KR101456193B1 - 하전 입자빔 묘화 장치 및 하전 입자빔 묘화 방법 - Google Patents

하전 입자빔 묘화 장치 및 하전 입자빔 묘화 방법 Download PDF

Info

Publication number
KR101456193B1
KR101456193B1 KR1020120140874A KR20120140874A KR101456193B1 KR 101456193 B1 KR101456193 B1 KR 101456193B1 KR 1020120140874 A KR1020120140874 A KR 1020120140874A KR 20120140874 A KR20120140874 A KR 20120140874A KR 101456193 B1 KR101456193 B1 KR 101456193B1
Authority
KR
South Korea
Prior art keywords
aperture
opening
charged particle
particle beam
opening end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120140874A
Other languages
English (en)
Korean (ko)
Other versions
KR20130064024A (ko
Inventor
타카나오 토우야
무네히로 오가사와라
Original Assignee
가부시키가이샤 뉴플레어 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 뉴플레어 테크놀로지 filed Critical 가부시키가이샤 뉴플레어 테크놀로지
Publication of KR20130064024A publication Critical patent/KR20130064024A/ko
Application granted granted Critical
Publication of KR101456193B1 publication Critical patent/KR101456193B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KHANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K5/00Irradiation devices
    • G21K5/08Holders for targets or for other objects to be irradiated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3175Lithography
    • H01J2237/31774Multi-beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3175Lithography
    • H01J2237/31776Shaped beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electron Beam Exposure (AREA)
KR1020120140874A 2011-12-07 2012-12-06 하전 입자빔 묘화 장치 및 하전 입자빔 묘화 방법 Active KR101456193B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-267800 2011-12-07
JP2011267800A JP5897888B2 (ja) 2011-12-07 2011-12-07 荷電粒子ビーム描画装置

Publications (2)

Publication Number Publication Date
KR20130064024A KR20130064024A (ko) 2013-06-17
KR101456193B1 true KR101456193B1 (ko) 2014-11-03

Family

ID=48572280

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120140874A Active KR101456193B1 (ko) 2011-12-07 2012-12-06 하전 입자빔 묘화 장치 및 하전 입자빔 묘화 방법

Country Status (4)

Country Link
US (1) US8791422B2 (https=)
JP (1) JP5897888B2 (https=)
KR (1) KR101456193B1 (https=)
TW (1) TWI478213B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2627732C2 (ru) * 2012-06-01 2017-08-11 Сименс Акциенгезелльшафт Отклоняющая пластина и отклоняющее устройство для отклонения заряженных частиц
JP6349944B2 (ja) * 2014-05-13 2018-07-04 株式会社ニューフレアテクノロジー 電子ビーム描画装置及び電子ビーム描画方法
CN105070345A (zh) * 2015-08-28 2015-11-18 上海核工程研究设计院 一种可拆式辐照监督样品盒
CN111108582B (zh) * 2017-08-08 2024-07-05 Asml荷兰有限公司 带电粒子阻挡元件、包括这样的元件的曝光装置以及使用这样的曝光装置的方法
JP6819509B2 (ja) * 2017-08-10 2021-01-27 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置
JP7219660B2 (ja) * 2019-04-09 2023-02-08 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及びアパーチャ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232209A (ja) * 1996-02-23 1997-09-05 Nec Corp 荷電粒子ビーム露光装置用アパーチャマスクとその製造方法
KR20020018950A (ko) * 2000-09-04 2002-03-09 히로시 오우라 전자빔 노광장치, 하전 입자선을 정형하는 부재 및 그제조방법
JP2002237441A (ja) * 2001-02-08 2002-08-23 Advantest Corp スリット製造方法、スリット、及び電子ビーム露光装置
KR20030036786A (ko) * 2000-11-01 2003-05-09 주식회사 아도반테스토 전자빔 노광장치 및 전자빔 노광방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03174716A (ja) * 1989-08-07 1991-07-29 Hitachi Ltd 電子ビーム描画装置および描画方式
JPH0684492A (ja) * 1992-03-09 1994-03-25 Topcon Corp 電子顕微鏡
JP3288767B2 (ja) * 1992-09-30 2002-06-04 株式会社東芝 荷電ビーム描画装置
JP3118390B2 (ja) 1995-03-16 2000-12-18 ホーヤ株式会社 転写マスクの製造方法
JPH08315760A (ja) * 1995-05-23 1996-11-29 Hitachi Ltd ビーム成形絞りとその作成方法およびこれを用いた荷電粒子ビーム露光装置
JP3422226B2 (ja) * 1997-07-16 2003-06-30 凸版印刷株式会社 アパーチャ及びその製造方法
JP2908433B1 (ja) 1998-06-05 1999-06-21 株式会社東芝 ビーム成形用アパーチャマスク及び荷電ビーム露光装置
JP2000243335A (ja) * 1999-02-18 2000-09-08 Nippon Telegr & Teleph Corp <Ntt> アパーチャ保持機構
DE10200645A1 (de) * 2002-01-10 2003-07-24 Leo Elektronenmikroskopie Gmbh Elektronenmikroskop mit ringförmiger Beleuchtungsapertur
ATE424037T1 (de) * 2005-07-20 2009-03-15 Zeiss Carl Sms Gmbh Teilchenstrahlbelichtungssystem und vorrichtung zur strahlbeeinflussung
DE102005040267B4 (de) * 2005-08-24 2007-12-27 Universität Karlsruhe Verfahren zum Herstellen einer mehrschichtigen elektrostatischen Linsenanordnung, insbesondere einer Phasenplatte und derartige Phasenplatte
JP5275396B2 (ja) * 2011-03-17 2013-08-28 株式会社東芝 電子ビーム照射装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232209A (ja) * 1996-02-23 1997-09-05 Nec Corp 荷電粒子ビーム露光装置用アパーチャマスクとその製造方法
KR20020018950A (ko) * 2000-09-04 2002-03-09 히로시 오우라 전자빔 노광장치, 하전 입자선을 정형하는 부재 및 그제조방법
KR20030036786A (ko) * 2000-11-01 2003-05-09 주식회사 아도반테스토 전자빔 노광장치 및 전자빔 노광방법
JP2002237441A (ja) * 2001-02-08 2002-08-23 Advantest Corp スリット製造方法、スリット、及び電子ビーム露光装置

Also Published As

Publication number Publication date
JP2013120833A (ja) 2013-06-17
TWI478213B (zh) 2015-03-21
US8791422B2 (en) 2014-07-29
US20130149646A1 (en) 2013-06-13
KR20130064024A (ko) 2013-06-17
JP5897888B2 (ja) 2016-04-06
TW201338015A (zh) 2013-09-16

Similar Documents

Publication Publication Date Title
JP7030663B2 (ja) 半導体装置及び荷電粒子線露光装置
KR101456193B1 (ko) 하전 입자빔 묘화 장치 및 하전 입자빔 묘화 방법
US8772734B2 (en) Charged particle beam lithography apparatus and method, and article manufacturing method
TWI477925B (zh) Multi - beam charged particle beam mapping device and multi - beam charged particle beam rendering method
US8927941B2 (en) Multi charged particle beam writing apparatus and multi charged particle beam writing method with fixed voltage ratio einzel lens
US6844560B2 (en) Lithography system comprising a converter plate and means for protecting the converter plate
US10451976B2 (en) Electron beam irradiation apparatus and electron beam dynamic focus adjustment method
US10211023B2 (en) Aperture set for multi-beam and multi-charged particle beam writing apparatus
KR101621784B1 (ko) 하전 입자 빔 묘화 장치 및 하전 입자 빔 묘화 방법
KR20200125484A (ko) 멀티 하전 입자 빔 묘화 장치
TWI591674B (zh) Electron beam tracing device and electron beam convergence half angle adjustment method
JP7275647B2 (ja) マルチビーム用アパーチャ基板セット及びマルチ荷電粒子ビーム装置
US4282437A (en) Charged particle beam lithography
JP5403739B2 (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP5859951B2 (ja) 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法
CN118266060A (zh) 描绘装置的控制方法以及描绘装置
JP7219660B2 (ja) 荷電粒子ビーム描画装置及びアパーチャ
CN114326317A (zh) 多带电粒子射束照射装置及多带电粒子射束照射方法
KR20240002197A (ko) 멀티 하전 입자 빔 묘화 방법 및 멀티 하전 입자 빔 묘화 장치
JP5649869B2 (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2010016192A (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170919

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20181004

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000