CN104770071B - 用于功能印刷系统的方法 - Google Patents
用于功能印刷系统的方法 Download PDFInfo
- Publication number
- CN104770071B CN104770071B CN201380059493.XA CN201380059493A CN104770071B CN 104770071 B CN104770071 B CN 104770071B CN 201380059493 A CN201380059493 A CN 201380059493A CN 104770071 B CN104770071 B CN 104770071B
- Authority
- CN
- China
- Prior art keywords
- substrate
- imaging
- imaging region
- functional material
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000003384 imaging method Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims abstract 2
- 238000001931 thermography Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052729 chemical element Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- -1 trimethoxy mercapto propyl Chemical group 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000002107 myocardial effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000250 revascularization Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- GUGNSJAORJLKGP-UHFFFAOYSA-K sodium 8-methoxypyrene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].C1=C2C(OC)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 GUGNSJAORJLKGP-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
- C23C18/182—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1868—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
一种用于在衬底(208)上形成导电图案的方法,包括:在衬底上提供用于成像的图像图案;使图像图案成像于衬底,从而形成成像区域;在衬底上喷射功能材料(232),衬底使功能材料的分子扩散进入成像区域;以及在衬底上的成像区域内应用构造出导电材料迹线的非电解铜涂层。
Description
技术领域
本发明涉及用于功能印刷的方法,该方法利用计算机直接制版成像技术。
背景技术
功能印刷是这样一类印刷,其利用商用印刷设备来印刷具有一定功能的电路或电子设备,该功能不同于信息的视觉显示或者是在信息的视觉显示以外新增的功能。印刷电路的例子可以是在包装或产品上印刷射频标识(RFID)。另一个例子可以是在包装上印刷电子线路,当打开包装时,该电子线路能够产生音乐片段。
有几种在衬底上印刷功能图案的方法,包括直接印刷功能墨水。其它的技术利用照相平版印刷术来掩蔽和去除预沉积的功能层。
发明内容
简而言之,按照本发明的一个方面,基于温度差异,利用特定的衬底特性将功能材料的图案沉积在表面。由于衬底的温度在某个位置上升,使得化学元素更快地扩散,或者使得化学元素附着到衬底的表面。有种方法是利用热写入设备(例如激光写入头、热转印写入头)在衬底上形成热图案,该热图案与化学环境相组合,在衬底上形成功能化学迹线的图案。该图案可用于各种应用,例如形成用于印刷制程的亲水性/疏水性区域。另一种用途是形成可用于诸如铜之类的金属的非电解沉积的催化剂材料的图案并由此在衬底上制造铜的迹线。
功能材料的精确沉积是需要的。激光成像或热转印的使用意味着在衬底上与被施加在成像区域的喷射材料(例如气体)的组合。气体分子向激光加热的衬底扩散,从而在气体与沉积于衬底表面的材料之间形成化学合成物。气体被称之为功能气体并且在例如用于形成导电线路的衬底上形成迹线的化合物。
在下面呈现的对优选实施例的详细描述中,本发明及其目标和优点将变得更为明显。
附图说明
图1以示意形式表示驱动成像设备的现有技术数字前端;
图2以示意形式表示这里所公开的成像系统;以及
图3以示意形式表示按照本发明的在图案化衬底上应用的非电解涂层机器设备。
具体实施方式
本发明将特别针对构成按照本发明的装置的一部分的单元,或者特别针对与按照本发明的装置更为直接地协同工作的单元。应该理解的是,未特别示出或描述的单元可采用本领域内技术人员熟知的各种形式。
虽然本发明的描述是与多个实施例中的其中一个相联系的,但是应该理解的是,其目的不是将本发明限定于该实施例。相反,其目的是涵盖由所附权利要求覆盖的替换、修改和等同形式。
图1示出了制版成像设备108。成像设备由数字前端(DFE)104驱动。DFE从桌面出版(DTP)系统(未画出)接收数字形式的成像数据,并且呈现用于成像的数字信息。所呈现的信息和成像设备控制数据经接口线路112,在DFE 104与成像设备108之间传送。
图2示出了成像系统200。成像系统200包括成像滑架212,材料喷射单元224连同热成像头220安装其上。喷射的材料可以采用气体的形态。热成像头220可基于热转印装置或激光成像单元。热成像头220被设计为工作在与衬底208特性相匹配的波长上。成像头220被配置为在安装于转动柱体204的衬底208上成像。滑架212适于在行进螺杆216引导下,基本上平行于柱体204移动。控制器228控制成像头220的图案化制程和材料从材料喷射单元224的发射。能够在平坦表面上成像的计算机直接制版设备(未画出)被称为绞盘设备,其也可以用于同样的目的。内部鼓CTP(未画出)配置同样可以与本发明结合使用。
诸如玻璃、金属和各种聚合物材料之类的衬底208被安装在柱体204上。根据所应用的特定制程,材料喷射单元224在衬底208附近散开材料。可以在激光曝光之前、期间或之后应用材料散开的操作。成像头220将根据从DFE 104接收的数据,在衬底208上对图案进行成像。CTP成像头220将提升衬底208的温度或者以光化学方式使成像区域内的衬底表面改性,从而使功能喷射材料232的分子高效率地扩散进入/结合进入衬底208的过程得以实现。因此,由成像头220形成的图案在衬底208上诱发掺杂图案。例如,近IR(NIR)成像头可以用于当施加诸如三甲氧基巯丙基硅烷(MPTS)之类的催化剂气体或钯精细粉末从而在衬底208上形成催化剂掺杂的迹线时,在专门吸收NIR的聚对苯二甲酸乙二醇酯(PET)衬底上成像。
当在衬底208上完成所需的图案化之后,执行标准的非电解涂层制程以在衬底208上,利用诸如图3所示的非电解涂层机器设备构造材料迹线,诸如铜迹线、银迹线或镍迹线。这些铜迹线将构成由CTP成像头220制作的图案(参见Yinxiang Lu, Qian Liang,Longlong Xue,应用表面科学,第258卷第10期,2012年3月1日,第4782-4787页)。
假设衬底的热容量和密度分别为~1.2Jg-1K-1和1.37gcm-3并且假设需要10微米的渗透深度,则为使衬底208增加1K的温度,将需要1.644mJ/cm2左右的能量。因此,为了达到100K的温度,将需要164mJ/cm2的增加量,该增加量在当前的CTP设备的工作范围内。
图案化分辨率由CTP成像头220的分辨率和诸如热传导率之类的衬底208的特性确定。
部件列表
104 数字前端(DFE)
108 成像设备
112 接口线路
200 成像系统
204 转动柱体
208 成像衬底
212 滑架
216 螺杆
220 热成像头
224 材料喷射单元
228 控制器
232 喷射材料
Claims (5)
1.一种用于在衬底上形成导电图案的方法,包括:
在所述衬底上提供用于成像的图像图案;
在所述衬底上按照所述图像图案应用热成像,从而形成具有升高的温度的成像区域;
在所述衬底上喷射功能材料,其中,所述成像区域的升高的温度使所述功能材料的分子扩散进入所述成像区域;以及
在所述衬底上的所述成像区域内应用构造出导电材料迹线的非电解铜涂层。
2.根据权利要求1的方法,其中,所述功能材料在所述成像期间被施加。
3.根据权利要求1的方法,其中,所述功能材料在所述成像之后被施加。
4.根据权利要求1的方法,其中,所述功能材料在所述成像之前被施加。
5.根据权利要求1的方法,其中,所述功能材料为气体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/676464 | 2012-11-14 | ||
US13/676,464 US8795788B2 (en) | 2012-11-14 | 2012-11-14 | Method for functional printing system |
PCT/US2013/069813 WO2014078361A1 (en) | 2012-11-14 | 2013-11-13 | Method for functional printing system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104770071A CN104770071A (zh) | 2015-07-08 |
CN104770071B true CN104770071B (zh) | 2017-11-17 |
Family
ID=49766149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380059493.XA Expired - Fee Related CN104770071B (zh) | 2012-11-14 | 2013-11-13 | 用于功能印刷系统的方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8795788B2 (zh) |
EP (1) | EP2921038A1 (zh) |
CN (1) | CN104770071B (zh) |
WO (1) | WO2014078361A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9072209B2 (en) * | 2012-11-14 | 2015-06-30 | Eastman Kodak Company | Method for forming a conductive pattern |
US20140366805A1 (en) * | 2012-11-14 | 2014-12-18 | Israel Schuster | System for forming a conductive pattern |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822633A (en) * | 1984-01-17 | 1989-04-18 | Inoue Japax Research Incorporated | Auto-selective metal deposition on dielectric surfaces |
US5389496A (en) * | 1987-03-06 | 1995-02-14 | Rohm And Haas Company | Processes and compositions for electroless metallization |
US5580616A (en) * | 1992-12-22 | 1996-12-03 | Director-General Of Agency Of Industrial Science And Technology | Method for surface modifying a fluorocarbonpolymer |
US6261422B1 (en) * | 2000-01-04 | 2001-07-17 | Ionica, Llc | Production of hollowed/channeled protective thermal-barrier coatings functioning as heat-exchangers |
CN1961620A (zh) * | 2004-02-10 | 2007-05-09 | 造型逻辑有限公司 | 金属沉积 |
CN102371757A (zh) * | 2010-07-30 | 2012-03-14 | 精工爱普生株式会社 | 印刷控制装置、印刷装置以及印刷装置的印刷控制方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
US6211073B1 (en) * | 1998-02-27 | 2001-04-03 | Micron Technology, Inc. | Methods for making copper and other metal interconnections in integrated circuits |
DE10009598A1 (de) * | 2000-02-29 | 2001-09-06 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Abscheidung einer Beschichtung auf einem Substrat durch Versprühen einer Flüssigkeit |
US6391528B1 (en) * | 2000-04-03 | 2002-05-21 | 3M Innovative Properties Company | Methods of making wire grid optical elements by preferential deposition of material on a substrate |
US7066463B2 (en) * | 2002-04-08 | 2006-06-27 | Ecrm Incorporated | System and method for sheet transporting using dual capstan rollers |
US7049234B2 (en) * | 2003-12-22 | 2006-05-23 | Intel Corporation | Multiple stage electroless deposition of a metal layer |
US8426749B2 (en) * | 2007-05-09 | 2013-04-23 | Fujifilm Corporation | Electromagnetic shielding film and optical filter |
KR101433899B1 (ko) * | 2008-04-03 | 2014-08-29 | 삼성전자주식회사 | 기판 식각부의 금속층 형성방법 및 이를 이용하여 형성된금속층을 갖는 기판 및 구조물 |
CN103038390B (zh) * | 2010-10-04 | 2015-01-07 | 森邦夫 | 金属膜形成方法及具有金属膜的制品 |
-
2012
- 2012-11-14 US US13/676,464 patent/US8795788B2/en active Active
-
2013
- 2013-11-13 EP EP13805977.9A patent/EP2921038A1/en not_active Withdrawn
- 2013-11-13 WO PCT/US2013/069813 patent/WO2014078361A1/en active Application Filing
- 2013-11-13 CN CN201380059493.XA patent/CN104770071B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822633A (en) * | 1984-01-17 | 1989-04-18 | Inoue Japax Research Incorporated | Auto-selective metal deposition on dielectric surfaces |
US5389496A (en) * | 1987-03-06 | 1995-02-14 | Rohm And Haas Company | Processes and compositions for electroless metallization |
US5580616A (en) * | 1992-12-22 | 1996-12-03 | Director-General Of Agency Of Industrial Science And Technology | Method for surface modifying a fluorocarbonpolymer |
US6261422B1 (en) * | 2000-01-04 | 2001-07-17 | Ionica, Llc | Production of hollowed/channeled protective thermal-barrier coatings functioning as heat-exchangers |
CN1961620A (zh) * | 2004-02-10 | 2007-05-09 | 造型逻辑有限公司 | 金属沉积 |
CN102371757A (zh) * | 2010-07-30 | 2012-03-14 | 精工爱普生株式会社 | 印刷控制装置、印刷装置以及印刷装置的印刷控制方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104770071A (zh) | 2015-07-08 |
US20140134326A1 (en) | 2014-05-15 |
EP2921038A1 (en) | 2015-09-23 |
WO2014078361A1 (en) | 2014-05-22 |
US8795788B2 (en) | 2014-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8747599B2 (en) | Process for making self-patterning substrates and the product thereof | |
US6697694B2 (en) | Apparatus and method for creating flexible circuits | |
CN103025071B (zh) | 用于基底上导电体的形成的系统和方法 | |
JP4763237B2 (ja) | 基板上に導電性電子部品を製造する方法 | |
US8062698B2 (en) | Synthesis of conductive metal markings for chipless RFID applications | |
CN105415882A (zh) | 用于导电元件沉积及形成的方法和设备 | |
CN104347944B (zh) | 一种金属直镀rfid电子标签天线的制作方法 | |
US20060158497A1 (en) | Ink-jet printing of compositionally non-uniform features | |
JP6080054B2 (ja) | パターンの形成方法 | |
CN1235455C (zh) | 生产用于便携式无线电通信装置的天线装置的方法 | |
CN104770071B (zh) | 用于功能印刷系统的方法 | |
KR101371327B1 (ko) | 프린팅 기술을 이용한 적층형 디지타이저 및 이의 제조방법 | |
CN101548587A (zh) | 印刷导电电路的方法 | |
CN101482938B (zh) | 一种无线识别标签的制备方法及其使用的烫印专用膜 | |
US9072209B2 (en) | Method for forming a conductive pattern | |
Hou et al. | Fabrication of user-defined copper conductive patterns onto paper substrate for flexible electronics by combining wax patterning with electroless plating | |
US9096051B1 (en) | Forming printed patterns of multiple print materials | |
US20140130737A1 (en) | Functional printing system | |
CN202782110U (zh) | 形成天线的柔版印刷设备 | |
JP2012077342A (ja) | 金属パターンの形成方法 | |
Cicek et al. | 2D characterisation and evaluation of multi-material structures towards 3D hybrid printing | |
US20140366805A1 (en) | System for forming a conductive pattern | |
CN113226713B (zh) | 增材制造系统、用于产生三维物体的方法和介质 | |
CN103490150B (zh) | 制造天线的方法 | |
Kaye et al. | Bowtie antennas inkjet printed on cylindrical surfaces |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171117 |