KR101483308B1 - 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 - Google Patents

점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 Download PDF

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KR101483308B1
KR101483308B1 KR20080131969A KR20080131969A KR101483308B1 KR 101483308 B1 KR101483308 B1 KR 101483308B1 KR 20080131969 A KR20080131969 A KR 20080131969A KR 20080131969 A KR20080131969 A KR 20080131969A KR 101483308 B1 KR101483308 B1 KR 101483308B1
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pressure
sensitive adhesive
adhesive layer
point
semiconductor chip
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KR20090072986A (ko
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나오야 사이키
히로노리 시즈하타
이사오 이치카와
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린텍 가부시키가이샤
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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JP5602669B2 (ja) * 2010-03-31 2014-10-08 リンテック株式会社 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
JP6133542B2 (ja) * 2012-02-29 2017-05-24 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
KR102126174B1 (ko) * 2012-11-30 2020-06-24 린텍 가부시키가이샤 보호막 형성용 조성물, 보호막 형성용 시트, 및 경화 보호막을 구비한 칩
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
JP6463664B2 (ja) * 2015-11-27 2019-02-06 信越化学工業株式会社 ウエハ加工体及びウエハ加工方法
WO2017154226A1 (ja) * 2016-03-09 2017-09-14 三菱樹脂株式会社 粘着フィルム及びその製造方法
JP6213618B2 (ja) * 2016-06-09 2017-10-18 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
JP7091996B2 (ja) * 2018-10-31 2022-06-28 三菱ケミカル株式会社 粘接着剤組成物、及びそれを用いてなる粘接着剤、粘接着シート、ならびに積層体
JP2022033064A (ja) * 2018-12-19 2022-02-28 昭和電工マテリアルズ株式会社 フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法
JP7655011B2 (ja) * 2021-03-08 2025-04-02 三菱ケミカル株式会社 粘接着剤組成物、及びそれを用いてなる粘接着剤、粘接着シート、ならびに積層体

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