KR101444981B1 - 노광 장치, 노광 방법 및 디바이스 제조 방법 - Google Patents
노광 장치, 노광 방법 및 디바이스 제조 방법 Download PDFInfo
- Publication number
- KR101444981B1 KR101444981B1 KR1020110040205A KR20110040205A KR101444981B1 KR 101444981 B1 KR101444981 B1 KR 101444981B1 KR 1020110040205 A KR1020110040205 A KR 1020110040205A KR 20110040205 A KR20110040205 A KR 20110040205A KR 101444981 B1 KR101444981 B1 KR 101444981B1
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- South Korea
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- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005259 measurement Methods 0.000 claims abstract description 188
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 230000001133 acceleration Effects 0.000 claims abstract description 40
- 230000003287 optical effect Effects 0.000 claims description 41
- 238000012937 correction Methods 0.000 claims description 40
- 238000012545 processing Methods 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 126
- 230000000875 corresponding effect Effects 0.000 description 10
- 238000005286 illumination Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/53—Automatic registration or positioning of originals with respect to each other or the photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2010-107716 | 2010-05-07 | ||
| JP2010107716A JP5498243B2 (ja) | 2010-05-07 | 2010-05-07 | 露光装置、露光方法及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110123665A KR20110123665A (ko) | 2011-11-15 |
| KR101444981B1 true KR101444981B1 (ko) | 2014-09-26 |
Family
ID=44901733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110040205A Active KR101444981B1 (ko) | 2010-05-07 | 2011-04-28 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8625072B2 (enExample) |
| JP (1) | JP5498243B2 (enExample) |
| KR (1) | KR101444981B1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5849613B2 (ja) | 2011-10-31 | 2016-01-27 | 株式会社リコー | 画像表示装置 |
| JP6053316B2 (ja) * | 2012-05-09 | 2016-12-27 | キヤノン株式会社 | リソグラフィー装置、および、物品製造方法 |
| JP6066610B2 (ja) * | 2012-07-31 | 2017-01-25 | キヤノン株式会社 | 露光方法、露光装置及びデバイス製造方法 |
| JP6071628B2 (ja) * | 2013-02-22 | 2017-02-01 | キヤノン株式会社 | 露光装置、露光方法及びデバイスの製造方法 |
| JP5734344B2 (ja) * | 2013-05-16 | 2015-06-17 | キヤノン株式会社 | 露光装置および物品の製造方法 |
| JP5986538B2 (ja) | 2013-06-10 | 2016-09-06 | キヤノン株式会社 | 露光装置および物品の製造方法 |
| JP6267530B2 (ja) * | 2014-02-04 | 2018-01-24 | キヤノン株式会社 | 露光装置、および物品の製造方法 |
| JP6463935B2 (ja) * | 2014-09-30 | 2019-02-06 | キヤノン株式会社 | 露光装置、露光方法、およびデバイス製造方法 |
| CN111948912A (zh) | 2015-02-23 | 2020-11-17 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
| CN111176084B (zh) | 2015-02-23 | 2023-07-28 | 株式会社尼康 | 测量装置、曝光装置、光刻系统、测量方法及曝光方法 |
| HK1246849A1 (en) | 2015-02-23 | 2018-09-14 | Nikon Corporation | Measurement device, lithography system and exposure device, and device manufacturing method |
| CN108369390B (zh) | 2015-12-15 | 2021-05-18 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
| CN107544213B (zh) * | 2016-06-29 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | 光刻机动态调平调焦方法 |
| JP6806509B2 (ja) * | 2016-09-15 | 2021-01-06 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
| CN108022847B (zh) * | 2016-10-31 | 2020-12-18 | 中芯国际集成电路制造(上海)有限公司 | 用于检测基板上的标记的装置、设备和方法 |
| JP6882091B2 (ja) * | 2017-06-21 | 2021-06-02 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
| JP6952590B2 (ja) * | 2017-11-30 | 2021-10-20 | キヤノン株式会社 | 露光装置、露光方法、および物品の製造方法 |
| JP6688330B2 (ja) * | 2018-02-28 | 2020-04-28 | キヤノン株式会社 | 露光方法、露光装置、決定方法および物品製造方法 |
| JP2020109531A (ja) * | 2020-04-02 | 2020-07-16 | キヤノン株式会社 | 露光装置、露光方法、および物品製造方法 |
| EP3923078A1 (en) * | 2020-06-10 | 2021-12-15 | ASML Netherlands B.V. | Heigth measurement method and height measurement system |
| JP2024157368A (ja) * | 2023-04-25 | 2024-11-07 | キヤノン株式会社 | 露光装置、露光方法、および物品製造方法 |
| TW202531165A (zh) * | 2023-10-03 | 2025-08-01 | 日商佳能股份有限公司 | 決定方法、圖案轉印方法、物品製造方法、程式、資訊處理裝置及微影系統 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283403A (ja) * | 1993-03-26 | 1994-10-07 | Nikon Corp | 面位置設定装置 |
| JP3754743B2 (ja) * | 1996-03-01 | 2006-03-15 | キヤノン株式会社 | 表面位置設定方法、ウエハ高さ設定方法、面位置設定方法、ウエハ面位置検出方法および露光装置 |
| JP3815759B2 (ja) * | 1997-09-22 | 2006-08-30 | キヤノン株式会社 | 検出方法、露光装置およびデバイス製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100300618B1 (ko) * | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
| JP3376179B2 (ja) | 1995-08-03 | 2003-02-10 | キヤノン株式会社 | 面位置検出方法 |
| JP3376219B2 (ja) | 1996-08-22 | 2003-02-10 | キヤノン株式会社 | 面位置検出装置および方法 |
| JP3428825B2 (ja) * | 1996-08-02 | 2003-07-22 | キヤノン株式会社 | 面位置検出方法および面位置検出装置 |
| JPH1097987A (ja) * | 1996-09-25 | 1998-04-14 | Canon Inc | 走査型露光装置および方法 |
| US6090510A (en) * | 1997-03-25 | 2000-07-18 | Nikon Corporation | Method for scanning exposure |
| JP3428872B2 (ja) | 1997-08-29 | 2003-07-22 | キヤノン株式会社 | 露光方法および装置 |
| JPH11186129A (ja) * | 1997-12-19 | 1999-07-09 | Nikon Corp | 走査型露光方法及び装置 |
| WO1999039374A1 (en) * | 1998-01-29 | 1999-08-05 | Nikon Corporation | Exposure method and device |
| JP4072981B2 (ja) * | 1998-10-09 | 2008-04-09 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| WO2005124832A1 (ja) | 2004-06-17 | 2005-12-29 | Nikon Corporation | 露光装置 |
| JP2007035783A (ja) * | 2005-07-25 | 2007-02-08 | Canon Inc | 露光装置及び方法 |
| JP4953923B2 (ja) | 2007-05-30 | 2012-06-13 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
-
2010
- 2010-05-07 JP JP2010107716A patent/JP5498243B2/ja active Active
-
2011
- 2011-04-28 KR KR1020110040205A patent/KR101444981B1/ko active Active
- 2011-05-03 US US13/099,686 patent/US8625072B2/en active Active
-
2013
- 2013-12-03 US US14/094,950 patent/US9001306B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283403A (ja) * | 1993-03-26 | 1994-10-07 | Nikon Corp | 面位置設定装置 |
| JP3754743B2 (ja) * | 1996-03-01 | 2006-03-15 | キヤノン株式会社 | 表面位置設定方法、ウエハ高さ設定方法、面位置設定方法、ウエハ面位置検出方法および露光装置 |
| JP3815759B2 (ja) * | 1997-09-22 | 2006-08-30 | キヤノン株式会社 | 検出方法、露光装置およびデバイス製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9001306B2 (en) | 2015-04-07 |
| US20110273686A1 (en) | 2011-11-10 |
| JP2011238707A (ja) | 2011-11-24 |
| KR20110123665A (ko) | 2011-11-15 |
| JP5498243B2 (ja) | 2014-05-21 |
| US8625072B2 (en) | 2014-01-07 |
| US20140092374A1 (en) | 2014-04-03 |
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