KR101522806B1 - 세라믹스 회로 기판 - Google Patents
세라믹스 회로 기판 Download PDFInfo
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- KR101522806B1 KR101522806B1 KR1020137027479A KR20137027479A KR101522806B1 KR 101522806 B1 KR101522806 B1 KR 101522806B1 KR 1020137027479 A KR1020137027479 A KR 1020137027479A KR 20137027479 A KR20137027479 A KR 20137027479A KR 101522806 B1 KR101522806 B1 KR 101522806B1
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- Prior art keywords
- circuit board
- alumina substrate
- alumina
- mass
- substrate
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
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- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
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JPJP-P-2011-156160 | 2011-07-14 | ||
JP2011156160 | 2011-07-14 | ||
PCT/JP2012/067957 WO2013008920A1 (ja) | 2011-07-14 | 2012-07-13 | セラミックス回路基板 |
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KR20130137029A KR20130137029A (ko) | 2013-12-13 |
KR101522806B1 true KR101522806B1 (ko) | 2015-05-26 |
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Country Status (4)
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JP (1) | JP6129738B2 (ja) |
KR (1) | KR101522806B1 (ja) |
CN (1) | CN103503130B (ja) |
WO (1) | WO2013008920A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11498878B2 (en) | 2016-02-26 | 2022-11-15 | Heraeus Deutschland GmbH & Co. KG | Copper-ceramic composite |
US11584696B2 (en) | 2016-02-26 | 2023-02-21 | Heraeus Deutschland GmbH & Co. KG | Copper-ceramic composite |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3315476B1 (en) * | 2015-06-26 | 2020-02-26 | Kyocera Corporation | Ceramic substrate and mounting substrate using same, and electronic device |
DE102016203058B3 (de) * | 2016-02-26 | 2017-05-18 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund und Modul |
HUE053117T2 (hu) * | 2016-02-26 | 2021-06-28 | Heraeus Deutschland Gmbh & Co Kg | Réz-kerámia kompozitok |
DE102016203030A1 (de) * | 2016-02-26 | 2017-08-31 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund |
EP3210956B1 (de) * | 2016-02-26 | 2018-04-11 | Heraeus Deutschland GmbH & Co. KG | Kupfer-keramik-verbund |
WO2019073783A1 (ja) | 2017-10-12 | 2019-04-18 | 住友電気工業株式会社 | セラミック基板、積層体およびsawデバイス |
JP7180607B2 (ja) | 2017-10-12 | 2022-11-30 | 住友電気工業株式会社 | セラミック基板、積層体およびsawデバイス |
WO2019167330A1 (ja) * | 2018-03-01 | 2019-09-06 | 株式会社村田製作所 | 積層基板 |
CN112573903B (zh) * | 2019-09-30 | 2022-08-26 | 国网河南省电力公司桐柏县供电公司 | 一种氧化铝复合基板材料及其制备方法 |
WO2021111508A1 (ja) * | 2019-12-03 | 2021-06-10 | 日本碍子株式会社 | 接合基板及び接合基板の製造方法 |
CN114031375A (zh) * | 2021-11-26 | 2022-02-11 | 潮州市三泰陶瓷有限公司 | 基于高温烧结的高硬度陶瓷材料及其制备工艺 |
WO2024111484A1 (ja) * | 2022-11-25 | 2024-05-30 | デンカ株式会社 | 接合体及びパワーモジュール |
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KR960007510A (ko) * | 1994-08-18 | 1996-03-22 | 오까무라 카네오우 | 세라믹 히터용 알루미나기 소결재료 |
JP2000277662A (ja) * | 1999-03-26 | 2000-10-06 | Toshiba Corp | セラミックス回路基板 |
JP2005281063A (ja) * | 2004-03-30 | 2005-10-13 | Denki Kagaku Kogyo Kk | 高純度球状アルミナ粉末、その製造方法及び組成物 |
JP2006298703A (ja) * | 2005-04-21 | 2006-11-02 | Nishimura Togyo Kk | 陶磁器熱放射性固体物 |
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JPS6483512A (en) * | 1987-09-24 | 1989-03-29 | Showa Denko Kk | Low soda alumina |
TW579372B (en) * | 1998-07-29 | 2004-03-11 | Sumitomo Chemical Co | Process for producing alumina sintered body |
JP2006199584A (ja) * | 2006-02-17 | 2006-08-03 | Toshiba Corp | セラミックス回路基板の製造方法 |
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2012
- 2012-07-13 WO PCT/JP2012/067957 patent/WO2013008920A1/ja active Application Filing
- 2012-07-13 JP JP2013524003A patent/JP6129738B2/ja active Active
- 2012-07-13 CN CN201280019672.6A patent/CN103503130B/zh active Active
- 2012-07-13 KR KR1020137027479A patent/KR101522806B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR960007510A (ko) * | 1994-08-18 | 1996-03-22 | 오까무라 카네오우 | 세라믹 히터용 알루미나기 소결재료 |
JP2000277662A (ja) * | 1999-03-26 | 2000-10-06 | Toshiba Corp | セラミックス回路基板 |
JP2005281063A (ja) * | 2004-03-30 | 2005-10-13 | Denki Kagaku Kogyo Kk | 高純度球状アルミナ粉末、その製造方法及び組成物 |
JP2006298703A (ja) * | 2005-04-21 | 2006-11-02 | Nishimura Togyo Kk | 陶磁器熱放射性固体物 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11498878B2 (en) | 2016-02-26 | 2022-11-15 | Heraeus Deutschland GmbH & Co. KG | Copper-ceramic composite |
US11584696B2 (en) | 2016-02-26 | 2023-02-21 | Heraeus Deutschland GmbH & Co. KG | Copper-ceramic composite |
Also Published As
Publication number | Publication date |
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KR20130137029A (ko) | 2013-12-13 |
JPWO2013008920A1 (ja) | 2015-02-23 |
WO2013008920A1 (ja) | 2013-01-17 |
CN103503130A (zh) | 2014-01-08 |
CN103503130B (zh) | 2016-11-16 |
JP6129738B2 (ja) | 2017-05-17 |
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