KR20180083537A - Method and workpiece of inducing vertical groth in electroforming - Google Patents

Abstract

The present invention relates to an electroforming workpiece processing method inducing vertical growth, an electroforming product thereby, and an electroforming mold thereof. The most representative electroforming product of the present invention is a mesh, and also includes an ultrafine circuit and an MEMS processing technology as well as the mesh. According to the present invention, the linewidth and the height of the electroforming workpiece generally correspond to a range of few micrometers to few dozens of micrometers, and the electroforming mold is a conductive mold comprising a protrusion part and a space part. The space part is filled with a non-conductive substance and the non-conductive substance is filled in a parabolic shape. When the electroforming mold is used, the electroforming wp is almost vertically grown. The non-conductive material is an elastic body ideally, in particular, is made of silicone as a main material. The most representative product of the present invention is a mesh. A mesh mold formed with a conductive body comprises a protrusion part and a space part. The space part of the conductive mold is filled with a non-conductive substance in a parabolic shape, a vertically growing electroforming workpiece is formed by performing electroforming for the conductive mold, and the mesh is made by demolding the electroforming workpiece from the conductive mold.

Description

TECHNICAL FIELD The present invention relates to a method and a workpiece for induction vertical groth in electroforming,

The present invention relates to a technique for performing electroforming. In particular, it is a technology that allows the workpiece to be vertically grown. The electroplated workpiece is grown in the plating solution by the electroforming die. The present invention includes an electroforming die capable of vertical growth and a electroformed workpiece vertically grown through the electroforming die. A processing method of making them, and a result of the method. Especially, the result is mesh.

In a conventional electroconductive workpiece, a metal mold made of a conductive material is placed in a plating solution, and when electricity is added to the conductive metal mold, plating ions migrate and the electroforming workpiece is plated on the metal mold.

When a preprocessed workpiece is formed in a desired shape, the preformed workpiece is separated from the conductive mold to produce an object.

Generally, when electroforming is performed on a conductive metal mold, the electroformed workpiece simultaneously grows in the width direction and the height direction. It is not easy to artificially control the growth of such plating.

Generally, when electroforming is performed on a conductive metal mold, the electroformed workpiece simultaneously grows in the width direction and the height direction.

It is an object of the present invention to enable growth to be controlled in accordance with the characteristics of a preform workpiece. This alias makes it particularly possible to thicken the grown plating. The growth in the width direction in the plating direction is made small and the growth in the height direction is maximized to make the thickness of the resultant of the processing.

The present invention can be easily applied to the case of a polished work such as an extremely fine circuit, an extremely fine mesh, and the like. Generally, it is too difficult to control the growth of the plating when the size of the plating is precise and the size is several micrometers.

Therefore, most of these cases produce products through etching. When making a product by etching, the thickness of the base material to be etched becomes the thickness of the product.

In order to obtain a product such as an extremely fine circuit, an extremely fine mesh and the like, conventionally, etching was mainly performed. However, when a product is manufactured by an etching method, it is impossible to artificially control the direction of etching.

In a microcircuit, when the thickness of the base material to be processed is thick, the line width of the circuit to be processed is small, and the pitch of the circuit is small, etching can not be performed. This is because the etching progresses in the vertical direction and at the same time, the etching progresses in the width direction at the same time.

Of course, the same problem also occurs in general electric pole machining. When the plating starts from the electroforming mold, the plating can grow in the height direction but also grow in the width direction.

When the present invention is applied to fabrication of a microcircuit, fabrication is possible even when the thickness of the circuit to be processed is thick, the line width of the circuit to be processed is small, and the pitch of the circuit is small. Such a microcircuit can be easily manufactured by applying the technique of the present invention. It can be obtained by controlling the growth in the width direction of the electroforming workpiece to be grown from the electroforming die for making the microcircuit, and allowing the growth only in the height direction.

The use of the present invention makes it easy to apply MEMS technology to form very fine circuitry and extremely fine structures. What is referred to as extremely fine in the present invention is generally referred to as a size of several hundred micrometers or less, several tens of micrometers or less, and a micrometer or less.

However, it goes without saying that the present invention can be applied to a workpiece of several hundreds of micrometers or more depending on the shape of the electric pole workpiece.

The present invention is a technique that smoothly supplies the plating solution in contact with the electrostatic workpiece in the vertical direction, but restricts the supply in the horizontal direction.

In the present invention, the electroplating does not control the growth in the height direction, but controls the growth in the width direction. A factor controlling the growth in the width direction is defined as a growth control wall in the present invention.

In the present invention, the plating in the height direction is grown and the growth control wall grows by the same height. Therefore, although the plating grows in the height direction, growth is controlled in the width direction due to the growth control wall. It is a feature of the present invention that the growth control wall is continuously grown according to the growth of the plating product.

The plating solution to be considered in the present invention is responsible for the role of the growth control wall.

In the electroforming die of the present invention, the growth direction control of the electroformed workpiece to be initially grown plays a decisive role. In the electroforming die of the present invention, a non-conductive, silicon filler material having a parabolic shape is used for controlling the growth direction of the electroformed workpiece.

In order to control the growth direction of the electroformed workpiece, the non-conductive, silicon filler having a parabolic shape grows in the vertical direction of the grown electroforming work, and suppresses growth in the width direction. Through this, the vertically-grown electrostatic work piece of the present invention is manufactured.

1 is a plan view of a mesh.
Fig. 2 is an explanatory view of the electroforming die according to the present invention.
3 is an explanatory view for explaining that a space of the electroforming die is filled with a non-conductive material in a parabolic shape.
Fig. 4 is an explanatory view for explaining the initial shape of the electroforming die of the present invention.
5 is an explanatory diagram showing the fluidity of the plating solution for the electroforming die of the present invention.
FIGS. 6 to 9 are explanatory diagrams illustrating how vertical plating proceeds by inactive regions.
10 is a cross-sectional view of a product obtained by demoulding a preprocessed workpiece grown in the electroforming die of the present invention.
11 is an explanatory diagram of a conventional technique.
12 is an embodiment of vertical growth by the electroforming die of the present invention.

The present invention relates to a method of machining a preform workpiece for inducing vertical growth, and to a preform workpiece and a preform die by the method. Mesh is one of the most representative examples of the present invention. Of course, it includes not only meshing but also extremely fine circuitry and MEMS processing technology. The electroconductive workpieces of the present invention generally have a line width and a height generally ranging from several micrometers to tens of micrometers. The electroforming die used in the present invention comprises a protruding portion and a space portion as a conductor mold. The space portion is filled with a non-conductive material; The non-conductive material is filled in a parabolic shape.

When the electroforming die of the present invention is used, the electroformed workpiece to be grown grows almost vertically. In the present invention, the non-conductive material is an elastic material, and more specifically, silicon is used as a main material.

The most representative product of the present invention is a mesh. A mesh mold composed of a conductor constitutes a protruding portion and a space portion. Filling a space portion of the conductive metal mold with a non-conductive material in a parabolic shape; Subjecting the conductive metal mold to electroforming to form a vertically growing electroforming workpiece; The preform workpiece is demolded from the conductor mold to form a mesh.

Hereinafter, a detailed description will be given based on the drawings.

1 is a plan view of a mesh. Mesh is widely used in products such as printing and filters, and its applications are various. These meshes can be made in various shapes such as quadrilateral and hexagonal (honeycomb). Conventionally, a thin metal wire is woven to fabricate or etch meshes. In general, it is preferable that the fine mesh has a narrow line width and a large space portion, and the thickness of the mesh is thick enough to have durability. In the present invention, the practical application for describing these meshes can be applied not only to the meshes but also to the fine workpieces. In the present invention, precise workpieces with line width and thickness of several micrometers to tens of micrometers are mainly used.

Fig. 2 is an explanatory view of the electroforming die according to the present invention.

The present invention is directed to an electroforming die for vertical growth. In the present invention, vertical growth does not mean that the vertical growth is precisely vertical, vertical growth is defined in the present invention in which the growth of the electrophoresis workpiece in the lateral direction is small and the growth of the electrophoresis workpiece in the height direction is large.

The electroforming die in the present invention means an electroforming die capable of vertical growth. The protruding portion 2 is formed on the substrate 4 of the conductor preform die which is in the form of a flat plate. The protrusions are, of course, conductors, and are usually grown to one-and-a-half years with the substrate. A space portion (3) is formed between the projecting portions. The apexes of the protrusions are in the form of homogeneous flat portions or homogeneous lines. If the lower portion is thicker than the upper portion of the protrusion, stability and durability are structurally improved.

3 is an explanatory view for explaining that a space of the electroforming die is filled with a non-conductive material in a parabolic shape. The material filled in space is non-conductive material. A non-conductive material having elasticity is preferable, and a silicon material can be most representative. A non-conductive material is filled in the space portion, and the shape to be filled is a parabolic shape.

In the present invention, a non-conductive material is not applied on the upper portion of the projection so that plating can be performed. A non-conductive material is applied to the side surface of the protrusion so as not to be plated. It is possible to apply the side surface portion of the projecting portion with the non-conductive material by various methods. Among them, the most representative embodiment is to fill in a parabolic shape. The most important factor is that the thickness of the non-conductive material should be close to ZERO at the upper end of the protrusion as shown in Fig.

Fig. 4 is an explanatory view for explaining the initial shape of the electroforming die of the present invention. When the electroforming die of the present invention is placed in the plating bath, the plating solution 7 surrounds the electroforming die of the present invention.

5 is an explanatory diagram showing the fluidity of the plating solution for the electroforming die of the present invention. The plating solution is trapped in the parabolic portion of the electroforming die of the present invention, and the flow of the plating solution is almost stopped. Since the distance between the protrusions and protrusions is very small and the height of the protrusions is higher than the gap, the plating solution is trapped in the parabola and therefore the movement is small. In the present invention, a region where the plating solution hardly moves is defined as an inactive region 8.

FIGS. 6 to 9 are explanatory diagrams illustrating how vertical plating proceeds by inactive regions. In FIG. 6, when plating is started on the electroforming die, the plating is restricted in the non-active region and the plating solution flows smoothly in the vertical direction of the projecting portion, so that the plating proceeds with the vertical plating 9. Figure 7 illustrates that the inactive area is raised by vertical plating. As the vertical plating section grows to the top, the inactive area also rises to the top. Fig. 8 illustrates an intermediate process in which the vertical plating 11 and the inactive area 12 simultaneously rise vertically. 9 illustrates that the height of the vertical plating 12 is equal to the height of the product, and the height of the inactive area 14 is as high as that of the product. The present invention is established only when the protruding portion and the space portion are extremely small in size. Generally, when the size of the protruding portion and the space portion is large, an inactive region is not formed.

10 is a cross-sectional view of a product obtained by demoulding a preprocessed workpiece grown in the electroforming die of the present invention. At the start of electric pole machining, demoulding easily occurs because a release layer is formed on the electric pole die. Strictly speaking, the widthwise growth of the workpiece is inevitably increased as the workpiece is elevated in the height direction from the sectional view of the product. However, when the vertical growth method of the present invention is used, the growth in the width direction can be suppressed to a large extent.

11 is an explanatory diagram of a conventional technique. Conventionally, there is a method of filling a non-conductive material 17 between protrusions and using this as a pre-casting mold. In this case, the plating body 16 grown as shown in the drawing grows simultaneously in the width direction and the vertical direction, and a desired product can not be obtained.

12 is an embodiment of vertical growth by the electroforming die of the present invention.

When the electroforming process is carried out with the electroforming die of the present invention in which the protrusions are filled with the silicon 19 in the form of a parabola, the electroformed workpiece 18 raised almost vertically can be obtained. As a matter of course, the electric pole works rise vertically but do not grow perfectly vertically. However, this is also referred to as vertical lift in the present invention.

It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. But is not limited thereto.

2:
3: space part
4: Board of electric pole mold
8: Inactive area

Claims (11)

A method of processing a polished workpiece inducing vertical growth, the method comprising: forming a protruding portion and a space portion in a conductor mold; The space portion is filled with a non-conductive material; Wherein the non-conductive material is filled in a parabolic shape so that the growth of the preprocessed workpiece is caused to grow vertically. The method of claim 1, wherein the non-conductive material is an elastic body. The method according to claim 2, wherein the elastic body comprises silicon as a main component. A vertically grown electrophoretic workpiece produced using the method of claim 1. The conductor mold has a protruding portion and a space portion; The space portion is filled with a non-conductive material; Wherein the non-conductive material is filled in a parabolic shape. The electroconductive metal mold according to claim 5, wherein the non-conductive material is an elastic body. The electroconductive mold according to claim 6, wherein the elastic body is made of silicon as a main component. In the method of making a mesh, the conductor mold comprises protrusions and voids; Filling a space portion of the conductive metal mold with a non-conductive material in a parabolic shape;
Subjecting the conductive metal mold to electroforming to form a vertically growing electroforming workpiece;
Wherein the preform workpiece is demolded from the conductor mold to produce a mesh. In the conductive metal mold composed of the protruding portion and the space portion, the space portion is filled with the non-conductive material in a parabolic shape;
Subjecting the conductive metal mold to electroforming to form a vertically growing electroforming workpiece;
Wherein the electroconductive workpiece is demolded from the conductive metal mold. The mesh according to claim 9, wherein the non-conductive material is an elastic body. The elastic body according to claim 9, wherein the elastic body is made of silicon as a main component.

Images