KR101473709B1 - 전기기계 변환장치의 제조 방법 - Google Patents

전기기계 변환장치의 제조 방법 Download PDF

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Publication number
KR101473709B1
KR101473709B1 KR1020120099744A KR20120099744A KR101473709B1 KR 101473709 B1 KR101473709 B1 KR 101473709B1 KR 1020120099744 A KR1020120099744 A KR 1020120099744A KR 20120099744 A KR20120099744 A KR 20120099744A KR 101473709 B1 KR101473709 B1 KR 101473709B1
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South Korea
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insulating layer
blocking wall
silicon substrate
substrate
height
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KR1020120099744A
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English (en)
Korean (ko)
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KR20130031206A (ko
Inventor
아야코 카토
카즈토시 토라시마
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캐논 가부시끼가이샤
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/0075For improving wear resistance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50Devices controlled by mechanical forces, e.g. pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0221Variable capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/03Static structures
    • B81B2203/0315Cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/03Static structures
    • B81B2203/0369Static structures characterized by their profile
    • B81B2203/0392Static structures characterized by their profile profiles not provided for in B81B2203/0376 - B81B2203/0384
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49007Indicating transducer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Computer Hardware Design (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Manufacturing & Machinery (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
KR1020120099744A 2011-09-20 2012-09-10 전기기계 변환장치의 제조 방법 Expired - Fee Related KR101473709B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-204970 2011-09-20
JP2011204970A JP5896665B2 (ja) 2011-09-20 2011-09-20 電気機械変換装置の製造方法

Publications (2)

Publication Number Publication Date
KR20130031206A KR20130031206A (ko) 2013-03-28
KR101473709B1 true KR101473709B1 (ko) 2014-12-17

Family

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KR1020120099744A Expired - Fee Related KR101473709B1 (ko) 2011-09-20 2012-09-10 전기기계 변환장치의 제조 방법

Country Status (5)

Country Link
US (1) US8518733B2 (enExample)
EP (1) EP2572804A3 (enExample)
JP (1) JP5896665B2 (enExample)
KR (1) KR101473709B1 (enExample)
CN (1) CN103011054B (enExample)

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* Cited by examiner, † Cited by third party
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JP5511260B2 (ja) * 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法
JP5479390B2 (ja) * 2011-03-07 2014-04-23 信越半導体株式会社 シリコンウェーハの製造方法
JP6381195B2 (ja) 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
US10581344B2 (en) * 2015-01-16 2020-03-03 Chambre De Commerce Et D'industrie De Region Paris Ile De France Miniature kinetic energy harvester for generating electrical energy from mechanical vibrations
CN105036058B (zh) * 2015-05-27 2016-10-05 华南理工大学 集成化电容式微加工超声换能器及其制备方法
JP6606034B2 (ja) * 2016-08-24 2019-11-13 株式会社日立製作所 容量検出型超音波トランスデューサおよびそれを備えた超音波撮像装置
KR20220098075A (ko) 2021-01-02 2022-07-11 김동호 참여용 골인보드
CN114380271B (zh) * 2021-09-02 2025-07-01 苏州清听声学科技有限公司 一种定向发声屏绝缘凸点压印制作方法

Citations (4)

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JP2006516368A (ja) 2002-08-08 2006-06-29 ザ・ボード・オブ・トラスティーズ・オブ・ザ・レランド・スタンフォード・ジュニア・ユニバーシティ マイクロ機械加工された超音波トランスデューサ及び製造方法
JP2009194934A (ja) 2004-06-03 2009-08-27 Olympus Corp 静電容量型超音波振動子および積層型静電容量型超音波振動子の製造方法
KR100977826B1 (ko) 2007-11-27 2010-08-27 한국전자통신연구원 멤스 마이크로폰 및 그 제조 방법
KR101150186B1 (ko) 2009-12-04 2012-05-25 주식회사 비에스이 멤스 마이크로폰 및 그 제조방법

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WO2000002014A1 (en) * 1998-07-07 2000-01-13 The Goodyear Tire And Rubber Company Dual output capacitance interface circuit
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
JP4909279B2 (ja) * 2005-10-18 2012-04-04 株式会社日立製作所 超音波探触子
TWI268183B (en) * 2005-10-28 2006-12-11 Ind Tech Res Inst Capacitive ultrasonic transducer and method of fabricating the same
US7745248B2 (en) * 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
JP5594986B2 (ja) 2008-06-24 2014-09-24 キヤノン株式会社 機械電気変換素子及び機械電気変換装置の製造方法
US8099854B2 (en) * 2008-06-24 2012-01-24 Canon Kabushiki Kaisha Manufacturing method of an electromechanical transducer
US20100173437A1 (en) * 2008-10-21 2010-07-08 Wygant Ira O Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound
JP5550363B2 (ja) * 2010-01-26 2014-07-16 キヤノン株式会社 静電容量型電気機械変換装置
KR20130014501A (ko) * 2010-01-29 2013-02-07 리써치 트라이앵글 인스티튜트 압전 초음파 변환 장치의 형성 방법들 및 연관된 장치들
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5812660B2 (ja) 2011-04-19 2015-11-17 キヤノン株式会社 電気機械変換装置及びその製造方法
JP5751026B2 (ja) * 2011-05-31 2015-07-22 セイコーエプソン株式会社 超音波トランスデューサー、生体センサー、及び超音波トランスデューサーの製造方法
KR101761819B1 (ko) * 2011-08-24 2017-07-26 삼성전자주식회사 초음파 변환기 및 그 제조 방법
JP2013051459A (ja) * 2011-08-30 2013-03-14 Canon Inc 電気機械変換装置及びその製造方法
JP5834657B2 (ja) * 2011-09-12 2015-12-24 セイコーエプソン株式会社 超音波プローブおよび超音波画像診断装置

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JP2006516368A (ja) 2002-08-08 2006-06-29 ザ・ボード・オブ・トラスティーズ・オブ・ザ・レランド・スタンフォード・ジュニア・ユニバーシティ マイクロ機械加工された超音波トランスデューサ及び製造方法
JP2009194934A (ja) 2004-06-03 2009-08-27 Olympus Corp 静電容量型超音波振動子および積層型静電容量型超音波振動子の製造方法
KR100977826B1 (ko) 2007-11-27 2010-08-27 한국전자통신연구원 멤스 마이크로폰 및 그 제조 방법
KR101150186B1 (ko) 2009-12-04 2012-05-25 주식회사 비에스이 멤스 마이크로폰 및 그 제조방법

Also Published As

Publication number Publication date
CN103011054A (zh) 2013-04-03
US20130071964A1 (en) 2013-03-21
EP2572804A3 (en) 2017-12-27
CN103011054B (zh) 2015-10-14
KR20130031206A (ko) 2013-03-28
EP2572804A2 (en) 2013-03-27
JP5896665B2 (ja) 2016-03-30
US8518733B2 (en) 2013-08-27
JP2013070112A (ja) 2013-04-18

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