KR101537300B1 - 미스컷 기판들 상에 성장된 평면의 무극성 m-면 Ⅲ족-질화물 막들 - Google Patents
미스컷 기판들 상에 성장된 평면의 무극성 m-면 Ⅲ족-질화물 막들 Download PDFInfo
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- KR101537300B1 KR101537300B1 KR1020107004848A KR20107004848A KR101537300B1 KR 101537300 B1 KR101537300 B1 KR 101537300B1 KR 1020107004848 A KR1020107004848 A KR 1020107004848A KR 20107004848 A KR20107004848 A KR 20107004848A KR 101537300 B1 KR101537300 B1 KR 101537300B1
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- film
- substrate
- miscut
- nitride
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2908—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/32025—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth non-polar orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95476707P | 2007-08-08 | 2007-08-08 | |
| US95474407P | 2007-08-08 | 2007-08-08 | |
| US60/954,744 | 2007-08-08 | ||
| US60/954,767 | 2007-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100051846A KR20100051846A (ko) | 2010-05-18 |
| KR101537300B1 true KR101537300B1 (ko) | 2015-07-16 |
Family
ID=40341775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107004848A Expired - Fee Related KR101537300B1 (ko) | 2007-08-08 | 2008-08-08 | 미스컷 기판들 상에 성장된 평면의 무극성 m-면 Ⅲ족-질화물 막들 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US20090039356A1 (https=) |
| EP (1) | EP2176878A4 (https=) |
| JP (2) | JP2010536181A (https=) |
| KR (1) | KR101537300B1 (https=) |
| WO (1) | WO2009021201A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7504274B2 (en) * | 2004-05-10 | 2009-03-17 | The Regents Of The University Of California | Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
| WO2009097611A1 (en) * | 2008-02-01 | 2009-08-06 | The Regents Of The University Of California | Enhancement of optical polarization of nitride light-emitting diodes by wafer off-axis cut |
| US8795430B2 (en) * | 2009-03-02 | 2014-08-05 | The Regents Of The University Of California | Method of improving surface morphology of (Ga,Al,In,B)N thin films and devices grown on nonpolar or semipolar (Ga,Al,In,B)N substrates |
| JP4375497B1 (ja) | 2009-03-11 | 2009-12-02 | 住友電気工業株式会社 | Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法 |
| CN102460739A (zh) * | 2009-06-05 | 2012-05-16 | 加利福尼亚大学董事会 | 长波长非极性及半极性(Al,Ga,In)N基激光二极管 |
| JP2011023537A (ja) * | 2009-07-15 | 2011-02-03 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法 |
| WO2011109754A1 (en) * | 2010-03-04 | 2011-09-09 | The Regents Of The University Of California | Semi-polar iii-nitride optoelectronic devices on m-plane substrates with miscuts less than +/-15 degrees in the c-direction |
| JP4820465B1 (ja) * | 2010-04-02 | 2011-11-24 | パナソニック株式会社 | 窒化物系半導体素子およびその製造方法 |
| JP5781292B2 (ja) * | 2010-11-16 | 2015-09-16 | ローム株式会社 | 窒化物半導体素子および窒化物半導体パッケージ |
| CN103959437B (zh) | 2011-09-30 | 2017-08-01 | 圣戈班晶体及检测公司 | 具有特定结晶特征的iii‑v族衬底材料及其制备方法 |
| JP5949064B2 (ja) * | 2012-03-30 | 2016-07-06 | 三菱化学株式会社 | GaNバルク結晶 |
| KR102288547B1 (ko) * | 2012-03-30 | 2021-08-10 | 미쯔비시 케미컬 주식회사 | 주기표 제 13 족 금속 질화물 결정 및 주기표 제 13 족 금속 질화물 결정의 제조 방법 |
| JP5942547B2 (ja) * | 2012-03-30 | 2016-06-29 | 三菱化学株式会社 | Iii族窒化物結晶の製造方法 |
| TWI529964B (zh) | 2012-12-31 | 2016-04-11 | 聖戈班晶體探測器公司 | 具有薄緩衝層的iii-v族基材及其製備方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245564A (ja) * | 2005-02-07 | 2006-09-14 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| KR20060110700A (ko) * | 2005-04-21 | 2006-10-25 | 삼성전자주식회사 | 질화갈륨계 화합물 반도체 소자 |
| JP2010529943A (ja) * | 2007-06-15 | 2010-09-02 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | ミスカット基板上に成長したプレーナ無極性m平面III族窒化物薄膜 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3757339B2 (ja) * | 1995-12-26 | 2006-03-22 | 富士通株式会社 | 化合物半導体装置の製造方法 |
| US6849472B2 (en) * | 1997-09-30 | 2005-02-01 | Lumileds Lighting U.S., Llc | Nitride semiconductor device with reduced polarization fields |
| US6218280B1 (en) * | 1998-06-18 | 2001-04-17 | University Of Florida | Method and apparatus for producing group-III nitrides |
| JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
| WO2000033388A1 (en) * | 1998-11-24 | 2000-06-08 | Massachusetts Institute Of Technology | METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES |
| JP3668031B2 (ja) * | 1999-01-29 | 2005-07-06 | 三洋電機株式会社 | 窒化物系半導体発光素子の製造方法 |
| JP3696182B2 (ja) * | 2001-06-06 | 2005-09-14 | 松下電器産業株式会社 | 半導体レーザ素子 |
| US7501023B2 (en) * | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
| US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
| US6683327B2 (en) * | 2001-11-13 | 2004-01-27 | Lumileds Lighting U.S., Llc | Nucleation layer for improved light extraction from light emitting devices |
| WO2003089696A1 (en) * | 2002-04-15 | 2003-10-30 | The Regents Of The University Of California | Dislocation reduction in non-polar gallium nitride thin films |
| US7208393B2 (en) | 2002-04-15 | 2007-04-24 | The Regents Of The University Of California | Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy |
| US7186302B2 (en) * | 2002-12-16 | 2007-03-06 | The Regents Of The University Of California | Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
| JP3888374B2 (ja) * | 2004-03-17 | 2007-02-28 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
| JP2005277254A (ja) * | 2004-03-26 | 2005-10-06 | Shikusuon:Kk | 基板およびその製造方法 |
| US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
| JP4581490B2 (ja) * | 2004-05-31 | 2010-11-17 | 日立電線株式会社 | Iii−v族窒化物系半導体自立基板の製造方法、及びiii−v族窒化物系半導体の製造方法 |
| JP2006060069A (ja) * | 2004-08-20 | 2006-03-02 | Sumitomo Electric Ind Ltd | AlN結晶の表面処理方法、AlN結晶基板、エピタキシャル層付AlN結晶基板および半導体デバイス |
| US7432531B2 (en) * | 2005-02-07 | 2008-10-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
| KR101145755B1 (ko) * | 2005-03-10 | 2012-05-16 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 평면의 반극성 갈륨 질화물의 성장을 위한 기술 |
| JP4988179B2 (ja) * | 2005-09-22 | 2012-08-01 | ローム株式会社 | 酸化亜鉛系化合物半導体素子 |
| TWI490918B (zh) * | 2006-01-20 | 2015-07-01 | 美國加利福尼亞大學董事會 | 半極性氮化(鋁,銦,鎵,硼)之改良成長方法 |
| JP2008285364A (ja) * | 2007-05-17 | 2008-11-27 | Sumitomo Electric Ind Ltd | GaN基板、それを用いたエピタキシャル基板及び半導体発光素子 |
| JP5118392B2 (ja) * | 2007-06-08 | 2013-01-16 | ローム株式会社 | 半導体発光素子およびその製造方法 |
-
2008
- 2008-08-08 WO PCT/US2008/072669 patent/WO2009021201A1/en not_active Ceased
- 2008-08-08 JP JP2010520332A patent/JP2010536181A/ja active Pending
- 2008-08-08 US US12/189,026 patent/US20090039356A1/en not_active Abandoned
- 2008-08-08 EP EP08797523A patent/EP2176878A4/en not_active Withdrawn
- 2008-08-08 KR KR1020107004848A patent/KR101537300B1/ko not_active Expired - Fee Related
-
2011
- 2011-06-03 US US13/152,553 patent/US20110237054A1/en not_active Abandoned
-
2014
- 2014-02-26 JP JP2014034875A patent/JP2014099658A/ja active Pending
-
2017
- 2017-05-26 US US15/607,319 patent/US20170327969A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245564A (ja) * | 2005-02-07 | 2006-09-14 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| KR20060110700A (ko) * | 2005-04-21 | 2006-10-25 | 삼성전자주식회사 | 질화갈륨계 화합물 반도체 소자 |
| JP2010529943A (ja) * | 2007-06-15 | 2010-09-02 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | ミスカット基板上に成長したプレーナ無極性m平面III族窒化物薄膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010536181A (ja) | 2010-11-25 |
| KR20100051846A (ko) | 2010-05-18 |
| EP2176878A4 (en) | 2010-11-17 |
| JP2014099658A (ja) | 2014-05-29 |
| EP2176878A1 (en) | 2010-04-21 |
| US20110237054A1 (en) | 2011-09-29 |
| WO2009021201A1 (en) | 2009-02-12 |
| US20170327969A1 (en) | 2017-11-16 |
| US20090039356A1 (en) | 2009-02-12 |
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