KR101519314B1 - 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법 - Google Patents

가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법 Download PDF

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Publication number
KR101519314B1
KR101519314B1 KR1020147024350A KR20147024350A KR101519314B1 KR 101519314 B1 KR101519314 B1 KR 101519314B1 KR 1020147024350 A KR1020147024350 A KR 1020147024350A KR 20147024350 A KR20147024350 A KR 20147024350A KR 101519314 B1 KR101519314 B1 KR 101519314B1
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KR
South Korea
Prior art keywords
jig
layer
workpiece
copper foil
laser beam
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KR1020147024350A
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English (en)
Korean (ko)
Inventor
교헤이 오카모토
Original Assignee
미쓰비시덴키 가부시키가이샤
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Application granted granted Critical
Publication of KR101519314B1 publication Critical patent/KR101519314B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
KR1020147024350A 2013-10-18 2013-10-18 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법 KR101519314B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/078354 WO2015056349A1 (ja) 2013-10-18 2013-10-18 加工テーブル用治具、加工テーブル用治具の製造方法およびレーザ加工方法

Publications (1)

Publication Number Publication Date
KR101519314B1 true KR101519314B1 (ko) 2015-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024350A KR101519314B1 (ko) 2013-10-18 2013-10-18 가공 테이블용 지그, 가공 테이블용 지그의 제조 방법 및 레이저 가공 방법

Country Status (5)

Country Link
JP (1) JP5591422B1 (zh)
KR (1) KR101519314B1 (zh)
CN (1) CN104755220B (zh)
TW (1) TWI546152B (zh)
WO (1) WO2015056349A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020105957A1 (ko) * 2018-11-21 2020-05-28 엘지이노텍 주식회사 비아 홀 가공을 위한 지그, 비아 홀 가공 장치 및 이를 이용한 비아 홀 가공방법
KR20200059664A (ko) * 2018-11-21 2020-05-29 엘지이노텍 주식회사 비아 홀 가공 방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195905B (zh) * 2015-10-16 2017-07-18 惠州市杰普特电子技术有限公司 新型激光打印设备
CN105196710B (zh) * 2015-10-16 2016-10-05 张晶 激光打印设备
CN106041324B (zh) * 2016-06-03 2017-10-17 张家港协鑫集成科技有限公司 层压件开孔定位装置及方法

Citations (3)

* Cited by examiner, † Cited by third party
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JP2004298885A (ja) * 2003-03-28 2004-10-28 Ricoh Microelectronics Co Ltd レーザー加工用治具及びレーザー加工方法
JP2012055954A (ja) * 2010-09-13 2012-03-22 Panasonic Corp レーザ加工装置およびレーザ加工方法
KR20120115339A (ko) * 2010-02-24 2012-10-17 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로 기판용 동박 및 인쇄 회로 기판용 동장 적층판

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JPS6319987U (zh) * 1986-07-22 1988-02-09
JPS6319986U (zh) * 1986-07-22 1988-02-09
FR2747065B1 (fr) * 1996-04-05 1998-06-12 Milly Daniel Paul Dispositif de protection pour table a laser
JP3875867B2 (ja) * 2001-10-15 2007-01-31 新光電気工業株式会社 シリコン基板の穴形成方法
DE102004020737A1 (de) * 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
TW200715928A (en) * 2005-10-06 2007-04-16 Mec Co Ltd Method for manufacturing a printed wiring board
KR100831593B1 (ko) * 2007-04-23 2008-05-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법, 비아홀 천공 장치
KR101043729B1 (ko) * 2008-12-31 2011-06-24 주식회사 하이닉스반도체 반도체설비의 교정용 기준 웨이퍼 및 그 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004298885A (ja) * 2003-03-28 2004-10-28 Ricoh Microelectronics Co Ltd レーザー加工用治具及びレーザー加工方法
KR20120115339A (ko) * 2010-02-24 2012-10-17 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로 기판용 동박 및 인쇄 회로 기판용 동장 적층판
JP2012055954A (ja) * 2010-09-13 2012-03-22 Panasonic Corp レーザ加工装置およびレーザ加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020105957A1 (ko) * 2018-11-21 2020-05-28 엘지이노텍 주식회사 비아 홀 가공을 위한 지그, 비아 홀 가공 장치 및 이를 이용한 비아 홀 가공방법
KR20200059664A (ko) * 2018-11-21 2020-05-29 엘지이노텍 주식회사 비아 홀 가공 방법
KR102581007B1 (ko) * 2018-11-21 2023-09-22 엘지이노텍 주식회사 비아 홀 가공 방법

Also Published As

Publication number Publication date
TWI546152B (zh) 2016-08-21
WO2015056349A1 (ja) 2015-04-23
JP5591422B1 (ja) 2014-09-17
CN104755220B (zh) 2016-11-16
CN104755220A (zh) 2015-07-01
TW201515759A (zh) 2015-05-01
JPWO2015056349A1 (ja) 2017-03-09

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