KR100871093B1 - Nano ordered fine pattern curcuit and its manufacturing process - Google Patents

Abstract

The present invention relates to a nano-scale fine pattern circuit and a method of manufacturing the same, in particular, a groove having a nanometer-class width and depth by irradiating a focused ion beam at a predetermined width and interval on the upper surface of the carbon glass having a rectangular parallelepiped shape Forming them; Heating the polyimide plate to be fusible; Placing a polyimide plate having a fusible property on the upper surface of the carbon glass provided with grooves and pressing the same through a press to form continuous nanometer-shaped iron parts and recesses on the bottom surface of the polyimide plate; Cooling the polyimide plate to remove fussability and then separating from the carbon glass; Placing the polyimide plate in a plasma gas body and performing plasma treatment to form a copper plating layer by electroplating or electroless plating on the upper surface of the polyimide plate, including recesses and convex portions of the polyimide plate; Removing the copper plating layer applied to the upper surface including the iron portion of the polyimide plate through the electropolishing, and to form a copper plating layer plated in the recess portion as a fine pattern circuit.

Therefore, it is possible to form a relatively complex and very fine subcontracting micropattern circuit relatively simple, easy and accurate, which makes it possible to reduce the weight and size of various electronic products.

Nanometer, fine pattern circuit, carbon glass, focused ion beam, polyimide plate

Description

Nano ordered fine pattern curcuit and its manufacturing process

1 is a step-by-step process diagram for explaining a conventional substrate manufacturing method.

2 is a flowchart illustrating a conventional substrate manufacturing method.

Figure 3a to 3h is a step-by-step process diagram for explaining the method of manufacturing the nano-scale fine pattern circuit of the present invention.

4 is a flowchart for explaining the method of the present invention.

Explanation of symbols on the main parts of the drawings

1: carbon glass 2: polyimide plate

3: plasma gas body 4: copper plating layer

11: groove 21: iron

22: main portion 41: fine pattern circuit

The present invention relates to a nano-class micropattern circuit and a method of manufacturing the same, and more particularly, to form a very fine pattern circuit as relatively simple and nanometer-class relatively simple, easy and accurate to contribute to the lighter and smaller size of various electronic products It is invented to be.

In general, a printed circuit board (PCB) is a thin plate on which an electric circuit such as an integrated circuit or a resistor or a switch is soldered, and a circuit used in most computers is installed on the printed circuit board.

Normal printed circuit boards attach copper foil to a thin substrate made of an epoxy resin or bakelite resin as an insulator, and then print a resist on the circuit wiring that is desired to remain as a copper foil, and then print on an etching solution capable of melting copper. After immersing the substrate to dissolve the non-resistive parts and removing the resist, the copper foil remains in the desired shape.Afterwards, insert a blue lead resist where the parts should be inserted and where no lead should be found. It is produced in the form of printing.

However, in recent years, electronic products have become increasingly diverse and light in weight, and accordingly, various electronic components have various functions and tend to be miniaturized. In the case of a general printed circuit board manufactured by the above-described process, There are technical limitations due to the removal of resist using an etchant, including printing technology, and there is a problem in that the holder to which each component is fixed, including a pattern for electrically connecting each component, cannot be formed very finely and very small. .

Substrates such as printed circuit boards used in these electronic products are used in various parts of home appliances such as digital TVs and computers, as well as methods of forming densified patterns in response to the demands of multifunction and miniaturization. Is being developed.

Among these methods, the nanoimprint lithography process involves forming nanostructures on stamps and forming fine patterns on substrates through several steps.

A technique related to such a nanoimprint lithography process is disclosed in Korean Patent Laid-Open Publication No. 2004-84325 (2004.10.06). Such a nanoimprint lithography process is provided with groove grooves on an embossed element stamp. It is formed so that the resist is completely filled in the nanostructure of the stamp.

However, in such a nanoimprint lithography process, a complex shape such as a spherical lens must be made on the upper part of the pattern, and thus the process itself is very difficult and complicated. There is a problem that the process to go through the coating again.

Therefore, in recent years, as a method for solving such a problem, a "substrate manufacturing method" has been developed and presented in Korean Patent Publication No. 10-620384, which is the surface of the substrate 100 as shown in FIGS. A resist coating step (S10) of applying the resist 120 to the resist; Stamping step S15 of pressing the stamp 110 on which the intaglio pattern is formed to the resist 120 of the substrate 100; A resist curing step (S17) for curing the resist 120; A separation step (S19) for separating the stamp (110) from the resist (120) of the substrate (100); A hardening coating step (S21) of applying a conductive hardener 140 to the stamping portion 151 formed by the stamp 110 on the substrate 100; Curing agent curing step (S23) for curing the curing agent 140; Etching step (S25) to etch the resist 120 to form a pattern to form the cured curing agent, the resist coating step (S10) is a hydrophilic material for applying a hydrophilic material 121 on the surface of the substrate 100 The application step (S11), and the hydrophobic material coating step (S13) for applying a hydrophobic material 123 to the surface of the hydrophilic material 121 is configured.

However, such a substrate manufacturing process also includes a step of applying a resist on the surface of the substrate, including a stamping step using a stamp, a resist curing step, a step of separating the stamp from the resist of the substrate, a curing agent applying step, a curing agent and a resist Not only does the manufacturing process itself have a complicated problem such as etching, but also a resist formed of a hydrophilic material and a hydrophobic material is coated on a substrate and combined with a curing agent prepared in a liquid phase to form a fine pattern. Since the meter pattern can be formed, there is a problem that the pattern itself cannot form a very fine nanometer pattern.

The present invention has been devised to solve such a conventional problem, using a focused ion beam (FIB) having an ion beam focusing speed of 0.1-0.5 μm (ie, 100-500 nm). On the surface of carbon glass, which has little expansion rate, grooves having nanometer width and spacing are formed, and a polyimide plate is made to be fusible through heating. Place it on the upper surface of the carbon glass, press it, cool it, and separate it from each other so that nanometer-level irregularities are formed on one surface of the polyimide plate itself. Then, the polyimide plate is placed in a plasma gas body and plasma-treated. Iron on the polyimide plate except the copper plating layer plated in the recess by electrolytic polishing after copper electroplating or electroless plating on the upper surface including the iron and recess of the mid-plate. By removing the copper plating layer coated on the upper surface including the part, the in-ro substrate having the nanometer-level micropattern circuit can be manufactured to form a relatively complicated and very fine uncoated micropattern circuit relatively simple, easy and accurate. It is an object of the present invention to provide a nano-class fine pattern circuit and a method of manufacturing the same that can reduce the weight and miniaturization of various electronic products.

In order to achieve the above object, the present invention provides a nanometer-class width and depth by irradiating a focused ion beam at a predetermined width and interval on an upper surface of a rectangular parallelepiped carbon glass having a predetermined thickness and volume. Forming grooves; Heating the polyimide plate having a predetermined thickness and volume to make it fusible; Placing a polyimide plate having a fusible property on the upper surface of the carbon glass and pressing it through a press to form nanometer-shaped iron parts and recesses in the polyimide plate; Cooling the polyimide plate to solidify and separating from the carbon glass; Placing the polyimide plate into a plasma gas body and performing plasma treatment to form a copper plating layer by electroplating or electroless plating on the entire upper surface thereof, including recesses and convex portions of the polyimide plate; Removing the polyimide plate on which the copper plating layer is formed from the plasma gas body, removing the copper plating layer applied on the iron portion and the upper surface of the polyimide plate through electropolishing, and forming the copper plating layer plated in the recess into a fine pattern circuit; And removing copper powder by washing the upper surface of the polyimide plate.

At this time, the focusing speed of the focused ion beam is characterized in that 100-500nm.

In addition, the width and thickness of the fine pattern circuit formed in the recessed portion of the polyimide plate is characterized in that the nanometer class.

In addition, the nano-scale fine pattern circuit of the present invention for achieving the above object is characterized in that it is manufactured by the above method.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3A to 3H show a step-by-step process diagram for explaining the manufacturing method of the nano-scale micropattern circuit of the present invention, Figure 4 shows a flowchart for explaining the method of the present invention.

According to the manufacturing method of the present invention, the groove having a width and depth of nanometers by irradiating the focused ion beam at a predetermined width and interval on the upper surface of the rectangular parallelepiped carbon glass 1 having a predetermined thickness and volume ( 11) forming step (S1);

 Heating the polyimide plate 2 having a predetermined thickness and volume to make it fusible (S2);

A nanometer-grade convex portion continuous to the bottom of the polyimide plate 2 by placing a polyimide plate 2 having a fusible property on the upper surface of the carbon glass 1 provided with the recess 11 and pressing it through a press. Forming a recess 21 and a recess 22;

Cooling and solidifying the polyimide plate (2) and separating it from the carbon glass (S4) (S4);

The polyimide plate 2 is placed in a plasma gas body 3 and subjected to plasma treatment, including the recessed portion 22 and the convex portion 21 of the polyimide plate 2 by electroplating or electroless plating on the upper surface thereof. Step S5 of forming a copper plating layer 4;

The polyimide plate 2 having the copper plating layer 4 formed thereon is taken out of the plasma gas body 3, and the copper plating layer 4 coated on the upper surface including the convex portions 21 of the polyimide plate 2 is subjected to electropolishing. Removing and forming a copper plating layer plated in the recess 22 into the fine pattern circuit 41 (S6);

Characterized in that consisting of; (S7) to remove the electrolyte by washing the upper surface portion of the polyimide plate (2).

At this time, the focusing speed of the focused ion beam is characterized in that 100-500nm.

In addition, the width and thickness of the fine pattern circuit 41 formed of the copper plating layer on the recess 22 of the polyimide plate 2 are characterized in that the nanometer (nm) class.

In addition, the polyimide plate 2 is characterized in that it is flexible.

On the other hand, the nano-class micropattern circuit of the present invention, which is manufactured by the above method, that is, the polysilicon of the meltable state on the upper surface of the carbon glass (1) where the nanometer-type grooves 11 are formed by irradiation of a focused ion beam The mid plate 2 is placed and pressed to form the convex portion 21 and the concave portion 22, and the polyimide plate 2 having the concave portion 21 and the concave portion 22 is plasma treated to form the concave portion 22. And the copper plating layer 4 is formed on the entire upper surface including the convex portion 21, and then the copper plating layer 4 on the upper surface including the convex portion 21 of the polyimide plate 2 is removed by electrolytic polishing, and the recess 22 is formed. It is characterized in that the fine pattern circuit 41 made of a copper plating layer is formed only inside.

Referring to the effect of the present invention made of such a step and configuration as follows.

First, the present invention is a manufacturing method for forming a nanometer-class micropattern circuit 41 on the flexible polyimide plate (2), and the flexible nano-grade microcircuit pattern circuit board itself produced through the manufacturing method It is a technical component.

In order to manufacture such a substrate, first, as shown in FIG. 3A, a form for forming a nanometer fine pattern circuit using a rectangular parallelepiped carbon glass 1 having a predetermined thickness and volume is formed. This is a nanometer-wide width and depth as shown in Figure 3b through a method of irradiating a focused ion beam having a focusing speed of 100-500nm on the upper surface of the carbon glass 1 at a predetermined width and interval corresponding to the predetermined shape Forming the grooves 11 having a (S1) can be molded through.

In addition, in some cases, the polyimide plate 2 cut to have a certain thickness and volume is placed in a heater (not shown) and pressed (approximately 320 ° C. to increase precision by pressing near the Tg value (melting point value) to enable precision molding). After heating at a temperature of () to have a fusible (S2), the carbon glass (1) having the groove 11 is provided on the upper surface as described above on the support plate of the press (not shown) and as described above thereon A nanometer-grade convex portion 21 and a recess 22 are placed on the bottom surface of the polyimide plate 2 by placing a polyimide plate 2 having a fusible property by heating and operating a press. To form (S3).

That is, the groove 11 is opposed to the shape of the upper surface of the carbon glass 1 by pressing the polyimide plate 2 having the fusible property on the upper surface of the carbon glass 1 provided on the upper surface. On the bottom of the polyimide plate 2, continuous convex portions 21 and recesses 22 of a nanometer (for example, 100-500 nm) grade are formed.

At this time, since the carbon glass 1 hardly causes thermal expansion due to its characteristics, the carbon glass 1 opposes the shape of the groove 11 formed on the upper surface of the carbon glass 1 and the protrusion having a shape protruding between these grooves. The widths and spacings and the depths of the convex portions 21 and the recesses 11 continuously formed on the bottom surface of the plate 2 are molded in the form of maintaining nanometers.

The reason why the carbon glass (1) is used in the above is that a material with high hardness and a good electron beam workability are required in order to press the polyimide molding.

Thereafter, the carbon glass 1 and the polyimide plate 2 are cooled to a predetermined temperature or lower through natural or forced cooling to remove (ie, solidify) the meltability of the polyimide plate 2 (see FIG. 3E). As described above, the polyimide plate 2 is separated from the carbon glass 1 (S4).

As described above, the polyimide plate 2 separated from the carbon glass 1 is placed in the plasma gas body 3 with the concave portion 22 and the convex portion 21 facing upward as shown in FIG. 3F, and subjected to plasma treatment. As shown in FIG. 3G, the copper plating layer 4 by electroplating or electroless plating is formed on the entire upper surface of the polyimide plate 2 including the recess 22 and the convex portion 21 (S5).

When the copper plating layer 4 having the desired thickness is formed on the entire upper surface portion including the recess 22 and the convex portion 21, the polyimide plate 2 is removed from the plasma gas body 3 and subjected to electropolishing. When the copper plating layer 4 coated on the upper surface including the convex portion 21 of the polyimide plate 2 is removed, the copper plating layer plated in the recess 22 is formed on the polyimide plate 2 as shown in FIG. 3H. Only the fine pattern circuit 41 is formed (S6).

At this time, electrolytic polishing (electrolytic polishing) is a metal that is to be polished by the metal polishing method by using a fine convex portion on the metal surface of the anode selectively dissolving compared to the other surface portion during electrolysis as previously known If the plating layer is used as an anode, and the electrolytic solution is electrolyzed at high current density for a short time, the surface of the metal is removed and the copper plating layer 4 coated on the upper surface including the convex portion 21 of the polyimide plate 2 is dissolved. Compared to this, foreign matter does not adhere and a smoother surface can be obtained.

On the other hand, since the electrolytic solution remains on the surface of the polyimide plate 2 after electrolytic polishing of the upper surface portion of the polyimide plate 2 as described above, washing the upper surface portion of the polyimide plate 2 with water or the like Good (S7).

Although the manufacturing method of the nanoscale fine pattern circuit according to the present invention exemplifies only a method of manufacturing a substrate, the present invention can be applied to electronic components such as an IC circuit in which a fine pattern is formed.

Although the above-described embodiments have been described with respect to the most preferred embodiments of the present invention, it is not limited to the above embodiments, and it will be apparent to those skilled in the art that various modifications can be made without departing from the technical spirit of the present invention.

As described above, according to the present invention, grooves having a nanometer-wide width and a gap are formed by irradiating a focused ion beam having an ion beam focusing speed of 100-500 nm on the surface of the carbon glass with almost no expansion rate. The polyimide plate, which is fusible through heating, is placed on the upper surface of the carbon glass and pressed to form nanometer-shaped recesses and convex portions on one surface of the polyimide plate itself. Placing it into a sieve and performing plasma electroplating or electroless plating on the upper surface including the convex and concave portions of the polyimide plate, and then on the upper surface including the convex portions of the polyimide plate except the copper plating layer plated in the concave portion through electropolishing. By removing the coated copper plating layer, a substrate having a nanometer-level micropattern circuit was prepared. By the relatively complex and will be accurately formed while very fine class I for fine pattern circuit is relatively simple and easy are very useful, such as that can be more lightweight and miniaturization of various electronics inventors.

Claims (6)

Irradiating a focused ion beam on a top surface of the carbon glass having a rectangular parallelepiped shape to form grooves having a width and depth of a nanometer level; Heating the polyimide plate to be fusible; Placing a polyimide plate having a fusible property on the upper surface of the carbon glass provided with grooves and pressing the same through a press to form continuous nanometer-shaped iron parts and recesses on the bottom surface of the polyimide plate; Cooling the polyimide plate to remove fussability and then separating from the carbon glass; Placing the polyimide plate in a plasma gas body and performing plasma treatment to form a copper plating layer by electroplating or electroless plating on the upper surface of the polyimide plate, including recesses and convex portions of the polyimide plate; Removing the copper plating layer applied to the upper surface including the iron portion of the polyimide plate through the electropolishing, and forming a copper plating layer plated in the recessed portion as a fine pattern circuit. The method according to claim 1, And removing the electrolytic solution by washing the polyimide plate after molding into the micropattern circuit through electrolytic polishing. The method according to claim 1, The focusing speed of the focused ion beam is a nano-class fine pattern circuit manufacturing method, characterized in that. The method according to claim 1, The width and thickness of the fine pattern circuit formed of the copper plating layer on the main portion of the polyimide plate is nanometer (nm) class manufacturing method of the nanoscale fine pattern circuit. The method according to claim 4, The polyimide plate is a method of manufacturing a nano-class fine pattern circuit, characterized in that the flexible. Nano-class fine pattern circuit, characterized in that produced by the method of any one of claims 1 to 5.

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