KR101524338B1 - 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Download PDF

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Publication number
KR101524338B1
KR101524338B1 KR1020120051838A KR20120051838A KR101524338B1 KR 101524338 B1 KR101524338 B1 KR 101524338B1 KR 1020120051838 A KR1020120051838 A KR 1020120051838A KR 20120051838 A KR20120051838 A KR 20120051838A KR 101524338 B1 KR101524338 B1 KR 101524338B1
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South Korea
Prior art keywords
light
mold
optical system
relay optical
substrate
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Korean (ko)
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KR20120128571A (ko
Inventor
히로노리 마에다
세이야 미우라
가즈히꼬 미시마
겐 미노다
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Engineering (AREA)
KR1020120051838A 2011-05-17 2012-05-16 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Active KR101524338B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-110587 2011-05-17
JP2011110587A JP5637931B2 (ja) 2011-05-17 2011-05-17 インプリント装置、インプリント方法およびデバイス製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020140095713A Division KR101540884B1 (ko) 2011-05-17 2014-07-28 임프린트 방법
KR1020150018434A Division KR101603037B1 (ko) 2011-05-17 2015-02-06 임프린트 장치

Publications (2)

Publication Number Publication Date
KR20120128571A KR20120128571A (ko) 2012-11-27
KR101524338B1 true KR101524338B1 (ko) 2015-05-29

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KR1020120051838A Active KR101524338B1 (ko) 2011-05-17 2012-05-16 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법
KR1020140095713A Active KR101540884B1 (ko) 2011-05-17 2014-07-28 임프린트 방법
KR1020150018434A Active KR101603037B1 (ko) 2011-05-17 2015-02-06 임프린트 장치

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KR1020140095713A Active KR101540884B1 (ko) 2011-05-17 2014-07-28 임프린트 방법
KR1020150018434A Active KR101603037B1 (ko) 2011-05-17 2015-02-06 임프린트 장치

Country Status (5)

Country Link
US (2) US9188855B2 (https=)
JP (1) JP5637931B2 (https=)
KR (3) KR101524338B1 (https=)
CN (2) CN104614937B (https=)
TW (2) TWI654706B (https=)

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JP5637931B2 (ja) * 2011-05-17 2014-12-10 キヤノン株式会社 インプリント装置、インプリント方法およびデバイス製造方法
WO2013094068A1 (ja) * 2011-12-22 2013-06-27 キヤノン株式会社 インプリント装置及びデバイス製造方法
JP5938218B2 (ja) * 2012-01-16 2016-06-22 キヤノン株式会社 インプリント装置、物品の製造方法およびインプリント方法
JP6188382B2 (ja) 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
DE102013207243B4 (de) * 2013-04-22 2019-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6541328B2 (ja) * 2013-11-26 2019-07-10 キヤノン株式会社 検出装置、インプリント装置、および物品の製造方法
EP2916172A1 (en) * 2014-02-13 2015-09-09 Chemence, Inc. Improvements in the manufacture of craft stamps
TWI619145B (zh) * 2015-04-30 2018-03-21 佳能股份有限公司 壓印裝置，基板運送裝置，壓印方法以及製造物件的方法
US10386737B2 (en) * 2015-06-10 2019-08-20 Canon Kabushiki Kaisha Imprint apparatus and method for producing article
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法
WO2020038629A1 (en) * 2018-08-20 2020-02-27 Asml Netherlands B.V. Apparatus and method for measuring a position of alignment marks
CN113815304B (zh) * 2020-06-19 2023-08-29 陈竹 基于丝网印刷技术的同步对花板材、板材同步对花系统及方法
CN115799146B (zh) * 2023-01-30 2023-05-09 北京青禾晶元半导体科技有限责任公司 一种光学对位系统

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JP2010214913A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd インプリント方法およびインプリント装置

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JP2010214913A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd インプリント方法およびインプリント装置

Also Published As

Publication number Publication date
KR20150018866A (ko) 2015-02-24
US9188855B2 (en) 2015-11-17
TWI654706B (zh) 2019-03-21
KR101603037B1 (ko) 2016-03-11
JP5637931B2 (ja) 2014-12-10
CN102789127A (zh) 2012-11-21
JP2012243863A (ja) 2012-12-10
CN102789127B (zh) 2016-04-06
CN104614937A (zh) 2015-05-13
KR20140107156A (ko) 2014-09-04
CN104614937B (zh) 2019-07-23
US20120292801A1 (en) 2012-11-22
TW201250779A (en) 2012-12-16
KR20120128571A (ko) 2012-11-27
KR101540884B1 (ko) 2015-07-30
TWI496190B (zh) 2015-08-11
US20160033884A1 (en) 2016-02-04
TW201537669A (zh) 2015-10-01
US9645514B2 (en) 2017-05-09

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