KR101538904B1 - 유기무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents

유기무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체 Download PDF

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KR101538904B1
KR101538904B1 KR1020157002171A KR20157002171A KR101538904B1 KR 101538904 B1 KR101538904 B1 KR 101538904B1 KR 1020157002171 A KR1020157002171 A KR 1020157002171A KR 20157002171 A KR20157002171 A KR 20157002171A KR 101538904 B1 KR101538904 B1 KR 101538904B1
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KR
South Korea
Prior art keywords
particles
organic
conductive
group
inorganic hybrid
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KR1020157002171A
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English (en)
Korean (ko)
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KR20150023064A (ko
Inventor
야스유키 야마다
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20150023064A publication Critical patent/KR20150023064A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
KR1020157002171A 2012-12-06 2013-12-03 유기무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체 KR101538904B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012267382 2012-12-06
JPJP-P-2012-267382 2012-12-06
PCT/JP2013/082422 WO2014087984A1 (ja) 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
KR20150023064A KR20150023064A (ko) 2015-03-04
KR101538904B1 true KR101538904B1 (ko) 2015-07-22

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ID=50883401

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157002171A KR101538904B1 (ko) 2012-12-06 2013-12-03 유기무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체

Country Status (5)

Country Link
JP (1) JP5699230B2 (ja)
KR (1) KR101538904B1 (ja)
CN (1) CN104718241B (ja)
TW (1) TWI506076B (ja)
WO (1) WO2014087984A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107709414B (zh) * 2015-11-11 2021-12-28 积水化学工业株式会社 粒子、粒子材料、连接材料及连接结构体
JP6859077B2 (ja) * 2015-11-11 2021-04-14 積水化学工業株式会社 粒子材料、接続材料及び接続構造体
CN107221649B (zh) * 2016-03-21 2020-05-19 中国科学院苏州纳米技术与纳米仿生研究所 具有有机-无机复合保护层的电极、其制备方法及应用
JP6216474B1 (ja) * 2017-03-07 2017-10-18 宇部エクシモ株式会社 有機無機複合粒子
GB2561609B (en) * 2017-04-21 2019-12-18 Peratech Holdco Ltd Method of producing agglomerates for inclusion in a composite material
JP7440129B2 (ja) * 2020-02-19 2024-02-28 トリプルダブリュー リミテッド 乳酸生成およびポリ乳酸リサイクリングのための方法およびシステム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000204119A (ja) * 1999-01-14 2000-07-25 Nippon Shokubai Co Ltd 有機質無機質複合体粒子、その製造方法およびその用途
JP2004035293A (ja) * 2002-07-01 2004-02-05 Ube Nitto Kasei Co Ltd シリカ系粒子、その製造方法及び導電性シリカ系粒子
WO2012020799A1 (ja) * 2010-08-11 2012-02-16 株式会社日本触媒 重合体微粒子、導電性微粒子および異方性導電材料
JP2012041392A (ja) * 2010-08-13 2012-03-01 Asahi Kasei E-Materials Corp 感光性シリカ粒子含有縮合反応物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503932A (en) * 1993-11-17 1996-04-02 Nippon Shokubai Co., Ltd. Organic-inorganic composite particles and production process therefor
JP3502495B2 (ja) * 1996-01-11 2004-03-02 株式会社日本触媒 有機質−無機質複合体粒子、その製造法および用途
JP3457233B2 (ja) * 1999-10-19 2003-10-14 大日本塗料株式会社 有機無機複合樹脂水性エマルジョン及びその製造方法
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
JP5688032B2 (ja) * 2009-01-08 2015-03-25 ナノグラム・コーポレイションＮａｎｏＧｒａｍ Ｃｏｒｐｏｒａｔｉｏｎ ポリシロキサンポリエステル及び無機ナノ粒子の複合体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000204119A (ja) * 1999-01-14 2000-07-25 Nippon Shokubai Co Ltd 有機質無機質複合体粒子、その製造方法およびその用途
JP2004035293A (ja) * 2002-07-01 2004-02-05 Ube Nitto Kasei Co Ltd シリカ系粒子、その製造方法及び導電性シリカ系粒子
WO2012020799A1 (ja) * 2010-08-11 2012-02-16 株式会社日本触媒 重合体微粒子、導電性微粒子および異方性導電材料
JP2012041392A (ja) * 2010-08-13 2012-03-01 Asahi Kasei E-Materials Corp 感光性シリカ粒子含有縮合反応物

Also Published As

Publication number Publication date
TWI506076B (zh) 2015-11-01
WO2014087984A1 (ja) 2014-06-12
JPWO2014087984A1 (ja) 2017-01-05
CN104718241B (zh) 2016-11-23
JP5699230B2 (ja) 2015-04-08
CN104718241A (zh) 2015-06-17
KR20150023064A (ko) 2015-03-04
TW201434898A (zh) 2014-09-16

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