller, heating device, and image forming apparatus
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EP1639871B1 (en) * 2003-03-05 2010-07-14 Intune Circuits Oy Method for manufacturing an electrically conductive pattern
KR20060107048A (ko) 2005-04-07 2006-10-13 삼성전자주식회사 가열장치 및 그 구동방법
JP2006328479A (ja) * 2005-05-26 2006-12-07 Sumitomo Metal Mining Co Ltd 巻取式複合真空表面処理装置及びフィルムの表面処理方法
US20070215039A1 (en) * 2006-03-14 2007-09-20 Chuck Edwards Roll-to-roll manufacturing of electronic and optical materials

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CN101039532A (zh) * 2007-03-07 2007-09-19 潍坊共达电讯有限公司 耐回流焊驻极体传声器pcb加厚焊盘及其制造方法

Also Published As

Publication number Publication date
KR101545372B1 (ko) 2015-08-18
US20110067234A1 (en) 2011-03-24
US8720052B2 (en) 2014-05-13
EP2298047A1 (en) 2011-03-23
WO2009143206A1 (en) 2009-11-26
JP2011521476A (ja) 2011-07-21
KR20110021895A (ko) 2011-03-04
EP2298047B1 (en) 2020-02-05
CN102037794A (zh) 2011-04-27

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Granted publication date: 20130213

Termination date: 20210520