CN104770071A - 用于功能印刷系统的方法 - Google Patents

用于功能印刷系统的方法 Download PDF

Info

Publication number
CN104770071A
CN104770071A CN201380059493.XA CN201380059493A CN104770071A CN 104770071 A CN104770071 A CN 104770071A CN 201380059493 A CN201380059493 A CN 201380059493A CN 104770071 A CN104770071 A CN 104770071A
Authority
CN
China
Prior art keywords
substrate
imaging
functional material
pattern
over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201380059493.XA
Other languages
English (en)
Other versions
CN104770071B (zh
Inventor
I.舒斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN104770071A publication Critical patent/CN104770071A/zh
Application granted granted Critical
Publication of CN104770071B publication Critical patent/CN104770071B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/182—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1868—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

一种用于在衬底（208）上形成导电图案的方法，包括：在衬底上提供用于成像的图像图案；使图像图案成像于衬底，从而形成成像区域；在衬底上喷射功能材料（232），衬底使功能材料的分子扩散进入成像区域；以及在衬底上的成像区域内应用构造出导电材料迹线的非电解铜涂层。

Description

用于功能印刷系统的方法
技术领域
本发明涉及用于功能印刷的方法，该方法利用计算机直接制版成像技术。
背景技术
功能印刷是这样一类印刷，其利用商用印刷设备来印刷具有一定功能的电路或电子设备，该功能不同于信息的视觉显示或者是在信息的视觉显示以外新增的功能。印刷电路的例子可以是在包装或产品上印刷射频标识（RFID）。另一个例子可以是在包装上印刷电子线路，当打开包装时，该电子线路能够产生音乐片段。
有几种在衬底上印刷功能图案的方法，包括直接印刷功能墨水。其它的技术利用照相平版印刷术来掩蔽和去除预沉积的功能层。
发明内容
简而言之，按照本发明的一个方面，基于温度差异，利用特定的衬底特性将功能材料的图案沉积在表面。由于衬底的温度在某个位置上升，使得化学元素更快地扩散，或者使得化学元素附着到衬底的表面。有种方法是利用热写入设备（例如激光写入头、热转印写入头）在衬底上形成热图案，该热图案与化学环境相组合，在衬底上形成功能化学迹线的图案。该图案可用于各种应用，例如形成用于印刷制程的亲水性/疏水性区域。另一种用途是形成可用于诸如铜之类的金属的非电解沉积的催化剂材料的图案并由此在衬底上制造铜的迹线。
功能材料的精确沉积是需要的。激光成像或热转印的使用意味着在衬底上与被施加在成像区域的喷射材料（例如气体）的组合。气体分子向激光加热的衬底扩散，从而在气体与沉积于衬底表面的材料之间形成化学合成物。气体被称之为功能气体并且在例如用于形成导电线路的衬底上形成迹线的化合物。
在下面呈现的对优选实施例的详细描述中，本发明及其目标和优点将变得更为明显。
附图说明
图1以示意形式表示驱动成像设备的现有技术数字前端；
图2以示意形式表示这里所公开的成像系统；以及
图3以示意形式表示按照本发明的在图案化衬底上应用的非电解涂层机器设备。
具体实施方式
本发明将特别针对构成按照本发明的装置的一部分的单元，或者特别针对与按照本发明的装置更为直接地协同工作的单元。应该理解的是，未特别示出或描述的单元可采用本领域内技术人员熟知的各种形式。
虽然本发明的描述是与多个实施例中的其中一个相联系的，但是应该理解的是，其目的不是将本发明限定于该实施例。相反，其目的是涵盖由所附权利要求覆盖的替换、修改和等同形式。
图1示出了制版成像设备108。成像设备由数字前端（DFE）104驱动。DFE从桌面出版（DTP）系统（未画出）接收数字形式的成像数据，并且呈现用于成像的数字信息。所呈现的信息和成像设备控制数据经接口线路112，在DFE 104与成像设备108之间传送。
图2示出了成像系统200。成像系统200包括成像滑架212，材料喷射单元224连同热成像头220安装其上。喷射的材料可以采用气体的形态。热成像头220可基于热转印装置或激光成像单元。热成像头220被设计为工作在与衬底208特性相匹配的波长上。成像头220被配置为在安装于转动柱体204的衬底208上成像。滑架212适于在行进螺杆216引导下，基本上平行于柱体204移动。控制器228控制成像头220的图案化制程和材料从材料喷射单元224的发射。能够在平坦表面上成像的计算机直接制版设备（未画出）被称为绞盘设备，其也可以用于同样的目的。内部鼓CTP（未画出）配置同样可以与本发明结合使用。
诸如玻璃、金属和各种聚合物材料之类的衬底208被安装在柱体204上。根据所应用的特定制程，材料喷射单元224在衬底208附近散开材料。可以在激光曝光之前、期间或之后应用材料散开的操作。成像头220将根据从DFE 104接收的数据，在衬底208上对图案进行成像。CTP成像头220将提升衬底208的温度或者以光化学方式使成像区域内的衬底表面改性，从而使功能喷射材料232的分子高效率地扩散进入/结合进入衬底208的过程得以实现。因此，由成像头220形成的图案在衬底208上诱发掺杂图案。例如，近IR（NIR）成像头可以用于当施加诸如三甲氧基巯丙基硅烷（MPTS）之类的催化剂气体或钯精细粉末从而在衬底208上形成催化剂掺杂的迹线时，在专门吸收NIR的聚对苯二甲酸乙二醇酯（PET）衬底上成像。
当在衬底208上完成所需的图案化之后，执行标准的非电解涂层制程以在衬底208上，利用诸如图3所示的非电解涂层机器设备构造材料迹线，诸如铜迹线、银迹线或镍迹线。这些铜迹线将构成由CTP成像头220制作的图案（参见Yinxiang Lu, Qian Liang, Longlong Xue，应用表面科学，第258卷第10期，2012年3月1日，第4782-4787页）。
假设衬底的热容量和密度分别为~1.2Jg -1 K -1 和1.37gcm -3 并且假设需要10微米的渗透深度，则为使衬底208增加1K的温度，将需要1.644mJ/cm 2 左右的能量。因此，为了达到100K的温度，将需要164mJ/cm 2 的增加量，该增加量在当前的CTP设备的工作范围内。
图案化分辨率由CTP成像头220的分辨率和诸如热传导率之类的衬底208的特性确定。
部件列表
104 数字前端（DFE）
108 成像设备
112 接口线路
200 成像系统
204 转动柱体
208 成像衬底
212 滑架
216 螺杆
220 热成像头
224 材料喷射单元
228 控制器
232 喷射材料

Claims (5)

1.一种用于在衬底上形成导电图案的方法，包括：
在所述衬底上提供用于成像的图像图案；
使所述图像图案成像于所述衬底，从而形成成像区域；
在所述衬底上喷射功能材料，所述衬底使所述功能材料的分子扩散进入所述成像区域；以及
在所述衬底上的所述成像区域内应用构造出导电材料迹线的非电解铜涂层。
2.根据权利要求1的方法，其中，所述功能材料在所述成像期间被施加。
3.根据权利要求1的方法，其中，所述功能材料在所述成像之后被施加。
4.根据权利要求1的方法，其中，所述功能材料在所述成像之前被施加。
5.根据权利要求1的方法，其中，所述功能材料为气体。
CN201380059493.XA 2012-11-14 2013-11-13 用于功能印刷系统的方法 Expired - Fee Related CN104770071B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/676464 2012-11-14
US13/676,464 US8795788B2 (en) 2012-11-14 2012-11-14 Method for functional printing system
PCT/US2013/069813 WO2014078361A1 (en) 2012-11-14 2013-11-13 Method for functional printing system

Publications (2)

Publication Number Publication Date
CN104770071A true CN104770071A (zh) 2015-07-08
CN104770071B CN104770071B (zh) 2017-11-17

Family

ID=49766149

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380059493.XA Expired - Fee Related CN104770071B (zh) 2012-11-14 2013-11-13 用于功能印刷系统的方法

Country Status (4)

Country Link
US (1) US8795788B2 (zh)
EP (1) EP2921038A1 (zh)
CN (1) CN104770071B (zh)
WO (1) WO2014078361A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9072209B2 (en) * 2012-11-14 2015-06-30 Eastman Kodak Company Method for forming a conductive pattern
US20140366805A1 (en) * 2012-11-14 2014-12-18 Israel Schuster System for forming a conductive pattern

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822633A (en) * 1984-01-17 1989-04-18 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US5389496A (en) * 1987-03-06 1995-02-14 Rohm And Haas Company Processes and compositions for electroless metallization
US5580616A (en) * 1992-12-22 1996-12-03 Director-General Of Agency Of Industrial Science And Technology Method for surface modifying a fluorocarbonpolymer
US6261422B1 (en) * 2000-01-04 2001-07-17 Ionica, Llc Production of hollowed/channeled protective thermal-barrier coatings functioning as heat-exchangers
US20010026844A1 (en) * 2000-02-29 2001-10-04 Martin Hruschka Method and device for depositing a coating on a substrate by spraying a liquid
US20030188648A1 (en) * 2002-04-08 2003-10-09 Ecrm Inc. System and method for sheet transporting using dual capstan rollers
CN1961620A (zh) * 2004-02-10 2007-05-09 造型逻辑有限公司 金属沉积
US20090126984A1 (en) * 2007-05-09 2009-05-21 Fujifilm Corporation Electromagnetic shielding film and optical filter
CN102371757A (zh) * 2010-07-30 2012-03-14 精工爱普生株式会社 印刷控制装置、印刷装置以及印刷装置的印刷控制方法
WO2012046651A1 (ja) * 2010-10-04 2012-04-12 株式会社いおう化学研究所 金属膜形成方法、及び金属膜を有する製品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
US6211073B1 (en) * 1998-02-27 2001-04-03 Micron Technology, Inc. Methods for making copper and other metal interconnections in integrated circuits
US6391528B1 (en) * 2000-04-03 2002-05-21 3M Innovative Properties Company Methods of making wire grid optical elements by preferential deposition of material on a substrate
US7049234B2 (en) * 2003-12-22 2006-05-23 Intel Corporation Multiple stage electroless deposition of a metal layer
KR101433899B1 (ko) * 2008-04-03 2014-08-29 삼성전자주식회사 기판 식각부의 금속층 형성방법 및 이를 이용하여 형성된금속층을 갖는 기판 및 구조물

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822633A (en) * 1984-01-17 1989-04-18 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US5389496A (en) * 1987-03-06 1995-02-14 Rohm And Haas Company Processes and compositions for electroless metallization
US5580616A (en) * 1992-12-22 1996-12-03 Director-General Of Agency Of Industrial Science And Technology Method for surface modifying a fluorocarbonpolymer
US6261422B1 (en) * 2000-01-04 2001-07-17 Ionica, Llc Production of hollowed/channeled protective thermal-barrier coatings functioning as heat-exchangers
US20010026844A1 (en) * 2000-02-29 2001-10-04 Martin Hruschka Method and device for depositing a coating on a substrate by spraying a liquid
US20030188648A1 (en) * 2002-04-08 2003-10-09 Ecrm Inc. System and method for sheet transporting using dual capstan rollers
CN1961620A (zh) * 2004-02-10 2007-05-09 造型逻辑有限公司 金属沉积
US20090126984A1 (en) * 2007-05-09 2009-05-21 Fujifilm Corporation Electromagnetic shielding film and optical filter
CN102371757A (zh) * 2010-07-30 2012-03-14 精工爱普生株式会社 印刷控制装置、印刷装置以及印刷装置的印刷控制方法
WO2012046651A1 (ja) * 2010-10-04 2012-04-12 株式会社いおう化学研究所 金属膜形成方法、及び金属膜を有する製品

Also Published As

Publication number Publication date
US20140134326A1 (en) 2014-05-15
CN104770071B (zh) 2017-11-17
US8795788B2 (en) 2014-08-05
EP2921038A1 (en) 2015-09-23
WO2014078361A1 (en) 2014-05-22

Similar Documents

Publication Publication Date Title
US6697694B2 (en) Apparatus and method for creating flexible circuits
US7927669B2 (en) Method for applying coatings to surfaces
CN103025071B (zh) 用于基底上导电体的形成的系统和方法
CN105415882B (zh) 用于导电元件沉积及形成的方法和设备
KR102123615B1 (ko) 전도성 부재 배치 및 형성을 위한 방법 및 장치
US8747599B2 (en) Process for making self-patterning substrates and the product thereof
US20160172741A1 (en) Three dimensional sub-mm wavelength sub-thz frequency antennas on flexible and uv-curable dielectric using printed electronic metal traces
CN106211622A (zh) 一种埋入式电路板复合3d打印方法
JP6656102B2 (ja) 塗布装置及び塗布方法
CN1235455C (zh) 生产用于便携式无线电通信装置的天线装置的方法
CN104770071A (zh) 用于功能印刷系统的方法
CN110497708A (zh) 使用喷墨技术来印刷微线图案的方法
EP1496731A1 (en) Fast production method for printed board
US9072209B2 (en) Method for forming a conductive pattern
CN101548587A (zh) 印刷导电电路的方法
KR910001745B1 (ko) 인쇄회로기판 제조방법
US10443131B2 (en) Method of forming patterned metal unit, and patterned article formed with the same
US20140130737A1 (en) Functional printing system
WO2018136036A1 (en) Multi-layered printed circuit board
US20140366805A1 (en) System for forming a conductive pattern
CN108337826B (zh) 一种多层pcb板制作工具及制作方法
CN100591428C (zh) 用于热敏性中等尺度沉积的激光处理
Qin et al. Direct Manufacturing Technology for High‐Precision Follow‐the‐Shape Circuits on Complex, Hard, Curved Surfaces
US20230264415A1 (en) Additive manufacturing of three-dimensional object
CN117769150A (zh) 一种高分辨率曲面共形电路的制造方法及系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171117