KR20180089068A - Method and workpiece of electroforming. - Google Patents

Abstract

The present invention relates to a mold manufactured by electroforming, which does not control growth in a height direction, but controls growth in a lateral direction, and a manufacturing method thereof. According to the present invention, the mold manufactured by electroforming comprises: a step of forming a photosensitive layer on a substrate; a step of forming a protrusion part and a space part in the photosensitive layer through exposure and development processes, wherein the lower width of the space part is developed in a taper shape with a wider lower width than that of an upper width of the space part; a step of performing sputtering on the protrusion part and the space part; a step of forming an electroforming workpiece in a sputtered part through electroforming; and a step of removing the substrate and a photosensitive material from the electroforming workpiece to form a first type mold.

Description

TECHNICAL FIELD The present invention relates to a mold made by a method for manufacturing electric pole and a method of manufacturing the same.

The present invention relates to a mold manufactured by a pole forming method, a method of manufacturing the same, and a work made using a mold manufactured by a pole forming method.

In the present invention, a mold is initially manufactured using a photosensitive material mainly by a process of exposure and development. The shape is made through the electroforming to the three-dimensional shape obtained by using the photosensitive material, and a mold is produced.

Most of the molds of the present invention have protrusions and recesses. The protrusions form a taper in most cases to facilitate demoulding of the workpiece processed in the mold.

The mold thus manufactured is used repeatedly to manufacture workpieces for use in the manufacture of copper, and is also used as a preform die for putting into a plating bath.

There are many kinds of workpieces made by the mold of the present invention.

First, UV molds, epoxy molds, polyimide molds, silicon molds, and other resin molds in which a three-dimensional shape is formed are formed by using molds produced by the electric pole forming method, and the molds are filled with a conductive material such as silver paste And curing them to form various circuits. Such workpieces include chip-on-film, FPCB, ultra-precision circuit, transparent heat wire, electromagnetic wave shielding, and other electronic circuits.

Secondly, the electroforming process is carried out by inserting a metal mold produced by the electroforming process into a plating bath to obtain a polished workpiece having a three-dimensional shape.

Such prismatic workpieces include various printing meshes, screen meshes, filters, and three-dimensional MEMS parts. Particularly, it is possible to make a thick mesh by vertically growing the CNC workpieces, or to produce 3D precise workpieces. The electroforming process is performed on the electroforming mold to make the electroformed workpiece having the three-dimensional shape, and the electroformed workpiece is allowed to grow vertically, thereby making it possible to produce a product having a large thickness and a large opening degree.

Third, a product can be made by bonding a sheet-like film to a polished workpiece made by the second method, filling the polished workpiece with the polished workpiece manufactured by the second method, and demolding the product.

Molds and workpieces made by the method of the present invention, electroforming molds and electroformed workpieces can be used as production methods with remarkable productivity in mesh, microcircuit, chip-on film, MEMS processing, and three-dimensional part processing.

There is a great effect that a workpiece is manufactured in a target in a micrometer-unit size with a relatively high precision. In the case of using the metal mold produced by the present invention as a metal mold for electroplating, it is used for machining a part having a three-dimensional shape, and thus is distinguished from a plating technique generally used. If the plating technique is to form a plating material on the surface, the present invention is a processing technique for forming necessary parts.

When the electroforming die is made by using the present invention, the electroforming workpiece capable of vertically growing can be produced by using the electroforming die of the present invention.

The present invention is also directed to a method for manufacturing such a pole-shaped workpiece and a polepiece obtained by the method.

The electroforming die and the manufacturing method thereof capable of vertical growth are also objects of the present invention.

In general, electroformed workpieces grown by plating grow in the plating solution by electroforming molds. It is essential that the electroforming die capable of vertical growth and the electroformed workpiece vertically grown through the electroforming die are formed.

The present invention also includes a method of processing a polished workpiece and a result of the method. Typical examples of the result are meshes, filters, circuits, and the like.

The mold used in the present invention has a protruding portion and a concave portion.

There are two types of molds used in the present invention, general molds and electric pole molds.

In the electroforming mold, the recess is mainly filled with non-conductive elastic body.

The starting point of the machining of the electroforming die is to laminate a photosensitive material on a conductive substrate, and to expose the photosensitive material to a tapered shape through an exposure technique. Thereafter, a tapered space portion is formed through the developing process. The electric pole die is manufactured in a tapered shape in order to facilitate release of the workpiece.

The present invention is widely applied to the production of thick workpieces. If a taper is not formed, it is practically impossible to demould a workpiece having a small pitch and a large thickness. In most cases, the application of the present invention is based on the assumption that a tapered exposure method is used, but in a special case, the case of not giving a taper is also included.

In the past, polynomial workpieces have been made and used. This is to put a preform die in the plating solution, and to plated the preform die to make a desired plating body.

In general, when a preform metal mold made of a conductive conductor is inserted and electricity is added to the conductor preform metal mold, metal ions move to form a preform workpiece. The preform workpiece is demolded from the mold to produce a preform workpiece.

Generally, when electroforming is performed on the conductive preform die, the electroformed workpieces simultaneously grow in the horizontal direction (width direction) and the vertical direction (height direction).

It is not easy to artificially control the growth direction of the plating.

According to the present invention, there is provided an electroforming die for inducing growth in the vertical direction and suppressing growth in the horizontal direction.

A stagnation region is formed in the space portion formed in the electroforming die so that the flow of the plating solution hardly occurs, by a method of suppressing the growth in the horizontal direction.

When the electroforming die of the present invention is used, as the electroforming is grown in the vertical direction, the stagnant regions are also elevated together in the vertical direction.

In the present invention, a three-dimensional shape in which a taper is formed is obtained by using a photosensitive material, and electroforming is performed on the three-dimensional shape to obtain a mold or electroforming die.

A workpiece or a polished workpiece having a three-dimensional shape is manufactured by using the mold or electroforming die.

In the present invention, first, a case in which electric pole machining is performed using the electroforming die of the present invention will be described. Hereinafter, a technique for manufacturing the mold of the present invention will be described.

The technique of mainly vertically growing the metal structure is the core when the electroforming is performed with the electroforming die of the present invention. The electroformed workpiece having a three-dimensional shape can be produced using the electroforming die of the present invention and utilized in many industrial fields.

The features of the electroforming die of the present invention are as follows.

First, the electroforming die of the present invention can be a single product or a material of a product itself. The electroforming die in the present invention can be used as a workpiece for electroforming itself. Accordingly, throughout the present invention including claims, the electroforming die may be a preform workpiece or a metal mold for electroforming.

Second, the electroforming die of the present invention can be used as a mold capable of producing a large number of electroformed workpieces by repetitively performing electroforming. At this time, the electroforming die has protrusions and recesses, and the recesses fill the parabolic silicon.

The non-conductive body is filled in the concave portion, but the electro-conductive workpiece which is filled with the parabolic shape grows vertically.

Third, the electroforming die of the present invention can be used as a mold capable of being pressed or formed by using a resin or the like.

The article to be the subject of the present invention is various such as mesh, circuit, chip-on film, FPCB, MEMS parts, transparent heat wire, printing mesh, filter, electromagnetic shielding, TSP and the like.

When the electroforming die of the present invention is used, or for the same purpose, the space portion is formed in a tapered shape to facilitate demoulding.

When plating by using electroforming mold, it is necessary to grow in the vertical direction for vertical growth but not in the horizontal direction. To this end, new metal ions should be supplied in the vertical direction and new metal ions should not be supplied in the horizontal direction. In the present invention, an environment should be provided so that vertical growth can be maintained even if a preform workpiece is grown.

The present invention employs a method of processing a pole former to induce vertical growth.

This can be accomplished by using the electroforming die of the present invention for vertical growth.

The electric pole mold is composed of a conductive mold. The conductor mold has a protruding portion and a space portion. The space is filled or coated with a non-conductive material in a parabolic shape.

A stagnation region is formed in the space portion.

In the present invention, electroforming is performed on the electroforming die capable of vertical growth. When a pole workpiece is grown and a pole workpiece is demolded from a pole pole mold, a pole pole workpiece led to vertical growth is made.

The electroconductive workpiece may include a mesh, a printing mesh, a circuit forming mesh using a silver paste, a filter, an electromagnetic wave shielding material, and the like.

Generally, when electroforming is performed on a conductive metal mold, the electroformed workpiece simultaneously grows in the height direction simultaneously with the growth in the width direction.

The present invention is characterized in that growth in the height direction causes free growth and growth in the horizontal direction occurs in the stagnation region of the plating solution.

The stagnation area also increases in proportion to the vertical growth.

The electroformed workpiece made according to the present invention is characterized in that a mesh having a large opening degree can be produced. Particularly, it has a feature that the opening degree is large and the thickness of the mesh can be made thick.

The present invention can produce a large-area product by using the present invention, and expose the photosensitive material in a tapered shape.

The electroformed workpieces produced by the present invention can be made thick.

This can be achieved by controlling the growth direction of the plating. The growth in the width direction is made small and the growth in the height direction is maximized, so that the thickness of the resultant product can be made thick.

The electroformed workpieces produced by the present invention are also used in the production of extremely fine meshes. It is almost impossible to make a mesh with a pitch of 70 micrometers or less, a mesh line width of 15 micrometers or less, a mesh thickness of 30 micrometers or more, and a mesh size of 1 meter or more, respectively.

However, by using the present invention, production becomes easy.

The basic process of the present invention is to fabricate a mold by electroforming to a three-dimensional shape produced by exposing and developing a photosensitive material. Through this process, the shape of the exposed portion formed with the taper is utilized in the mold.

The present invention can be utilized to make a great contribution to the production of a mold for forming circuits or three-dimensional workpieces with extremely fine pitches, minute line widths, and thicker thicknesses.

In order to obtain a thick thickness, a thick photosensitive layer is basically formed. When such a thick photosensitive layer is exposed to a pattern or circuit of fine line width and pitch, and the development process is carried out, most of it can not be developed to the bottom.

In part, even if the phenomenon is at a desired level, there is almost no complete phenomenon over a large area.

Even in such a case, a method capable of manufacturing an almost complete mold is presented in the present invention. By utilizing such a mold, the present invention makes a mold of a pole.

In the present invention, the electroforming die to be produced is characterized in that it forms the electroforming die capable of vertical growth.

In the present invention, the projecting portion and the space portion are formed so as to allow vertical growth when the electroforming process is carried out with the electroforming die of the present invention.

The space is filled with parabolas in a parabolic shape.

Plating begins at the projecting part of the electroforming mold, and when the metal grows, new metal ions are continuously supplied in the vertical direction. However, in the horizontal direction, the movement of the metal ions is stopped to prevent the plating, thereby causing the vertical growth.

As the metal layer grows, the stagnation region, which serves to supply the metal ions in the horizontal direction, also continues to grow, allowing vertical growth to continue.

In the present invention, it is necessary to expose the exposed portion in a tapered shape.

It is difficult to expose the substrate so as to have an inclination with a general parallel light exposure apparatus. However, when the luminous source generating apparatus using the lenticular according to the present invention is used, an angle can be given to the light to be exposed through the function of the lenticular. In addition, exposure of a large area can be facilitated.

The present invention is not described in detail because the apparatus is not a subject. However, in the production of the mold according to the present invention, an exposure apparatus having a light source generating apparatus is very usefully used.

Conventionally, when obtaining a product such as an extremely fine circuit or an extremely fine mesh, it is mainly processed by etching. However, when a product is manufactured by an etching method, it is impossible to artificially control the direction of etching.

In the case of a fine circuit, if the thickness of the base material to be processed is thick, the line width of the circuit to be processed is small, and the pitch of the circuit is small, it can not be manufactured by the etching method. This is because the etching progresses in the vertical direction (the height direction and the depth direction) and simultaneously the etching progresses in the width direction (the horizontal direction and the width direction).

Of course, the same problem also occurs in general electric pole machining. When plating is started in the electroforming mold, the plating proceeds simultaneously in the vertical direction (height direction, depth direction) and width direction (horizontal direction, width direction).

The present invention makes it possible to produce various types of electroformed workpieces, particularly electroformed workpieces of extremely fine three-dimensional shape.

In the case of a very small circuit of a workpiece, it is possible to manufacture the present invention even when the thickness of the circuit to be processed is thick, the line width of the circuit to be processed is small, and the pitch of the circuit is small.

This is possible because, because of the possibility of controlling the growth in the width direction of the preprocessed workpiece to be grown from the electroforming die for producing the microcircuit, it can grow only in the height direction.

Through the present invention, the metal to be plated can be vertically grown when electroforming is performed on the electroforming die. It is necessary to make a tapered exposure part in order to make such electroforming mold.

The reason for having a tapered shape is to facilitate demoulding.

In order to make the electroforming die for vertical growth of the present invention, the space portion is filled with the nonconductive material. The nonconductive material is configured to have a parabolic shape.

The reason for filling the parabolic non-conductive material is to induce vertical growth with little horizontal growth. The vertically grown CNC workpiece is demolded and used as mesh and filter products.

The use of the present invention is easily applied to MEMS technology, which makes extremely fine circuit formation and extremely fine three-dimensional structures. In the present invention, it is generally referred to as a size of several tens of micrometers or less and a few micrometers or less.

However, it goes without saying that the present invention can be applied to a workpiece of several hundreds of micrometers or more depending on the shape of the electric pole workpiece.

The present invention provides a technique for smoothly supplying a plating solution forming a polished workpiece in a vertical direction, but restricting smooth supply in a horizontal direction.

In the present invention, the electroplating does not control the growth in the height direction, but controls the growth in the width direction.

The reason for controlling the growth in the width direction is that the stagnation region is formed in the electroforming die. In this stagnation region, the movement of the plating solution is stagnated and the original activity plating activity is suppressed.

In the present invention, plating is grown in the height direction and the stagnation region is grown by the same height. Therefore, the plating grows actively in the height direction, but the growth is limited due to the stagnation region in the width direction.

It is a feature of the present invention that the stagnation region is continuously grown upward in accordance with the growth of the plating material.

When the stagnation zone is formed, it does not mean that the plating is ZERO. The plating solution is also present in the stagnation region, but the growth is limited because the plating solution is limited. In the present invention, the plating solution is liable to serve as a stagnation region.

In the present invention, the shape of the start to be initially grown in the electroforming die plays a decisive role. In the present invention, the space portion of the electroforming die is configured in a parabolic shape in order to control the start shape.

In order to achieve such a parabolic shape, a typical example of the non-conductive material in the space portion is filled with silicon. The parabolic silicon filler controlling the growth direction of the electroformed workpiece allows the grown electroforming work to actively grow in the vertical direction and suppress the growth in the width direction. Through this, the vertically-grown electrostatic work piece of the present invention is manufactured.

1 is a plan view of a mesh.
Fig. 2 is an explanatory view of the electroforming die according to the present invention.
3 is an explanatory view for explaining that a space of the electroforming die is filled with a non-conductive material in a parabolic shape.
Fig. 4 is an explanatory view for explaining the initial shape of the electroforming die of the present invention.
5 is an explanatory diagram showing the fluidity of the plating solution for the electroforming die of the present invention.
Figs. 6 and 7 are explanatory diagrams illustrating that vertical growth is performed so that plating is not formed in the static region when plating is started on the electroforming die.
8 is an explanatory view for explaining an intermediate process in which the stagnation area 12 is vertically elevated at the same time as the vertical plating 11 proceeds.
Figure 9 illustrates vertical growth.
FIG. 10 is a cross-sectional view of a product obtained by demoulding a polished workpiece grown in a vertical growth electroforming die of the present invention.
11 is an explanatory view for explaining a growth state of a polished workpiece in a general electroforming die.
12 is an explanatory view of a vertically-grown electroforming workpiece by the electroforming die of the present invention.
13 is an embodiment of the vertical growth electroforming die of the present invention.
14 is an explanatory view of the inclination angle of the filling material formed in the space portion.
Fig. 15 is an explanatory diagram for explaining whether or not vertical growth is determined according to the depth of a parabola even in a preform metal mold having the same parabola.
16 is an explanatory view for explaining the height of the projection and the vertical rise due to the distance between the projection and the adjacent projection.
17 is an explanatory view of a removal process for removing a lower growth portion or a maximum width horizontal growth portion generated in the electrophoresis work of the present invention.
Fig. 18 is a view for explaining one embodiment of the present invention and a method of processing a two-type electroforming die.
Fig. 19 is an explanatory view of the electroforming die of the third and fourth embodiments of the present invention. Fig.
Fig. 20 is an explanatory diagram of the electroforming die of the fifth embodiment of the present invention.
Figs. 21, 22, and 23 show examples of the shapes of the patterns constituting the five-shape electroforming die.
Fig. 25 is an explanatory view of an electroforming die filled with a parabolic non-conductive material. Fig.
26 is an explanatory diagram of a step of producing a film on which a circuit is formed by using the electroforming die of the present invention.

The present invention basically involves a method of forming a mold using a three-dimensional shape obtained by applying a photosensitive material to a conductive substrate or a non-conductive substrate, exposing and developing the photosensitive material, and a mold produced through the method.

However, it also includes methods of making molds in other forms.

The mold of the present invention includes a preform die. And a polynomial work produced by using the polynomial is used as an object of the present invention. The electric pole mold means a mold for applying electric power to a mold to form a pole workpiece in a plating bath. In the present invention, a method of making a metal mold for vertically growing, especially among the metal molds, is explained, which is also the core of the present invention.

The most typical prismatic workpiece of the present invention includes a printing mesh for forming a photovoltaic circuit, a microfine filter, and the like. Of course, not only meshes but also microscopic circuits and circuit boards, transparent heat lines, flexible circuit boards, chip-on films, three-dimensional MEMS parts, and processing techniques for processing them are included.

The electroconductive workpiece in the present invention mainly deals with ultra-precision. It is common for line widths and heights to range from a few micrometers to tens of micrometers.

The electroforming die used in the present invention is a substrate made of a conductor. The conductive substrate has a protruding portion and a space portion formed therein. The space portion is filled, coated or coated with a non-conductive material. The non-conductive material serves to form a stagnation region and is mainly formed in a parabolic shape.

In the present invention, by using the electroforming die constituting the stagnation region, the electroformed workpiece to be grown can be grown almost vertically. The non-conductive material constituting the stagnation region is ideal as an elastic body. As a representative example, silicon is used as a main material. Hereinafter, a detailed description will be given based on the drawings.

1 is a plan view of a mesh. In the fine mesh 1, the line width of the mesh is small and the opening degree is large. These are mainly used for fine printing. In recent years, it is widely used to make fine electric current circuits on a substrate that converts sunlight into electric energy. These are mainly used to construct a fine electric circuit using a silver paste through a mesh.

Mesh used here is fine in line width and pitch, and thick in thickness, so it has durability. If the thickness is large, the line width becomes thick and the opening degree becomes small.

However, due to the nature of the product, the aperture must be large and thick. Due to these properties, it is hardly possible to produce by the etching method. In the past, a wire having a diameter of several micrometers was woven to make a quadrilateral mesh.

However, in the present invention, a vertically-grown electroforming die is made and a quadrangular, hexagonal, or circular electroformed workpiece is formed through electroforming to fabricate a mesh. They can be made thinner in line width, thicker in thickness and larger in aperture. Or the force of the mesh can be tapered so that the silver paste can be easily ejected when printing.

In addition to the mesh and the filter, the electroformed workpiece produced by the present invention has various uses. In the present invention, the mesh may be manufactured in various shapes such as a circular mesh, a quadrilateral mesh, and a hexagonal mesh (honeycomb). Conventionally, a thin metal wire is woven to produce a quadrilateral mesh.

In general, the precision mesh reduces the force of the product, that is, the line width, in order to improve the aperture. The thickness of the mesh is made thick to have durability.

The electroformed workpiece according to the present invention will be described on the basis of such a mesh. However, a three-dimensional electroformed workpiece and a two-dimensional electroformed workpiece having various shapes can be manufactured in various products as well as a mesh. In the present invention, the line width and the thickness of the electroformed workpiece are processed into precise electroformed workpieces of several micrometers to several tens of micrometers.

Fig. 2 is an explanatory view of the electroforming die of the present invention. Fig. The electroforming die in the present invention is a preform die for vertical growth.

In the present invention, vertical growth does not mean only vertical growth. The horizontal and vertical growth of the workpieces is carried out. Vertical growth means that horizontal growth is suppressed, but growth is not restricted in the vertical direction.

That is, vertical growth is defined in the present invention in which the growth of the polished workpiece in the height direction (vertical direction) is larger than the growth in the horizontal direction (width direction). In the present invention, the electroforming die for vertical growth means the electroforming die capable of vertical growth.

In the present invention, the electroforming die mainly uses the electrically conductive substrate 4 in which a plate-shaped electricity passes. A number of protrusions (2) are formed on the conductor substrate. The protrusions are also of course made of a conductor and the same body as the substrate. A space portion (3) is formed between the protruding portion and the protruding portion. The size of protrusions and spaces in the present invention is several micrometers to tens of micrometers. A large number of protrusions and voids are formed on a large substrate. The upper portion of the protrusion is formed in a homogeneous flat portion or a homogeneous line shape. The protrusion becomes a start surface or a start line on which the plating solution is grown.

3 is an explanatory view for explaining that a static area is formed by filling a non-conductive material in a space portion of the electroforming die. The material filled in space is non-conductive material. A non-conductive material can be filled, coated or applied to the space portion.

Representative examples of the non-conductive material include silicon and fluororesin.

In the present invention, it is preferable to use a material having a non-conductive material elasticity. If it does not have elasticity, the coating or the filled or non-conductive material will break as the electroforming proceeds. Therefore, the durability of the electroforming die is a problem.

The most representative nonconductive elastomer in the present invention is a silicon material. The nonconductive material filled in the space portion is mainly composed of a parabolic shape. In the present invention, the term " parabolic shape " does not necessarily mean parabolic shape. It means that it is roughly constituted in the form of a parabola.

In the present invention, the application of a nonconductive material in a parabolic shape is a comprehensive expression of filling, coating, or applying a nonconductive material to a space portion. If only one protrusion is observed, it can be expressed that even if the side wall of the protrusion and the lower surface of the space are thinly coated with a nonconductive material, they are filled in a parabolic shape. This is because the lower corners on both sides of the protrusion are automatically filled with a large amount of nonconductive material and applied in a rounded manner.

In an embodiment, when silicon is thinly coated on both sides and the lower surface of the space, silicone is filled in rounded corners at both corners of the lower part of the space part.

At the corners of the upper surface of the protruding part in the electroforming mold, as the slope of the parabolic curve abruptly increases, the stagnation area becomes more active as the depth of the central part of the space part becomes deeper.

 In the present invention, since the upper surface of the protrusion is a portion where plating proceeds, the non-conductive material is not applied to the upper surface of the protrusion. Since the non-conductive material is applied to both sides of the protrusion, the plating does not proceed. Only plating is initiated on the upper horizontal surface of the protrusion. The sides of the protrusions are coated, coated or filled with a non-conductive material in various ways. The most representative example is filling the silicon in a parabolic shape.

The most important factor is that, as shown in Fig. 3, the corners of the upper plane of the protrusions are clean and uniformly grown only when the boundaries are accurate and clean. And non-conductive material begins to fill at both corners of the upper plane of the protrusion. The parabolic curve of this place should be steeply sloped so that the Jeonju workpiece can grow vertically.

FIG. 4 is an explanatory diagram for explaining an initial shape for performing electroforming on a vertically-growing electroforming die of the present invention. When the electroforming die of the present invention is put in the plating bath, the plating solution 7 surrounds the space portion made of the nonconductive material and the upper surface of the projecting portion.

In the present invention, the plating solution is forced to flow in the plating bath so that the plating is uniform and active. For this purpose, it is desirable that the electroforming die can be rotated or moved left and right in the plating bath. Alternatively, the electroforming mold may be stopped and the plating solution may be flowed.

5 is an explanatory view of the stagnation area of the vertically-growing electroforming die of the present invention. When the electroforming die is moved in the plating bath, the upper surface of the protruding portion of the electroforming die is brought into contact with the flowing plating solution to always contact the new plating solution. However, the plating solution in the space where the non-conductive material is filled in a parabolic shape is in a static state without flowing.

The region where the plating solution in the space portion filled with the non-conductive substance is stagnant is defined as the stagnation region 8 in the present invention.

The plating solution in the parabolic space is trapped. The plating solution becomes a state in which the flow is almost stopped or the flow is not activated.

In the present invention, the distance between the protruding portion and the protruding portion is extremely small, and the height of the protruding portion is often higher than the gap. In such a situation, if the space portion is filled with the conductive material in a parabolic shape, the plating solution is trapped in the parabola and the movement is small. A stagnation region is formed. This stagnation region is formed more reliably as the depth of the parabola becomes deeper.

6 to 9 are explanatory diagrams illustrating that vertical plating proceeds in the stagnation region. Plating starts on the vertical growth electroforming die in which the stagnation regions shown in Figs. 6 and 7 are formed.

Plating is not performed in the stagnation region, and vertical growth is performed on the upper surface of the protrusion. The growth of the metal hardly occurs in the horizontal direction of the upper surface of the protrusion, and the metal grows in the vertical direction actively. This is defined as vertical growth in the present invention.

Strictly speaking, some plating can proceed in the downward direction along the shape of the parabola at both corners of the upper surface of the protrusion. However, since the flow of the plating solution is smooth in the vertical direction on the upper surface of the projection, the vertical plating 9 actively proceeds.

Overall, vertical growth is active, but growth is limited in the horizontal direction. As the plating growth portion grows to the upper portion by vertical plating, the stagnation region 10 also becomes higher at the same time. The effect of stacking walls on top of the growing vertical plating part is automatically created, and the congestion area also automatically increases.

The plating continues to grow vertically until the desired workpiece has grown to the desired height. As the electrophotographic workpiece is vertically grown, the height of the stagnation area is also increased, and lateral growth is significantly suppressed due to the stagnation area.

8 is an explanatory view for explaining the process of simultaneously increasing the stagnation region 12 by the vertical growth unit 11. [ As the vertical plating proceeds, the congestion area also automatically increases to the upper part. The reason why the plating is not activated in the stagnation region is that there is no introduction of a new plating solution. The metal ions originally in the stagnation zone are initially depleted. Since there is no introduction of new metal ions, the growth in the horizontal direction is automatically suppressed.

In the stagnation region, metal ions become lean and a new plating solution can not be introduced. As a result, there is almost no plating growth in the stagnation region. Therefore, the plating growth in the horizontal direction only occurs little.

The vertically grown plated body serves to enhance the stagnation area. Initially, the stagnation region is formed by the layered non-conductive material, but when the vertical growth occurs, the vertically grown plating body automatically performs the role of forming the stagnation region. That is, when the height of the vertical growth increases, the height of the stagnation area automatically increases.

Figure 9 illustrates vertical growth. The electroforming is continued until the height of the vertically grown electrostatic workpiece 13 reaches the height of the product. The stagnation area 14 also rises by the height of the electrophoresis workpiece.

In the present invention, as the number of protrusions and spaces formed in the electroforming die is smaller, the vertical growth is better. That is, the stagnation area is well done. The environment for inducing the stagnation area is advantageous as the size of the protrusions and spaces becomes smaller and the depth of the space becomes deeper. The narrower the width of the space portion and the deeper the depth of the space portion, the easier the formation of the stagnation region.

10 is a cross-sectional view of a vertically grown product obtained by demolding a polished workpiece obtained by growing a vertical growth electroforming die of the present invention.

At the beginning of the electroforming process, a release layer is formed on the vertical growth electroforming die for the convenience of demolding. The release layer formed on the upper surface of the protrusion facilitates demoulding of the grown prismatic workpiece.

Even with the use of vertical growth prism molds, the horizontal growth (lateral growth) is not completely absent. The vertical growth in the present invention means that the growth in the vertical direction is large and the growth in the horizontal direction is small as the electrophotographic processing proceeds, and it does not mean that there is no growth in the lateral direction, that is, in the horizontal direction.

In the present invention, it is not said that the growth of the platen workpiece occurs in a straight line. The growth of the electroformed workpiece depends on the direction and velocity of the metal solution, the presence of the additive, the height of the projecting portion, the size of the space portion, the shape and depth of the nonconductive portion filled in the space portion, , And the temperature of the plating solution.

Despite the various circumstances and conditions affecting the growth of the vertically-grown electrophotographic workpiece of the present invention, the magnitude of growth in which the electroforming process grows in the horizontal direction is suppressed, and the size of the growth in the vertical direction (height direction) will be.

The key technology that can produce a product with a thicker product thickness while reducing the line width while increasing the aperture of the resulting product is the formation of the stagnation region.

As shown in the cross-sectional view of the vertically-grown electro-magnetic workpiece, it can be seen that as the electrophotographic process proceeds, the growth in the width direction (horizontal direction and width direction) takes various forms while being affected by various influences. Depending on the magnitude of the stagnation zone effect, the electrostatic workpiece grows most, depending on the flow rate, temperature and direction of the metal solution, and other environmental and physical factors. Therefore, the width of the workpiece can be increased while decreasing vertically.

FIG. 11 is an explanatory view for explaining the growth state of electroconductive workpieces when a conventional electroconductive metal mold is used to produce electroconductive workpieces. Generally, the space between the projections is filled with the non-conductive body 17, and mainly filled horizontally. Although it was tried to fill it horizontally, it is often filled in a gentle parabolic shape in some cases.

In this conventional case, the electro-magnetic workpiece 16 simultaneously grows in the horizontal and vertical directions. Conventionally, horizontal growth is not suppressed when a polished workpiece is grown. Therefore, even if the electroforming process proceeds a little, the grown plated bodies meet each other.

FIG. 12 is an explanatory diagram of a preform workpiece grown in the vertical direction by the vertical growth preform mold of the present invention. FIG.

The cross-sectional shape of the electro-magnetic workpiece varies in various ways depending on the shape of the non-conductive material filled in the space between the projections and the projections. Of course, depending on the height of the protrusion, the width of the space, the shape of the parabola, the depth of the parabola, the direction and velocity of the plating solution, the intensity of the current, and the composition and temperature of the plating solution,

The largest influence on the stagnation region is the height of the protrusion, the width of the space, the shape of the parabola, and the depth of the parabola, and the depth of the parabola has the greatest influence.

However, when the stagnation region is formed, it is commonly grown such that vertical growth is dominant rather than horizontal growth. The electroformed workpieces 18 are obtained in various forms according to the environment of the stagnation region.

The shape and depth of the filling material filled in the space portion are the most influential to the shape change of the electroforming workpiece.

The most desirable form for vertical growth is a deep parabolic shape. Of course, the parabolic form does not mean only a form with a strict parabola. Which means that the non-conductive material is coated, filled, and coated in a parabolic shape as a whole.

The shape of the electroformed workpiece obtained in accordance with the shape of the stagnation region in the electroforming die of the present invention has various shapes such as (A), (B), (C), (D), (E), and (F). Of course, other than the illustrated form is also possible.

In the present invention, all of them are defined as vertically grown electroforming workpieces.

Of course, they did not grow vertically.

These are those that have grown in the vertical direction with some control over horizontal growth, which could not be controlled in general pole forming. In the present invention, these are referred to as vertical growth electroforming workpieces.

Herein, terms for the downward growth portion of the present invention are defined.

The lower growth area is defined as the area where the plating progresses downward from the upper surface of the protrusion when the electrophotographic processing is performed in the vertical growth electrophotographic mold.

(A), (B), and (C), there is no downward growth portion in the electret workpiece 18. All of them were growing vertically within a limited range while growing vertically.

However, the electroformed workpiece of (D) and (F) has a portion that is lower than the upper surface of the projecting portion of the electroforming die. In the present invention, this is referred to as a lower growth portion 19.

The downward growth part is a part of the lower part extending in the downward direction along the parabolic shape of silicon in the initial stage in which the electrophotographic processing is started at the upper surface of the protruding part. And grows only in the vertical direction at the center of the upper surface of the projection. However, in both corner portions of the upper surface of the protrusion, the growth progresses in the downward direction along the parabolic shape of the silicon, and the growth in the lateral direction progresses simultaneously.

Vertical growth proceeds at the center of the upper surface of the protrusion. When the vertical growth is progressively continued upward, the congestion area also becomes higher. The diffusion of metal ions supplied from the stagnation region gradually disappears, so that the downward growth is automatically stopped.

When the electrophoresis workpiece grows in the horizontal direction, the opening degree of the mesh becomes small.

It is desirable to prevent the downward growth portion from occurring in order to improve the aperture of the vertically grown electrophotographic workpiece. Of course, if the growth in the horizontal direction is also suppressed, the degree of opening increases. The most important factor to suppress the growth in the downward and horizontal directions is to deepen the depth of the parabola and increase the slope of the starting parabola.

(E) does not have a downward growth portion, but has undergone the process of making the horizontal growth at a maximum at a relatively early stage when the electroforming begins. In the present invention, the maximum width horizontal growth portion is defined as the portion that maximizes the horizontal growth in the electroconductive workpiece.

The maximum horizontal growth part is also formed in the downward growth part as in (D). (F). All electroformed workpieces have a maximum horizontal growth somewhere.

In the present invention, except for the unusual case, usually the maximum width horizontal growth portion is formed at an initial point of time when most of the electroforming is started.

(E) shows an embodiment in which the horizontal growth portion having the maximum width occurs at an initial stage of starting the electroforming process, and then the line width gradually decreases.

(D) and (F), the maximum width horizontal growth portion is formed below the projecting portion surface of the electroforming die.

When the electrophotographic process is started, the growth progresses in the height direction at the central portion of the upper surface of the projection, but the growth may occur along the non-conductive material at both corners of the projection upper surface. Metal growth proceeds downward along a non-conductive material to some point. After some time, the growth to the bottom stops.

When the electrophotographic workpiece starts to grow, electroforming proceeds also in the downward and horizontal directions along the nonconductive material at the upper surface edge of the projections.

When the electroforming is carried out with the vertical growth electroforming die of the present invention, the electroforming workpiece often has a downward growth portion. By changing the shape of the filling, the depth of the filling, the speed of the plating solution, the width of the space, the height of the projection, the depth of the parabola, etc., some control of the lower growth portion or the maximum horizontal growth portion is possible. It is possible to control the congestion area by controlling these conditions well.

Theoretically, the stagnation region is a place where the flow of the plating solution is stopped and the processing of the electric pole is hardly achieved. However, it is a matter of course that a small amount of plating solution flows in practice. The metal ions existing in the stagnant region can not be prevented from being precipitated by the plating.

In order to make the stagnant region of the present invention, there is a method of coating, filling or applying a non-conductive material to the space portion. Non-conductive materials are easy to apply or fill in parabolic form.

13 is an embodiment of the vertical growth electroforming die of the present invention.

The vertical growth electroforming die of the present invention is a standard type in which protrusions and spaces are formed on a conductor substrate. And the space is filled with a non-conductive material.

The most representative example of the non-conductive material is silicon. Other materials such as other fluorocarbon resins can be substituted. The most representative form of non-conductive material coated or applied or filled is parabolic. The deeper the depth of the parabola, the greater the effect of vertical growth.

The nonconductive material to be filled in the present invention does not necessarily have to be parabolic. In the present invention, the term " constituting a parabolic shape " includes a parabolic shape and a parabolic shape.

And a nonconductive coating is applied thinly on both the wall surface and the bottom surface of the space portion.

Figure (A) shows that the space portion 21 is filled with the parabolic shape 22. The deeper the depth of the central part of the parabola, the stagnant area becomes clear, and the effect of vertical growth is excellent.

The upper surface of the protrusion 20 is generally planar. The upper surface of the protrusions maintains the same overall height and shape to achieve uniform vertical growth. The upper surface of the protrusion is configured in the form of a smooth flat or smooth line.

(B). (C) shows that the non-conductive material is applied to the space portion, coated or filled. These shapes are parabolic, which is difficult to express in any other form, but the function can perform the function of the stagnation region in a parabolic shape.

Coated and filled (24, 26) with a non-conductive material so that the conductor is not exposed to the entire wall surface and the bottom surface of the space portion. At this time, as the depth of the applied or filled space is deeper, the vertical growth effect is excellent.

Fig. 2B illustrates that the horizontal portion 23 is formed at both corners of the upper surface of the protruding portion, where the non-conductive material is horizontally held at the same height. At the end of the horizontal portion, the non-conductive material forms a steep slope to form a stagnation region. In this case, the entire surface of the protruding portion and the space portion is uniformly coated with a non-conductive material, and the upper surface of the protruding portion is horizontally polished.

In this case, the non-conductive material does not directly form a sharp inclination angle at both edges of the upper surface of the projection, but a very small amount of intermediate portion 23 exists. And an abrupt angle is formed at the end of the intermediate portion.

FIG. 5C illustrates that the non-conductive material applied to, coated on, or coated in the space portion forms a sharp inclination angle 25 at both corners of the upper surface of the projection.

FIG. 14 is an explanatory view of the inclination angle of the filling material formed in the space portion in the vertical growth electroforming die of the present invention. The inclination angle plays an important role in filling non-conductive material in the space portion formed between the protruding portion and the protruding portion.

When the inclination angle is too gentle, both the downward growth and the horizontal growth are actively performed at both corners of the upper surface of the protrusion. This is because the flow of the plating solution actively proceeds also in the space portion if the inclination angle is gentle. In this case, the stagnation area can not be formed.

In the present invention, when the space is filled or applied, the center point of the space is the deepest part of the parabola. The deeper the depth of the center of the parabola, the more it helps to grow vertically. This means that the stagnation area is surely established.

FIG. 2A shows that the non-conductive material forms a sharp inclination angle 27 at both corners of the upper surface of the protrusion, and FIG. 2B shows the abrupt inclination angle 28 through the intermediate portion.

FIG. 15 is an explanatory diagram for explaining how the shape of vertical growth is determined according to the depth of a parabola. FIG. If the depth of the parabola is shallow, the stagnation area can not be formed. In the case of Figure (A), the depth of the parabola 29 is shallow, and the plating solution flows actively, so that the shape does not have a stagnation region. Here, it means that horizontal growth and downward growth also actively occur.

(B), the depth of the parabola 30 is deep, so that a stagnation region is formed and the plating solution does not flow, thereby suppressing horizontal growth.

(C) indicates that the non-conductive material applied or filled is an arbitrary shape (31) other than the shape of a parabola. Explain that vertical growth does not occur if the stagnation region is created even if it is not a parabolic shape. Explain that non-conductive materials can be filled or coated in various forms. In the present invention, this form is also included in the term parabolic form.

16 is an explanatory view for explaining the effect of vertical uplift depending on the height of the protruding portion of the vertical up-to-front electric pre-press mold and the width of the space portion. A plurality of projections are formed on the conductor substrate, and a space is formed between the projections. Both walls and bottom of the space are coated with non-conductive material. Plating is not formed in the coated space portion.

However, this is a separate problem from the fact that the plating is not performed and the stagnation region is formed in the space portion. In order to vertically lift the electroplated workpiece to be plated on the upper surface of the protrusion, the space portion is coated with the non-conductive material and the stagnation region must be formed due to the non-conductive material in the space portion.

The vertical elevating electroforming die of the present invention forms a stagnation region in the space portion and suppresses horizontal and vertical growth as much as possible. And the vertical growth is actively formed on the upper surface of the protrusion.

The stagnation region is easily formed when the width b of the space portion is small and the height h of the projection portion is high. In the present invention, the width (b) of the space portion is usually several micrometers to tens of micrometers. When the plating solution is trapped in the narrow space portion, the plating solution becomes a stagnant region in which the flow can not be performed. In order to form the stagnation region, the interval (b) and the height (h) can not be uniquely defined. Elements, including the flow rate of the plating solution, are involved.

According to the present invention, as the electroformed workpiece is vertically grown, the stagnation area of the vertically rising electroforming metal mold is also raised upward.

17 is an explanatory view of a process of removing the lower growth portion or the maximum width growth portion. By subjecting the vertical elevating electroforming die of the present invention to electroforming, a vertically growing electroforming workpiece can be obtained. The vertically rising electrophotographic workpiece may have a downward growth portion or a maximum widthwise horizontal growth portion.

Various environmental factors are controlled to allow downward growth to be suppressed. And also makes the width of the horizontal growth portion as small as possible. Thus, the aperture of the pole piece workpiece can be increased.

If improvement of the numerical aperture is required in the vertically rising electroconductive workpiece, the downward growth portion can be removed and the width of the maximum horizontal growth portion can be reduced. This proceeds through post processing. Such post-processing may remove the downward growth portion to flatten or smooth the surface and greatly increase the opening degree.

The processes for removing the downward growth portion or the maximum width horizontal growth portion are various. The most typical method is to use an electrolytic process, an etching process, or a mechanical polishing process.

Removing the downward growth portion or the maximum width horizontal growth portion further improves the aperture degree. When the electroplated workpiece is grown in the downward direction, side growth is also performed at the same time. Therefore, the aperture becomes narrower.

Generally, the downward growth portion or the maximum width horizontal growth portion is a portion protruding in a sharp shape, so electricity is concentrated. Therefore, this portion is actively etched or electrolyzed.

FIG. 2A is an embodiment in which a preformed workpiece 32 is vertically grown on the upper surface of a protruding portion of the vertical elevating electroforming die 33 of the present invention.

Fig. 5 (B) is a cross-sectional view of a polished workpiece having a downward growth portion 34 formed on the upper surface edge of the projection of the vertical lifting preform mold of the present invention. Fig.

(C) places the blocking plate 35 in a plane opposite to the plane having the downward growth portion of the electro-magnetic workpiece 36 having the downward growth portion 34. The blocking plate is used to remove the downward growth portion, and it is possible to safely protect the upper surface of the electro-magnetic workpiece 36.

Figure (D) illustrates an embodiment in which an etching process or an electrolytic process or a mechanical polishing is performed. The lower growth portion having sharp ends is removed through etching, electrolysis, or mechanical polishing. Since the current is concentrated at the sharp end, the downward growth portion is easily removed in the etching or electrolytic polishing process. Upon completion of the removal process, a polished workpiece 38 having a large opening is obtained.

After machining, the shield plate 37 is removed.

During mechanical polishing, it is preferable to fill the space portion of the electroplating workpiece with a temporary filler so as not to damage the electroplating workpiece.

Diagram (E) is a cross-sectional view of a preform workpiece 39 having a large opening. If the car plate is removed after removing the downward growth portion, a poled workpiece having a large opening can be obtained. The poled workpieces made through these processes become large workpieces. This has a great effect on the production of a mesh or filter or mesh having a large aperture.

It is used extensively for precise printing mesh, silver paste printing mesh, etc., when polynomial workpieces are used as meshes. The electroformed workpiece produced through the present invention has the most ideal characteristics as a precision printing mesh.

First, it is possible to fabricate a mesh with a honeycomb shape, which is the ideal structure of a print mesh. Second, it is possible to manufacture a mesh having a large opening degree. Third, the line width of the mesh can be minimized. Fourth, the thickness representing the durability of the mesh can be increased. Fifth, since the cross section of the mesh has a tapered shape, it is easy to discharge ink or silver paste at the time of printing. Sixth, a conventional woven mesh has disadvantages in that the mesh is moved, but the mesh of the present invention does not suffer from such disadvantages. The mesh of the present invention exerts an excellent effect in many parts.

Fig. 18 is a view for explaining one embodiment of the present invention and a method of processing a two-piece mold. The one-shape, two-shape, three-shape, and four-shape molds described in the present invention are molds used to make the vertically-grown electroforming mold used in the present invention. All of them form a photosensitive layer on a substrate, and the photosensitive layer is subjected to an exposure process and a development process. Through the development process, a three-dimensional structure is formed on the substrate by the exposure part. The first, second, third, and fourth molds of the present invention commonly use a substrate having a three-dimensional structure formed by the exposure unit.

In the present invention, a drier film is mainly used as the photosensitive material. The thickness of the photosensitive material is usually 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, and the like. The surfaces coated with these photosensitive materials on the substrate are coated smoothly and uniformly.

In the present invention, the photosensitive material is exposed through various patterns.

Usually the pitch is 10, 20, 30, 40, 50, 60, 70, 80, 90, and 100 micrometers.

In a circuit, the line width is usually 5, 10, 15, 20, 25, and 30 micrometers.

As an example of the material selection in the present invention, it is assumed that the thickness of the light-sensitive material is 40 micrometers, the pitch is 30 micrometers, the line width is 10 micrometers, and the horizontal dimension X dimension of the product is 40 centimeters by 80 centimeters. Exposure ratios and developing units which allow exposure and presenting with such data have not conventionally existed. However, the present invention makes this possible. Most importantly, it is necessary to use an exposing machine having a concentrating light source generating apparatus which enables the exposure of a large area and allows the fine exposure.

However, even if the exposure and development proposed in the present invention can be successfully accomplished using the optical circulator of the present invention, it is very difficult to produce a perfect product because the phenomenon is always partially developed in one or two places.

According to the present invention, a technique for preventing the occurrence of such a phenomenon from occurring in one or two places is not difficult. This is a breakthrough technology that completely covers the immaturity of the phenomenon by sputtering the conductive metal to perform electroplating, even if the development process is incomplete.

Fig. 18 illustrates a method of manufacturing the one-piece mold and the two-piece mold. The one-shape mold is characterized in that a three-dimensional shape is formed on a substrate using a photosensitive material, sputtering is performed on the three-dimensional shape with a conductive metal, and then a preform is formed to produce a mold.

A three-dimensional shape is produced by the exposure unit. The shape of the exposed portion is tapered to facilitate demoulding.

The photosensitive layer 41 is applied to a substrate 40 mainly made of a flat plate. The photosensitive layer is exposed through a pattern. An exposed portion 42 and an unexposed portion 43 are formed on the photosensitive material.

In the present invention, the exposure unit forms a TAPE shape in the exposure process, thereby facilitating demoulding in the subsequent process. That is, the upper width of the exposed portion is narrower than the lower width. For this exposure, the inventor of the present invention uses a patent-pending light source generating apparatus.

If the upper width of the exposed portion is wider than the lower width, the subsequent demolding process becomes impossible. Even if the upper width of the exposed portion is equal to the lower width, the demolding process becomes almost impossible. Because the thickness of the photosensitive layer is thick, if there is no inclined surface, demoulding becomes almost impossible.

For this reason, according to the present invention, the exposure progresses such that the upper width of the exposed portion is narrower than the lower width. That is, the exposed portion is formed in a tapered shape.

When the unexposed portion is removed through the development process, only a tapered exposure portion remains on the substrate. A protrusion having a three-dimensional shape is formed on the substrate.

The projecting portion 45 and the space portion 44 are formed on the substrate by the exposure portion.

The projection made of the exposure part has a shape in which the upper part is narrower than the lower part. In order to expose such a tapered shape, an exposure apparatus having a toric light source generating apparatus developed by the present inventor is used.

By using this, tapered exposure can be facilitated. The tapered shape can be processed by using the characteristics of the Lenticular lens used in the luminous source generating device.

When the non-visible portion is removed from the substrate through the developing process, only the protruding portion 45 is left. A space portion 44 is formed between the protruding portion and the protruding portion. Even when the development is completed, the remaining photosensitive material 46, which has not been completely removed from the space portion, often remains. It is often the case that the remaining photosensitive material remains on the bottom surface of the substrate.

If the thickness of the photosensitive layer is as thin as several micrometers or less, exposure and development can be performed so that the remaining photosensitive layer is not formed. However, if the thickness of the photosensitive layer is large, it is too high to fail to develop the photosensitive layer so that there is no remaining photosensitive layer. If the size of the mold is to be made large, it is concluded that even if the remaining photosensitive layer remains in at least one or two places in the entire area, this phenomenon fails.

In the present invention, a three-dimensional mold is produced by using a photosensitive material having a thickness of several tens of micrometers. In addition, the size of the mold to be produced is often made large.

When a precision mold is manufactured, the width of the space portion is very narrow and the thickness of the photosensitive layer is thick, so that no matter how fine the phenomenon is, it is a reality that it is impossible to completely remove the remaining photosensitive material by a general developing technique. Therefore, if the mold is manufactured under the premise that the residual photosensitive material is completely removed, the probability of failure is too high.

For this reason, in the present invention, it is assumed that a remaining photosensitive material exists. Discloses a technique for producing an excellent mold despite the presence of a residual photosensitive material.

When the development process is completed, a projecting portion is formed on the substrate by the exposure portion. And a space portion is formed between the projecting portion and the projecting portion. A remaining photosensitive material remains in the part of the space.

In this reality, the sputtering process 47 is performed on the upper surface of the projecting portion, the space portion, and the remaining photosensitive material with the conductive metal. Through the sputtering process, the upper surface of the projection, the space, and the remaining photosensitive material are given conductivity.

The release layer is again formed on the sputtered substrate.

Electricity is passed through the sputtering layer that can be energized, and electric pole machining is performed to grow a pole workpiece.

The obtained electroforming work 48 is demoulded.

The demolded prismatic workpiece is defined as a one-form mold. The one-piece mold has a shape in which a plurality of projections are formed on a conductive substrate. A space 50 is formed between the projection 49 and the projection.

The height of the upper surface of the protruding portion may differ depending on the influence of the remaining photosensitive material. The portion where the remaining photosensitive material has no influence is the bottom surface of the space portion. The bottom surface of the space portion is a clean plane, which preserves the surface roughness of the photosensitive material.

The one-piece mold manufactured in this way is a breakthrough method that can be manufactured as a complete mold even if the remaining photosensitive material is present. The remaining photosensitive material gives a slight change in the height of the projecting portion, and the upper surface of the projecting portion can be roughened by the influence of the remaining photosensitive material.

In the present invention, even if the substrate to which the photosensitive layer is initially applied is a conductive substrate, electric power is not applied to the substrate to perform direct electric processing. Instead, a sputtering layer is formed of a conductive metal, a two-layered layer is formed, and the sputtering layer is energized to perform electric pole machining.

If electricity is directly applied to the conductive substrate without sputtering and electroforming is performed, defects may occur in the portion where the photosensitive material is left. However, if the remaining photosensitive material is sputtered with a conductive metal, then electricity is applied to the sputtered portion to perform electric pole machining, electric pole machining is performed even if there is a remaining photosensitive material.

The one-piece mold 51 is formed with a protruding portion 49 and a space portion 50.

Due to the influence of the remaining photosensitive material, the heights of the projections are minutely different.

The upper surface of the protrusion forms an unclean surface due to the influence of the remaining photosensitive material. However, the bottom of the space portion has a surface roughness of the photosensitive material and is smooth and clean.

The height of the bottom of the space is uniform. The bottom of the space portion has the surface roughness of the photosensitive material as it is, and all the heights are uniform. In the present invention, a portion preserving the surface roughness and height of the photosensitive material is defined as a storage surface.

The one-piece mold is constituted by the projecting portion 49 and the space portion 50, and the bottom of the space portion is a storage surface. One type mold is a good mold formed with a preserving surface underneath the space portion even if there is a remaining exposure material.

However, if an ideal development process is possible without remaining residual photosensitive material, the manufacturing method of the one-piece mold can be made simpler. But this is not possible with hope. However, theoretically, assuming that exposure can be performed without leaving a residual photosensitive material, the substrate is used as a conductive substrate.

After exposure and development, a release layer is formed without sputtering. Then, the electroconductive substrate is directly energized to perform electric pole machining. If the obtained preprocessed workpiece is demoulded, the same mold as the one-shaped mold can be obtained. However, at this time, if a small amount of the photosensitive material remains, a portion of the photosensitive material may fail to be plated and the one-piece mold may fail. If a photosensitive material remaining in a part of the substrate remains, plating defects are caused, and a polished workpiece is not formed or scratches are formed in the portion. Thus, even if it is well made, it becomes a failed mold with a flaw that can not be improved.

In order to manufacture a two-piece mold, a release layer is formed on the one-piece mold. A new electroforming workpiece 52 is formed by performing electroforming. When a new electroforming workpiece is demolded from a one-piece mold, it becomes a two-piece mold.

The two-dimensional mold is the same as that formed on the conductor substrate by the projecting portion and the space portion. The upper surface of the protrusion of the two-piece mold is constituted by a preserving surface. That is, the upper surfaces of the projections of the two-piece mold are smooth and all have the same height. When the non-conductive material is filled in the space portion of the two-piece mold to form the stagnation region, it becomes the electroforming mold capable of vertical growth.

If there is no taper angle of the projecting portion or the angle is too small in the mold of the present invention, demoulding of the electroforming workpiece is difficult. If it is difficult to form a taper on the protrusion, a flexible mold is proposed for demolding.

The elastic mold forms a release layer on the substrate on which the three-dimensional shape is formed, before the sputtering process, in the one-piece mold manufacturing process. Instead, the sputtering process is not carried out, but instead a flexible material such as silicone is poured into the moldings.

When silicone is molded under high temperature and high pressure, a flexible and durable elastic molding is produced. Thereafter, the resilient molding is demolded. Even if there is no taper, the molded article has elasticity, so demolding is easy. In the present invention, this is defined as a one-dimensional elastic mold. 1 shape The elastic mold has the same shape as the one-shape mold.

To fabricate a two-piece mold, a one-dimensional resilient mold is sputtered with a conductive metal and a release layer is formed thereon. Electricity is applied to the sputtering layer to perform electroforming. When the workpiece is finished, the workpiece is demolded from the elastic mold. Silicone mold has elasticity, so it is easy to demould the workpiece. The demoulded preform workpiece becomes a two-piece mold. The electret workpiece has a protruding portion and a space portion. The upper surface of the protrusion is formed as a preserving surface. When the non-conductive material is filled in the space portion of the two-piece mold to form the stagnation region, it becomes the electroforming mold capable of vertical growth.

Use a two-piece mold to make a vertical growth preform.

When a one-piece mold (or one-shape elastic mold) is used, a flexible circuit board can be manufactured. To this end, a release layer is formed on a one-shape elastic mold or a one-mold mold. A liquid resin is injected onto the release layer. Then, a flat film or a roll-like film is placed on the liquid resin.

Examples of the liquid resin include UV resin, epoxy resin, polyimide resin, and the like.

The liquid resin is bonded to the film while being molded and dried. The liquid resin is molded and cured, and the film is bonded and demolded from the one-shape elastic mold or the one-mold mold.

The deformed flexible circuit board is a circuit board having protrusions and recesses. The upper surface of the protrusion is smooth and the height becomes the same. When a conductive material such as silver paste is injected into the concave portion of the circuit board and cured, a circuit is formed into a flexible circuit board. As the liquid resin, various types of liquid resin such as epoxy resin, polyimide resin, and UV resin are used.

In the present invention, various types of elastic molds can be manufactured by the above-described method.

In the present invention, depending on the type of the mold or the elastic mold, the storage surface is on the upper surface of the protrusion or on the lower surface of the space portion. These preserving surfaces play an important role in ensuring that the surfaces of the polished workpieces are smooth and have the same height.

When designing a product using a mold or an elastic mold of the present invention, the surface of the final product should be designed to be smooth and uniform at all times.

These flexible molds are used in various places. First, a preprocessed workpiece is prepared from a flexible mold, and the preformed workpiece is demolded to be used as a product. In addition, a resin film substrate in which a circuit is molded through a flexible mold can be manufactured.

In the present invention, when formation of a taper is difficult, a flexible mold is manufactured in consideration of demolding of the product. In the present invention, a final product is produced by using a mold, an electroforming die, and a flexible mold. The upper surface of the protrusions formed in the final product is to be a preservation surface so that the surface of the product is smooth and the protrusions are the same height.

Fig. 19 is an explanatory view of a mold according to the third and fourth embodiments of the present invention. Fig.

This is done using one or two molds. The three-shape mold and the four-shape mold of the present invention have the same pitch as the pitch of the one-shape mold or the two-shape mold. However, the size of the protruding portion and the space portion can be different from that of the one-piece mold or the two-piece mold.

Fig. 19 illustrates a process of making a three-metal mold and a four-metal mold in the one-metal mold of the present invention. The one-piece mold 58 constituted by the projecting portion 54 and the space portion 55 is subjected to additional electric pole machining. When additional electric pole machining is performed, a plating layer having a substantially uniform thickness is formed on both the upper surface of the protrusion of the one-piece mold and both side portions of the protrusion. At the same time, a plating layer is formed at almost the same thickness at the bottom of the space portion. Such a plating layer enlarges the size of the projecting portion and at the same time reduces the size of the space portion. However, the pitch is unchanged.

A new plating layer 59 is added to the one-piece mold. The height and width of the protrusions are increased due to the new plating layer. The width of the space portion is reduced. However, the pitch is kept the same. Through this method, the size of the protrusion and the size of the space can be precisely controlled. Through this method, a new mold is produced by making the size of the projections and spaces the desired size.

By performing additional electric pole machining on the one-piece mold, a three-piece mold 60 is obtained in which the pitches are maintained but the sizes of the protrusions and spaces are adjusted. In the three-dimensional mold, the lower surface of the concave portion becomes the storage surface as in the one-piece mold.

A mold releasing layer is formed again on the three-dimensional mold 62, and a pole forming process is performed on the mold releasing layer to prepare a pole forming workpiece 61, and demolding the pole forming workpiece 61 obtains a four-shape mold 66. In the four-piece mold, the upper surface of the protrusion 63 serves as a storage surface.

In the same process as that of the molds of the 3-shape and the 4-shape in the 1-shape mold, 5-shape and 6-shape are produced in the 2-shape mold.

The mold manufactured by the present invention can serve as a mold itself or can be used as a product. Each of the molds of the present invention is used to produce a preform mold used in the present invention. In the present invention, the electroforming die means a mold capable of performing the electroforming process.

Fig. 20 shows an embodiment of the vertical elevating electroforming die of the present invention. In this embodiment, the electroforming die is manufactured by a completely different method without using the above-described one-type mold, two-type mold, and three-type mold. This embodiment uses a conductive substrate.

A photosensitive layer is formed on the conductive substrate 68. The thickness of the photosensitive layer is preferably thin. The photosensitive layer is exposed to light through a pattern to form an exposed portion 67 having a required shape and size. The unexposed portion is removed through the developing process. A thin photosensitive layer is preferable in order to completely remove the unexposed portion. The area where the unexposed area is removed is called the space area. A release layer is formed in the space portion and the exposed portion of the conductive substrate.

Electricity is applied to the conductive substrate in the plating bath so that a polished workpiece is produced on the release layer. The plating layer is initially formed only in the space portion. When the plating layer is grown above the height of the photosensitive layer in the space portion, the plating layer progressively diffuses on the exposed portion.

The plating layer diffuses through the upper part of the exposure part at a substantially uniform speed.

As plating progresses, the thickness of the plating layer becomes thicker.

Each of the plating layers grows in the horizontal direction and the vertical direction, and diffusion proceeds at the upper portion of the exposure portion. The interval between the plating layer and the adjacent plating layer gradually decreases. When the gap between the plating layer and the plating layer becomes a desired size, the electroforming is stopped. This is referred to as a base plating layer 69. The distance between the plating layer and the adjacent plating layer in the basic plating bath becomes the size of the projection of the vertical growth electroforming die to be completed later.

The base plating layer started to grow from the space portion of the conductive substrate. When the plating layer is grown above the height of the photosensitive layer in the space portion, the plating layer spreads at the upper portion of the exposure portion. At this time, the plating layer grows simultaneously in the horizontal direction and the vertical direction.

The electroplating process proceeds at a uniform speed and finally grows to the base plating layer 69.

When the base plating layer 69 having a desired shape and size is formed, the electroforming is stopped.

The base plating layer is an aggregate of a number of plating layers. The plating layer and the plating layer are formed at regular intervals. The gap between the plating layers becomes a new space portion.

The bottom surface of the new space portion is the surface of the exposure portion. As the plating layer of the plurality of plating layers becomes thicker and larger, the new space portion is automatically reduced.

A release layer is formed in the base plating layer (69) and the new space portion, and is again subjected to electroplating to form a preform workpiece (70). The preform workpiece is demoulded.

The demoulded preform workpiece 72 is provided with a protrusion and a space 71. In order to form a stagnant region in the electroconductive work, the space is filled with a non-conductive material having elasticity such as silicon. The preprocessed work in which the stagnant region is formed becomes a vertically-grown electroforming die. The shape of the non-conductive material is made into a parabolic shape to form a stagnation region. Usually, the filled shape of the non-conductive material becomes the parabolic curve 73. The vertical growth electroforming die is composed of a protruding portion 74 and a non-conductive region filled with a parabola. Care is taken not to cover the non-conductive material on the upper surface of the projecting portion. This is another embodiment of the vertical growth electroforming tool 75 of the present invention.

Figs. 21, 22, and 23 show examples of the pattern shapes constituting the vertically-grown electroforming die of Fig. Vertical growth prism molds can be configured in various patterns. Patterns can be composed of regular patterns such as circles, squares, and hexagons and irregular patterns. Depending on the shape of the pattern, various circuits, meshes, and various other types of three-dimensional workpieces can be obtained.

21 illustrates that the circular space portion 77 is formed in the middle of the exposed photosensitive layer 76. FIG. The photosensitive layer is uniformly applied to a conductive substrate.

A release layer is formed on the conductive substrate, and the conductive substrate is energized to perform electropolishing. When electricity is applied to the conductive substrate and plating is performed in the plating bath, a plating layer starts to be formed in the circular space 77. After completion of plating in the circular space portion, the plating layer gradually diffuses in the exposure portion 76. When the plating layer is further grown, the exposed portion of the conductive substrate is covered with the circular plating layer while leaving only a small space portion, as shown in the right drawing of Fig. The electroplating is grown simultaneously in the top and side directions. When the shape and size to be produced reach, stop the processing of the electric pole.

The interval between the circular plating layers becomes a new space portion. The bottom surface of the new space portion is the surface of the exposure portion. As the plating layer of the plurality of plating layers becomes thicker and larger, the new space portion is automatically reduced.

A release layer is formed in the base plating layer and the new space portion, and the preformed workpiece is again formed by electroforming. The preform workpiece is demoulded. A projecting portion and a space portion are formed in the demoulded preform work. In order to form a stagnant region in the electroconductive work, the space is filled with a non-conductive material having elasticity such as silicon. The preprocessed work in which the stagnant region is formed becomes a vertically-grown electroforming die. The shape of the non-conductive material is made into a parabolic shape to form a stagnation region. Usually, the filled shape of the non-conductive material becomes a parabola. The vertical growth electroforming die is composed of a non-conductive region filled with a protrusion and a parabola. Care is taken not to cover the non-conductive material on the upper surface of the projecting portion. This is yet another embodiment of the vertical growth electroforming die of the present invention.

22 illustrates that the rectangular space portion 80 is formed in the middle of the exposed photosensitive layer 81. FIG. The photosensitive layer is uniformly applied to a conductive substrate.

23 illustrates that the hexagonal space portion 84 is formed in the middle of the exposed photosensitive layer 85. FIG. The photosensitive layer is uniformly applied to a conductive substrate.

FIGS. 22 and 23 show still another embodiment of the vertical growth electroforming die through the same process as in FIG.

Fig. 24 is an explanatory view of an electroforming die filled with a parabolic non-conductive material. This is an explanatory view for explaining the production of a preform casting mold capable of vertical growth by filling non-conductive material into a thin metal mold with protrusions and spaces.

The non-conductive material 89 is filled in the space portion formed between the projecting portion 88 of the mold and the projecting portion. Non-conductive materials with elasticity are ideal. The use of a non-conductive material having elasticity increases the durability of the mold. In the case of a mold filled with a non-conductive material having no elasticity, when a growing plated layer is formed, the non-conductive material is easily broken by the dog layer. In order to prevent this, fill with elastic non-conductive material. The most representative of these elastic non-conductive materials is silicon.

In the present invention, silicon is used as a base material and various additives are added to improve the function.

The most important key technique in the vertical growth electroforming die of the present invention is to fill the space with a flexible non-conductive material so that the filling material has a steep slope at the edge of the upper surface of the projection, and the depth of the parabola must be deep .

In the vertical growth electroforming die of the present invention, inducing the electroplated layer to vertically grow is one of the core technologies. For this purpose, the inclination of the filling material should be such that the filling material has a steep slope. The most typical shape for this is a parabolic shape.

When electroplating is performed on the vertically growing electroforming die filled with the parabolic non-conductive material, the vertical plating portion 90 is grown on the projecting portion. Strictly speaking, it does not grow perfectly vertically, but it does vertical growth that can not be achieved by other plating. This vertical plating part is demolded and used as a product.

In the manufacturing method of the product, the vertically grown plating portion 92 is adhered to the rolled film or sheet-like film 91 using an adhesive in a state where the vertically grown electroforming die is not demolded. Thereafter, the plating portion joined to the film is demoulded to produce a product with the circuit 93 attached to the film 94. [

In addition, to ensure product stability, the circuit may be further stabilized by filling non-conductive material (95) between the circuit and the circuit.

25 is an explanatory view for explaining a step of making a flexible circuit board using various molds of the present invention.

Among the various molds 98 of the present invention, a mold having a preserving surface at the bottom of the space portion is used. A liquid resin 97 such as a liquid epoxy resin, an ultraviolet adhesive, or a polyimide is injected between the mold and the film substrate 96.

And the liquid resin is molded and cured. The film 102 formed with the engraved 101 is demolded by the resin molded from the mold. As a material of the film substrate, a polyimide film is the most typical embodiment.

The engraved angle is formed between the protrusion and the protrusion. It is preferred that the upper portion 99 of the projection is a preserved surface. So that the height of the upper surface of the projection is uniform and the surface of the product is clean.

A space portion of the film on which the space portion is formed is filled with a fluidic conductor 103 such as a silver paste, and the fluidic conductor is cured to form a circuit.

It is preferable to form a release layer such as a fluororesin on the upper surface of the protrusion before filling the silver paste. This is to ensure that silver paste is not applied to the upper surface of the protrusion but only silver paste is filled in the space portion. If a release layer is formed of fluorocarbon resin, it is possible to clean the surface even if silver paste is on the upper surface of the protrusion.

26 is an explanatory diagram of an embodiment in which a mesh is manufactured using the vertical growth electroforming die of the present invention.

Non-conductive material is filled in the space portion of the electroforming die 104 having the projecting portion 105 and the space portion 106. The non-conductive material filled in the space part forms the parasitic silicon 107 to form the stagnation area.

A mold releasing layer is formed on the vertically-growing pre-press mold in which the stagnation area is formed. And electroforming is performed on the upper surface of the projection. On the upper surface of the protrusions, a vertically growing prismatic workpiece 108 is formed.

The mesh 109 is fabricated by demoulding the electroformed workpiece.

These meshes are used as a mesh to draw the circuit of the condenser that converts sunlight into electricity. Printing the silver paste through the mesh has many advantages.

Since vertical growth is used, the opening degree is large and the line width of the forceps can be made small. Further, the thickness of the product is thick and durable, and taper is formed, which facilitates the discharge of the silver paste.

The flexible circuit board can be manufactured by utilizing the various types of dies introduced in the present invention. An embodiment for making a flexible circuit board will be described. In this embodiment, the following three types of substrates or molds or molds are used.

First, a substrate is provided with a photosensitive layer, a photosensitive layer is formed on the photosensitive layer, and a protrusion and a space are formed on the substrate through a developing process. Second, a mold having protrusions and spaces. Third, a flexible mold having protrusions and spaces formed therein.

One of the above three forms is used. It is preferable that the storage portion is formed on the bottom surface of the space portion. A release layer is formed on the upper part of the protruding portion and the space portion, and the liquid resin is applied after the release layer is dried. The polyimide film substrate is placed on the liquid resin before the liquid resin is cured. The liquid resin has a uniform height, and is cured at the same time as the molding, and is adhered to the polyimide film substrate.

A film substrate bonded with the resin molded from the substrate or the mold or the elastic mold is demoulded and a release layer is formed on the upper surface of the protrusion of the demoulded film substrate. A flexible circuit board is fabricated by filling silver paste in the space portion of the film substrate. The liquid resin may be an epoxy resin, a UV resin, or a polyimide resin. The height of the upper surface of the protrusion becomes a uniform height, and a clean and organized flexible circuit board can be manufactured.

Two embodiments in which a flexible circuit board is manufactured by using a vertically grown electroconductive workpiece as a circuit will be described.

A protruding portion and a space portion are formed in the conductive metal mold, and a non-conductive material is filled, coated or applied to the space portion to form a stagnation region, thereby fabricating a vertically grown electroforming die.

 A release layer is formed on the vertical growth electroforming die and electroforming is performed to produce a vertically growing electroforming workpiece.

The upper surface of the electrophotographic workpiece is bonded to a roll-shaped film substrate or a sheet-like film substrate via an adhesive.

A flexible circuit board is manufactured by demolding a film substrate to which a vertically growing electrophotographic workpiece is bonded in the electroforming die.

The space portion of the flexible circuit board may be filled with the liquid resin in order to reinforce the stability of the circuit, and the liquid resin may be cured.

Here, a detailed description will be given of how to make good-sized molds even if the photosensitive material is not completely developed during the mold making process and the remaining photosensitive material remains.

Forming a photosensitive layer on the substrate; The photosensitive layer forms a tapered exposure portion having a top width narrower than a bottom width through a pattern. The unexposed portion is removed through the developing process, and a space is formed in the substrate. The remaining photoresist may remain in the space portion.

Generally, if there remains a small amount of photosensitive material remaining in the developing process, a failed mold is produced. This is a technical difficulty that is difficult to overcome when using a thick photosensitive layer. In order to solve such a problem, the present invention discloses a technique of sputtering a conductive metal on a projecting portion, a space portion, and a remaining photosensitive material.

After a release layer is formed on the sputtering layer, electroforming is carried out to prepare electroforming workpieces. The preform workpiece is demoulded to produce a one-piece mold.

The step of manufacturing the flexible circuit board using the one-piece mold described above will be further described. A release layer is formed on the one-piece mold, a liquid resin is filled in the upper part of the release layer, and a roll-like or sheet-like film substrate is placed on the liquid resin. The liquid phase can be an epoxy resin, a UV resin or a polyimide resin.

After the liquid resin is cured, the film substrate is demolded from the one-piece mold to produce a film substrate having a protruding portion and a space portion.

A release layer is formed on the upper surface of the projecting portion of the circuit board, and a silver paste is filled in the space portion to manufacture a flexible circuit board.

The upper portion of the protruding portion of the flexible circuit board thus fabricated becomes a storage surface, and a flat and clean upper surface can be obtained. This is an original technique that excludes the influence of the residual photosensitive layer.

In the present invention, the flexible circuit board can also be manufactured using a flexible mold. A photosensitive layer is formed on a substrate, and an exposed portion is formed on the photosensitive layer through a pattern. A protrusion and a space are formed on the substrate through a developing process. A release layer is formed on the projecting portion and the space portion, and an elastic liquid material is filled in the upper portion of the release layer to form an elastic molded product. After the elastic material is cured, it is deformed to produce a flexible mold.

A release layer is formed on the flexible mold, a liquid resin is applied on the release layer, and a roll or sheet film substrate is placed on the liquid resin.

Thereby making the height of the liquid resin uniform. The liquid resin is molded while being cured and bonded to the film substrate at the same time. The film substrate is demolded from the elastic mold. The space portion of the film substrate is filled with silver paste.

The liquid phase is an epoxy resin, a UV resin or a polyimide resin. A release layer is formed on the upper surface of the protrusion formed on the film substrate, and the space portion is filled with silver paste.

In the present invention, when exposure is performed using a photosensitive material, an exposed portion having a tapered shape whose upper width of the exposed portion is narrower than the lower width is formed. This serves to facilitate demoulding in subsequent processes.

When the photosensitive layer is formed on the conductive substrate and the photosensitive layer is exposed through the pattern, the top width of the exposed portion may be tapered to be narrower than the bottom width to facilitate demoulding. When the flexible mold is used in the present invention, it is mainly used when the protruding portion is difficult to be formed into a tape shape. If the protrusion is made in a tapered shape, a resin mold using ordinary resin is produced without using a resilient material.

Since the protruding portion of the resin mold is formed in a tapered shape, demoulding is possible. Therefore, such a resin mold can be used for various purposes. A release layer may be formed on the resin mold to produce a product.

It is also possible to prepare a polished workpiece by forming a release layer after sputtering a conductive metal on the resin mold.

In another embodiment of the present invention, when the exposure and development process is completed and the remaining photosensitive layer is not left, a conductive substrate is used to conduct electroplating to form a mold. A flexible circuit board can be manufactured using the mold.

Usually, the photosensitive material should be 20 micrometers or less in thickness and the size of the product should be small to prevent the remaining photosensitive material from remaining.

It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit of the invention, The present invention is not limited thereto.

1: Non-visible area
2: Exposure section
3: Photosensitive layer
4: conductive substrate

Claims (57)

Forming a photosensitive layer on a substrate;
Forming a protruding portion and a space portion through the exposure and development process on the photosensitive layer, wherein the lower width of the space portion is wider than the upper width of the space portion;
Sputtering the protrusion and the space;
Forming a preform workpiece on the sparring part by electroforming;
And removing the substrate and the photosensitive material from the electroplating workpiece to form a one-piece mold. The method of processing a one-piece mold according to claim 1, wherein a remaining photosensitive material remains on the surface of the substrate at a lower portion of the space portion. The method of processing a two-piece mold according to claim 1, wherein a mold releasing layer is formed on the one-piece mold and the former workpiece is formed to form the former workpiece, and the former workpiece is separated from the one mold. The method according to any one of claims 1 to 3, further comprising the steps of: performing additional electroforming on the one-piece mold or the two-piece mold so as to readjust the dimensions of the projecting portion and the space portion while maintaining the pitch of the mold. The mold according to claim 4, characterized in that a release layer is formed on the mold having the projected portion and the space portion readjusted, and the former workpiece is formed by forming the former workpiece, and the former workpiece is separated from the mold and used as a new mold Processing method. A mold produced by any one of claims 1 to 5. A mesh or filter made by using the mold of claim 6, a heat wire or a three-dimensional circuit, and a three-dimensional ultra-precise electrostatic workpiece. 1. A method for manufacturing a preform casting mold for inducing vertical growth,
The conductor mold has a protruding portion and a space portion;
Wherein the space portion is filled with a non-conductive material, coated or applied to form a stagnation region. The method according to claim 8, wherein the conductive metal mold is a two-type or four-metal mold. The method according to claim 8, wherein the conductive metal mold forms a photosensitive layer on the conductive substrate;
Forming a conductive substrate having a three-dimensional shape of a protruding portion and a space portion through exposure and development processes on the photosensitive layer; Forming a preprocessed workpiece by electroforming the conductive substrate; Wherein said electroconductive workpiece is demolded from a top conductive substrate to produce a conductive mold. A method of manufacturing a vertically-grown electroforming die according to claim 8, wherein the electroforming process is further performed on the conductive metal mold to use the electroformed workpiece having the same pitch but the size of the protruded portion and the voided portion as the new electroformed metal mold . The conductive metal mold according to claim 8, wherein the conductive metal mold is formed by sputtering a conductive metal on an elastic mold, forming a release layer on the sputtering surface, performing electropolishing on the sputtering surface, Wherein the method comprises the steps of: The method according to claim 8, wherein the non-conductive material is an elastic body, and the elastic body is formed in a parabolic shape in the space. The method as claimed in claim 8, wherein the vertically-grown electroforming workpiece has a downward growth portion or a maximum width horizontal growth portion. 9. The method of claim 8, wherein the non-conductive material is silicon. The method as claimed in claim 8, wherein the upper portion of the protrusion is a storage surface. The electroforming die produced by any one of claims 8 to 16. A mesh, a filter, a hot wire or a three-dimensional circuit, or a three-dimensional ultra-precise electrostatic workpiece produced by subjecting the electroforming die of the seventeenth aspect to electroforming. 19. A preform workpiece according to claim 18, wherein the downwardly grown portion of the vertically grown electroforming workpiece is removed by an electrolytic polishing or etching process or a mechanical polishing process. 19. A preform workpiece according to claim 18, wherein the maximum horizontal growth portion of the vertically grown electroforming workpiece is removed by an electrolytic polishing or etching process or a mechanical polishing process. In a method for working a vertically grown electrostatic workpiece,
A conductive preform mold having protrusions and spaces is used, and the space portion of the conductive preform mold is filled, coated or applied with a non-conductive material to form a stagnation region;
Performing electroforming on the electroforming die to grow electroforming workpieces;
And the vertically grown electroforming workpiece is produced by demolding the grown electroforming workpiece from the electroforming die. 22. The method of claim 21, wherein the non-conductive material is an elastic body. 22. The method of claim 21, wherein the non-conductive material is silicon. 22. The method of claim 21, wherein the vertically-grown electrophotographic workpiece has a downward growth portion or a maximum width horizontal growth portion. 25. The method of claim 24, wherein the lower growth portion or the maximum width horizontal growth portion is removed by an electrolytic process, an etching process, or a polishing process. A vertically grown electrophoresis workpiece made according to any one of claims 21 to 25. 26. A polynomial workpiece according to claim 26, wherein the polynomial workpiece is a mesh comprising a circular, square or hexagonal texture. 26. A prismatic workpiece according to claim 26, wherein the prismatic workpiece is a filter made of a circular, rectangular or hexagonal structure. A method of manufacturing a flexible mold that solves the remaining problem with remaining photoresist,
Forming a photosensitive layer on the substrate, forming an exposed portion through the pattern in the photosensitive layer, forming a protruding portion and a space portion on the substrate through a developing process, and remaining photosensitive material not removed in the space portion;
Forming a release layer on the protrusion, the space, and the remaining photosensitive material; filling a flexible fluid material on the release layer and curing the elastic fluid material;
And the elastic mold is deformed to produce a flexible mold. The method of manufacturing a flexible mold according to claim 29, wherein the protrusions are formed in a narrow tapered shape and a wide tapered shape at the bottom. A resilient mold made according to claim 29 or 30. A method for producing a conductor mold from an elastic mold,
Forming a photosensitive layer on the substrate; Forming an exposure unit on the photosensitive layer through a pattern; A protrusion and a space are formed on a substrate through a development process, a release layer is formed on the protrusion and the space, and a flexible fluid material is filled on the release layer to manufacture a molded product; The mold is deformed to form a flexible mold, the elastic metal is sputtered on the elastic mold, a release layer is formed on the sputtering surface, electricity is passed through the sputtering layer, A method for manufacturing a conductive mold from a flexible mold by manufacturing a preform workpiece and demolding the preform workpiece from an elastic mold. 32. A method according to claim 31, wherein the protrusions are fabricated from a resilient mold characterized by a narrow top portion and a wide tapered shape at the bottom. A conductor mold made by the manufacturing method of claim 32 or 33. A method of manufacturing a flexible circuit board,
A substrate on which protrusions and spaces are formed by using a photosensitive material or a mold in which protrusions and voids are formed or a flexible mold in which protrusions and spaces are formed, a release layer is formed on the protrusions and the space portion, and a liquid resin is applied; Placing a polyimide film substrate on top of the liquid resin; Adhering the liquid resin to the polyimide film substrate at the same time as curing the liquid resin to a uniform thickness;
Demolding a film substrate to which a molding resin is adhered from the substrate or the mold or the elastic mold;
Wherein a release layer is formed on the upper surface of the projecting portion of the demoulded film substrate, and a silver paste is filled in the space portion of the film substrate. The method of manufacturing a flexible circuit board according to claim 35, wherein the liquid resin is an epoxy resin, a UV resin, or a polyimide resin. A method for manufacturing a flexible circuit board using a preprocessed workpiece grown vertically as a circuit,
Forming a protruding portion and a space portion in the conductive mold; Forming a stagnation region by filling or coating or applying a non-conductive material to the space portion to fabricate a vertically growing preform;
Forming a release layer on the vertically-grown electroforming die and performing electroplating to produce a vertically-grown electroplating workpiece;
Joining a roll-shaped or sheet-like film substrate with an upper surface of the vertically growing electrophotographic workpiece through an adhesive;
Wherein the film substrate on which the vertically grown electroplated workpiece is bonded is demolded in the electroforming die. The method of manufacturing a flexible circuit board according to claim 37, wherein the space portion of the flexible circuit board is filled with liquid resin, and the liquid resin is cured. A method of manufacturing a flexible circuit board,
Forming a photosensitive layer on the substrate; The photosensitive layer forms a tapered exposure portion with a top width narrower than a bottom width through a pattern;
A protruding portion and a space portion are formed on the substrate through the developing process, and a remaining photosensitive material remains in the space portion;
Sputtering a conductive metal on the projecting portion, the space portion, and the remaining photosensitive material;
Forming a release layer on the sputtering layer, subjecting the sputtering layer to electrification processing to produce a preform workpiece, demoulding the preform workpiece to produce a one-piece mold;
Forming a release layer on the one-piece mold, filling the top of the release layer with a liquid resin, and placing a roll-like or sheet-like film substrate on the liquid resin;
After the liquid resin is cured, the film substrate is demolded from the one-piece mold to produce a flexible circuit board having a protruding portion and a space portion;
Wherein a space portion of the flexible circuit board is filled with a silver paste. 41. The method of manufacturing a flexible circuit board according to claim 39, wherein the liquid main material is an epoxy resin, a UV resin, or a polyimide resin. 40. The method of manufacturing a flexible circuit board according to claim 39, wherein the upper portion of the protrusion formed on the flexible circuit board is a storage surface. 40. The method of manufacturing a flexible circuit board according to claim 39, wherein a release layer is formed on the upper surface of the protrusion formed on the flexible circuit board, and then silver paste is filled in the space portion of the circuit board. A method of manufacturing a flexible circuit board,
Forming a photosensitive layer on a conductive substrate, forming an exposed portion of the photosensitive layer through the pattern with a tapered shape whose top width is narrower than the bottom width;
Forming a protruding portion and a space portion in a conductive substrate through a developing process, forming a release layer on the conductive substrate, thickening the electroconductive substrate, and then demolding the electroconductive workpiece to produce a mold;
Forming a release layer on the mold, filling the top of the release layer with a liquid resin, and placing a roll or sheet film substrate on the liquid resin;
After the liquid resin is cured, the film substrate is demolded from the mold to produce a flexible circuit board having a protruding portion and a space portion;
Wherein a space portion of the flexible circuit board is filled with a silver paste. 44. The method of manufacturing a flexible circuit board according to claim 43, wherein the liquid main material is an epoxy resin, a UV resin, or a polyimide resin. The manufacturing method of a flexible circuit board according to claim 43, wherein a release layer is formed on the upper surface of the protrusion formed on the flexible circuit board, and the space is filled with silver paste. A method of manufacturing a flexible circuit board,
Forming a photosensitive layer on the substrate; Forming an exposure unit on the photosensitive layer through a pattern;
A protrusion and a space are formed on the substrate through a development process, a release layer is formed on the protrusion and the space, and a flexible liquid material is filled in the upper portion of the release layer to produce an elastic molding;
After the elastic material is cured, deforming to produce a flexible mold;
Forming a releasing layer on the flexible mold, applying a liquid resin on the releasing layer, and placing a roll or sheet film substrate on the liquid resin;
Disassembling the film substrate from the elastic mold after the liquid resin is cured to manufacture a flexible circuit board having a space portion;
Wherein a space portion of the flexible circuit board is filled with a silver paste. 47. The method of manufacturing a flexible circuit board according to claim 46, wherein the liquid main material is an epoxy resin, a UV resin, or a polyimide resin. 47. The method of manufacturing a flexible circuit board according to claim 46, wherein a release layer is formed on the upper surface of the protrusion formed on the flexible circuit board, and then silver paste is filled in the space. 48. A flexible circuit board or transparent heat ray or chip-on film or electromagnetic wave shielding sheet produced by any one of claims 35 to 48. Forming a photosensitive layer on a conductive substrate, exposing and developing the photosensitive layer to form an exposed portion and a space portion of a required shape;
Forming a release layer in the exposed portion and the space portion, performing electroplating in a plating bath to form a plating portion; The plating section first fills the space section, gradually diffuses to the exposure section at a uniform velocity, and plating proceeds; When the gap between the plating section and the neighboring plating section is formed to a desired size by the diffusion of the plating section, the plating process is stopped;
Forming a release layer between the plating section and the spacing section, and performing electroplating again to form a preform workpiece;
Disassembling the electrophotographic workpiece to produce an electroforming die having a protruding portion and a space portion; And forming a stagnation region by filling a non-conductive material in a space portion of the electroconductive metal mold. 50. A vertically-grown electroforming die made according to claim 50. Forming a release layer on the vertically-grown electroforming die fabricated according to claim 50 and performing electroplating to produce a vertically-grown electroplating workpiece;
Joining a roll-shaped or sheet-like film substrate with an upper surface of the vertically growing electrophotographic workpiece through an adhesive;
Wherein the film substrate on which the vertically grown electroplated workpiece is bonded is demolded in the electroforming die. The manufacturing method of a flexible circuit board according to claim 52, wherein the space portion of the flexible circuit board is filled with a liquid resin, and the liquid resin is cured. 52. A flexible circuit board or transparent heat wire or chip-on film or electromagnetic wave shielding sheet manufactured by the method of claim 52. A flexible circuit board or transparent heat wire or chip-on film or electromagnetic wave shielding sheet produced by the method of claim 53. A vertically-grown three-dimensional electroforming work produced by the electromechanical die of claim 51. A mesh or filter made by the electromechanical mold of claim 51, a heat wire or a three-dimensional circuit, a three-dimensional super-precision structure, a transparent heat wire, a chip on film, and an electromagnetic wave shielding sheet.

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