KR101493084B1 - Elastic print master and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an elastic printing master and a manufacturing method thereof. A method of manufacturing an elastic print master according to the present invention comprises the steps of: preparing a master electrodeposition plate in which a plurality of voids are formed by electrodeposited metal layers through electroforming on a metal plate as a conductor; Forming a model plate having protrusions corresponding to the space portions of the master electrodeposition plate; And applying an elastic body to one side of the model plate to obtain an elastic printing master having an ink receiving groove corresponding to the protrusion of the model plate.

Description

[0001] DESCRIPTION [0002] ELASTIC PRINT MASTER AND MANUFACTURING METHOD THEREOF [0003]

More particularly, the present invention relates to an elastic print master and a method of manufacturing the same, and more particularly, to a method of manufacturing an elastic print master and a method of manufacturing the same, Line, and surface of the print medium can be precisely printed.

The reason why the elastic body is used in the present invention is that the ink contained in the ink containing groove is printed without being spread sideways by the pressure of the printing master.

In order to constitute the fine ink receiving groove of the present invention, the size of the ink receiving groove is controlled to an accuracy of 1 micron using the homogeneity of electroforming in the present invention.

When the ink used in the elastic printing master of the present invention is printed using conductive ink of nanoparticles, it becomes easy to realize an ultra-precise microcircuit. That is, the present invention can realize an ultra-fine circuit with an extremely low cost.

In general, all devices operating with electrical energy are provided with a printed circuit board on which a plurality of elements are arranged to form a desired electrical circuit on one board.

That is, the printed circuit board is an abbreviation of a printed circuit board (PCB), which means a circuit board on which electric and electronic components are mounted and interconnecting them in a circuit.

In the manufacture of such a circuit board, there is a method of manufacturing a circuit board by photolithography.

A method of manufacturing a circuit board by photolithography is a method in which a photoresist is coated on the surface of a copper plate laminated on an insulating substrate, a positive circuit is printed and developed on the copper plate, The circuit board is manufactured by removing the corrosion.

However, the production of the circuit board by the photo-etching method has a problem that the loss of the expensive metal material is large, the corrosive chemical liquid is incidentally consumed in a large amount, and chemical pollution necessarily accompanies the corrosion process.

In addition, all of the apparatuses and the like used in the manufacture of circuit boards are expensive, so that there is a problem in that mass production of the circuit boards is difficult due to increase in the manufacturing cost of the circuit boards and complicated work.

In order to solve such a problem, a method of manufacturing a circuit board by a screen printing method has been suggested as an alternative.

In the production of a circuit board by a screen printing method, a concave and convex portions for forming a circuit are formed on the surface of a printing master, conductive ink filled in the convex and concave portions is transferred to a screen, Thereby producing a circuit board.

Since the method of manufacturing the circuit board by the screen printing method is not accompanied by the corrosion process, there is no loss of the metal material, and there is almost no pollution problem caused by chemicals.

However, in the production of a circuit board by the screen printing method, the electric resistance value of the circuit is not constant depending on the screen printing conditions of the printing master, and the reliability of the circuit is not high, and the use range of the circuit board is limited.

Therefore, in the case where precision circuit and high reliability are required, a circuit board manufactured by the corrosion method is used.

As a screen printing method, it is practically impossible to realize a circuit having a line width of several microns to several tens of microns.

Thus, the applicant of the present invention has developed a printing master capable of precisely printing even if the line width is several microns by manufacturing a printing master constituted of an elastic body. By using the elastic printing master, the ink to be printed on the printing object is printed neatly without spreading to the side.

Therefore, when printing is performed with the conductive ink, the printed circuit can not only make the electrical resistance value uniform but also improve the quality of the printed circuit.

The technical problem to be solved in the present invention is to make it possible to solve the problem that the extremely minute circuit of several microns to several tens of microns can not be solved by the conventional printing method with the elastic printing master according to the present invention.

The present invention not only enables an extremely fine circuit to be implemented by printing but also makes it possible to uniformize the electrical resistance value of a circuit to be printed when it is printed with conductive ink.

The present invention also provides an elastic print master capable of improving the quality of a printed circuit and a method of manufacturing the same.

According to an aspect of the present invention, there is provided an elastic print master comprising: a master electrodeposition plate having an electrodeposited metal layer formed on a metal plate as a conductor by electroforming to form a plurality of voids; Separating the model plate on which protrusions corresponding to the space portions of the master electrodeposition plate are protruded from the master electrodeposition plate to form a model plate; Applying an elastic body to one side surface of the model plate with a predetermined thickness so as to embed the projection of the model plate and laminating the reinforcing metal layer to the elastic body; And separating the elastic body joined with the reinforcing metal layer from the modeling plate to obtain an elastic printing master having a plurality of ink receiving grooves corresponding to the protruding portions.

As an effect of the present invention, the printed matter by the elastic print master of the present invention can be extremely easily formed by printing with a line of several microns.

That is, since the elastic printing master of the present invention can control the size of the ink receiving groove of the printing master to the accuracy of 1 micron by utilizing the homogeneity of the electroforming process, the printing precision can not be imagined Is possible.

When printing is performed using conductive ink of nanoparticles as an ink to be used in the elastic printing master of the present invention, it is easy to realize an ultra-precise microcircuit at low cost.

Therefore, according to the solution of the above-mentioned problems, not only the electrical resistance value of the circuit to be printed can be uniformly provided, but also the quality of the printed circuit can be improved.

Hereinafter, a method of manufacturing the elastic print master according to the present invention will be described step by step. In this case, each of the drawings is constructed as a sectional view for the sake of understanding. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted so as to avoid obscuring the subject matter of the present invention.

First, FIGS. 1 to 4 illustrate a process for manufacturing a master electrodeposition plate. As shown in FIG. 4, the master electrodeposited plate 20 is formed by forming the space 15 by controlling the distance between the electrodeposited metal layers 17 to a desired size by electroforming the metal plate 11, which is a conductor, as shown in FIG.

The master electrodeposition plate 20 according to the present invention can be precisely controlled and manufactured using the phenomenon of uniform growth of the electro-magnetic workpiece.

In order to make such a master electrodeposited plate 20, a photosensitive material is applied to an upper portion of a metal plate 11, which is a plate-shaped conductor, as shown in FIG. 1, The exposure process is performed through the pattern film constituted by the photoresist pattern.

The photoresist material exposed to light remains on the metal plate 11 as the insulating portion 13.

The receiving groove 12 formed between the exposed portion and the exposed portion of the metal plate 11 is a place where the unexposed photosensitive material has disappeared by the developing solution.

These receiving grooves 12 are provided in various shapes according to the pattern of the film pattern.

1 shows a state in which a plurality of receiving grooves 12 and a plurality of insulating portions 13 of a nonconductive body are formed on one side of the metal plate 11 through the exposure and development work after the photosensitive material is applied to the metal plate 11 A step of providing the base electrodeposited plate 10 having the base plate 10 will be described.

Here, as another method of forming the insulating portion 13, the insulating portion is first laminated on the surface of the metal plate 11, and then the insulating portion is laser-processed so that the receiving groove 12 is formed, . Insulators can be used in various types of materials.

At this time, the sizes of the insulating portion 13 and the receiving groove 12 are selected as needed. When the photosensitive material is applied to form the insulating portion 13, the size of the insulating portion 13 and the receiving groove 12 are determined according to the shape of the pattern of the film.

Electroplating is based on the property that the electrodeposited metal is grown at a uniform speed and uniformity in a state in which the homogeneity of the dissolved metal, the current density, etc. in the electrodeposition bath is secured.

FIG. 2 is a view showing a step of forming an electrodeposited metal layer on the surface of the metal plate of the base electrodeposition plate of FIG. 1; FIG.

The electrodeposited metal layer 17 is formed on the surface of the metal plate 11 on which the receiving groove 12 is formed when the base electrodeposited plate 10 having the insulating portion 13 is provided, Is formed.

At this time, the molten metal dissolved in the electroplating bath is formed of the electrodeposited metal layer 17 on the surface of the metal plate 11 on which the receiving grooves 12 except for the insulating portion 13 of the base electrodeposition plate 10 are formed .

The dissolving metal is not electrodeposited on the upper surface of the insulating portion 13 until the thickness of the electrodepositing metal layer 17 is increased by the height of the insulating portion 13 as the electrodeposited metal layer 17 is formed. That is, the electrodeposited metal layer 17 grows only in the upward direction.

When the thickness of the electrodeposited metal layer 17 is increased to the height of the insulating portion 13 as the electrodeposited metal layer 17 grows upwardly, as shown in FIG. 3, the electrodeposited metal layer 17 grows not only in the upward direction, Diffusion growth also begins.

The electrodeposited metal layer 17 diffuses and grows from the edge of the insulating portion 13 toward the central portion of the insulating portion 13 as the electrodeposited metal layer 17 spreads laterally.

As shown in Fig. 4, the distance between the electrodeposited metal layer and the surrounding electrodeposited metal layer is defined as a space 15. When the size of the space portion 15 becomes a desired size, the electroforming is stopped. This is defined as a master electrodeposited plate 20.

The space portion 15 determines the ink receiving groove of the master to be printed later, and the ink receiving groove is determined by the line width of the printed material to be printed.

5 is a view showing a step of forming a model plate.

When the master electrodeposited plate 20 is completed, a work for obtaining the model plate 30 is started.

This is a step of forming the model plate 30 having the protrusions 33 corresponding to the respective space portions 15 of the master electrodeposition plate 20. As an embodiment thereof, there are a method using a preform working and a method using a liquid resin.

First, as a method of using the electroforming process, a release material for assisting release is applied to the master electrodeposition plate 20 shown in FIG. 4, and then the master electrodeposition plate 20 is electroformed again to form a model plate 30 I make it.

As a method of using the liquid resin, a liquid resin is applied to one side of the master electrodeposited plate 20 to a predetermined thickness and cured to form the model board 30. [ That is, the liquid resin is applied including the space portions 15 of the master electrodeposition plate 20 and then cured.

At this time, a release material may be applied to facilitate demoulding.

Fig. 6 is a sectional view of the model plate of Fig. 5;

When the model plate 30 described in FIG. 5 is demolded from the master electrodeposition plate 20, a plurality of protruding portions 33 corresponding to the space portion 15 of the master electrodeposition plate 20 are protruded .

FIG. 7 is a view showing a step of applying an elastic body to the model plate of FIG. 6;

As shown in FIG. 7, an elastic body 41, which is a flexible elastic material, is applied to one side of the model plate 30 on which the protrusions 33 are protruded, and then the elastic body 41 is cured. At this time, the elastic body 41 is applied so that the projection 33 of the model plate 30 is completely embedded.

The elastic body 41 is most preferably a material which is easily demolded from the model plate 30 after curing and has elasticity after curing. As a representative example of such a material, various materials containing silicon as a main component can be used.

8 is a view showing a step of laminating a reinforcing metal layer to an elastic body.

After the elastic plate 41 is coated on the model plate 30 and cured, the reinforcing metal layer 45 is laminated on the elastic plate 41. [

The reinforcing metal layer 45 serves not only to support the elastic body 41 but also to suppress the expansion, deformation, and length change of the elastic body 41. Here, the reinforcing metal layer 45 is preferably made of an invar alloy material. An invar alloy is an alloy made by adding 36.5% of nickel to 63.5% of iron and having a coefficient of thermal expansion close to 0, and a low thermal expansion alloy having an austenite crystal structure of about 1/10 as compared with stainless steel.

The elastic print master 40 according to the present invention is obtained by separating the elastic body 41 and the reinforcing metal layer 45 from the model plate 30 after the lamination of the reinforcing metal layer 45 to the elastic body 41 is completed.

When the elastic print master 40 is formed in a Laura pattern, it is preferable that the reinforcing metal layer 45 is formed in the form of a metal roller.

9 is a cross-sectional view of an elastic print master according to the present invention.

The elastic print master 40 according to the present invention comprises a reinforcing metal layer 45 and an elastic body 41 bonded to the reinforcing metal layer.

A plurality of grooves corresponding to the protrusions 33 of the model plate 30 are formed on the surface of the elastic body 41. The plurality of grooves constitute the ink receiving grooves 43. Conductive ink is contained in the ink containing groove 43. The received conductive ink forms a circuit that is embodied as a dot, line, surface, or the like on a printing object.

This completes the production of the elastic print master 40 having elasticity and having a plurality of ink receiving grooves 43 formed on the surface thereof.

After the master electrodeposited plate 20 provided with the electrodeposited metal layer 17 for forming the plurality of space portions 15 is formed by electroforming, another electroforming process is performed on the master electrodeposited plate 20, The electrodeposition plate 20 is separated to obtain the model plate 30.

The elastic body 41 and the reinforcing metal layer 45 are successively laminated on the model plate 30 and then the elastic body 41 and the reinforcing metal layer 45 are separated from the model plate 30, A plurality of ink receiving grooves 43 corresponding to the protruding portions 33 are formed and an elastic printing master 40 having elasticity is obtained.

When the elastic printing master 40 of the present invention is pressed on the printing object, the elastic printing master 40 and the printing object are sufficiently close to each other due to the elasticity of the elastic body 41.

The conductive ink filled in the respective ink receiving grooves 43 of the elastic printing master 40 provides a great feature that the conductive ink does not spread sideways during the printing process and is cleanly printed due to the increased adhesion.

This makes it possible to form the circuit cleanly and uniformly when constructing a circuit using a conductive ink, thereby improving the physical safety and reliability of the circuit and uniformizing the electrical resistance of the printed circuit.

In addition, the quality of the printed circuit can be improved, and the circuit board can be economically and inexpensively manufactured in large quantities.

The reinforcing metal layer 45 supporting the elastic printing master 40 of the present invention not only supports the elastic body 41 but also plays a role of suppressing the expansion or deformation and the length change of the elastic body 41. Here, the reinforcing metal layer 45 is preferably made of an invar alloy material. An invar alloy is an alloy made by adding 36.5% of nickel to 63.5% of iron and having a coefficient of thermal expansion close to 0, and a low thermal expansion alloy having an austenite crystal structure of about 1/10 as compared with stainless steel.

In the case of printing requiring repeated printing at the same position twice or more, the deformation of the elastic printing master 40 can not be absolutely permitted. In this case, the reinforcing metal layer 45 of the invar material, which prevents thermal deformation, plays an excellent role.

The reason why it is preferable to use a material mainly composed of silicon as the elastic material 41 is that silicon not only has elasticity but also provides releasability to the conductive ink filled in the ink containing groove 43, Is a function that facilitates the movement of the printing medium to the printing object.

One of the greatest features of the present invention is that the ink receiving groove 43 can be precisely machined and a very fine ink receiving groove 43 can be formed. It is possible to control the size of the ink accommodating groove 43 to an accuracy of 1 micron using the homogeneity of the electroforming process, and thus it is possible to perform super precise printing which can not be imagined as the precision by the conventional printing.

When the conductive ink of the nanoparticle is used as the ink to be used in the elastic print master 40 of the present invention, it is easy to realize an ultra-precise microcircuit. That is, the present invention enables to realize a highly precise ultrafine circuit at an extremely low cost.

The present invention provides an ink jet recording head comprising: an elastic body (41) formed with a plurality of ink containing grooves (43); And a reinforcing metal layer 45 is laminated on the surface of the elastic body 41 on which the ink receiving groove 43 is not formed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

1 is a cross-sectional view of a base electrodeposition board for manufacturing an elastic print master according to the present invention,

FIG. 2 is a view showing a step of forming an electrodeposited metal layer on the surface of a metal plate of the base electrodeposition plate of FIG. 1;

3 is a view showing a step of diffusively growing an electrodeposited metal layer on the surface of a metal plate of the base electrodeposition plate of FIG. 1,

4 is a cross-sectional view of a master electrodeposition plate for making an elastic print master according to the present invention,

FIG. 5 is a view showing a step of forming a model plate on the master electrodeposition plate of FIG. 4,

Fig. 6 is a sectional view of the model plate of Fig. 5,

Fig. 7 is a view showing a step of applying an elastic body to the model plate of Fig. 6,

8 is a view showing a process in which a reinforcing metal layer is laminated on the elastic body of FIG. 6,

9 is a cross-sectional view of an elastic print master according to the present invention.

Description of the Related Art [0002]

10: base electrodeposition plate 11: metal plate

13: insulation part 15: space part

17: electrodeposited metal layer 20: master electrodeposition plate

30: model plate 33: projection

40: elastic printing master 41: ink receiving groove

43: elastic body 45: reinforcing metal layer

Claims (9)

In a method for producing an elastic printing master, A method for manufacturing a master electrodeposited copper foil, comprising the steps of: preparing a master electrodeposition plate for forming a plurality of voids by an electrodeposited metal layer through electroforming on a metal plate as a conductor; Forming a model plate having protrusions corresponding to the space portions of the master electrodeposition plate; And applying an elastic body to one side of the model plate to obtain an elastic print master having an ink receiving groove corresponding to the protrusion of the model plate, The step of fabricating the master electrodeposited plate comprises: Providing a base electrodeposition plate having a plurality of insulating portions of a nonconductive material disposed on one surface of the metal plate, the metal plate being a conductor, forming a plurality of receiving grooves; Performing electroplating on the base electrodeposited plate to form an electrodeposited metal layer on the surface of the metal plate corresponding to the receiving recess; Diffusion-growing the electrodeposited metal layer such that the electrodeposited metal layer gradually reduces the upper surface of the insulating portion; And stopping the electroforming if the width of the upper surface of the insulating portion is reduced to a desired size by diffusion growth of the electrodeposited metal layer to obtain the master electrodeposition plate. delete delete delete delete delete delete delete The method according to claim 1, In the elastic print master, An elastic body having a plurality of ink receiving grooves; Wherein a reinforcing metal layer is laminated on the surface of the elastic body on which the ink receiving groove is not formed.

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