KR101435410B1 - 열 안정성 양이온 광경화성 조성물 - Google Patents

열 안정성 양이온 광경화성 조성물 Download PDF

Info

Publication number
KR101435410B1
KR101435410B1 KR1020097010573A KR20097010573A KR101435410B1 KR 101435410 B1 KR101435410 B1 KR 101435410B1 KR 1020097010573 A KR1020097010573 A KR 1020097010573A KR 20097010573 A KR20097010573 A KR 20097010573A KR 101435410 B1 KR101435410 B1 KR 101435410B1
Authority
KR
South Korea
Prior art keywords
composition
phenyl
sterically hindered
stabilizer
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097010573A
Other languages
English (en)
Korean (ko)
Other versions
KR20090082251A (ko
Inventor
카르슈텐 린커
Original Assignee
시바 홀딩 인크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바 홀딩 인크 filed Critical 시바 홀딩 인크
Publication of KR20090082251A publication Critical patent/KR20090082251A/ko
Application granted granted Critical
Publication of KR101435410B1 publication Critical patent/KR101435410B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037Production of three-dimensional images
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/02Halogenated hydrocarbons
    • C08K5/03Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/05Alcohols; Metal alcoholates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymerisation Methods In General (AREA)
  • Dental Preparations (AREA)
  • Epoxy Resins (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1020097010573A 2006-10-24 2007-10-15 열 안정성 양이온 광경화성 조성물 Expired - Fee Related KR101435410B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06122783 2006-10-24
EP06122783.1 2006-10-24
PCT/EP2007/060924 WO2008049743A1 (en) 2006-10-24 2007-10-15 Thermally stable cationic photocurable compositions

Publications (2)

Publication Number Publication Date
KR20090082251A KR20090082251A (ko) 2009-07-29
KR101435410B1 true KR101435410B1 (ko) 2014-08-29

Family

ID=37846122

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097010573A Expired - Fee Related KR101435410B1 (ko) 2006-10-24 2007-10-15 열 안정성 양이온 광경화성 조성물

Country Status (7)

Country Link
US (1) US8084522B2 (enExample)
EP (1) EP2076563B1 (enExample)
JP (2) JP5523101B2 (enExample)
KR (1) KR101435410B1 (enExample)
CN (1) CN101558110B (enExample)
ES (1) ES2603838T3 (enExample)
WO (1) WO2008049743A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5473921B2 (ja) 2007-10-10 2014-04-16 ビーエーエスエフ ソシエタス・ヨーロピア スルホニウム塩開始剤
JP5498832B2 (ja) * 2009-03-25 2014-05-21 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
KR101833078B1 (ko) * 2009-12-17 2018-02-27 디에스엠 아이피 어셋츠 비.브이. 적층식 제작을 위한 발광 다이오드 경화성 액체 수지 조성물
US20110300367A1 (en) * 2010-06-07 2011-12-08 Ching-Kee Chien Optical Fiber With Photoacid Coating
WO2012039051A1 (ja) * 2010-09-24 2012-03-29 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
JP5832740B2 (ja) 2010-11-30 2015-12-16 株式会社ダイセル 硬化性エポキシ樹脂組成物
EP2514800B2 (de) * 2011-04-21 2018-03-07 Merck Patent GmbH Verbindungen und flüssigkristallines Medium
KR102091871B1 (ko) 2012-07-26 2020-03-20 덴카 주식회사 수지 조성물
KR102385321B1 (ko) 2014-01-23 2022-04-11 덴카 주식회사 수지 조성물
US10604659B2 (en) 2015-06-08 2020-03-31 Dsm Ip Assets B.V. Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication
KR102663364B1 (ko) 2015-10-01 2024-05-08 스트래터시스,인코포레이티드 적층식 제조용 액체 하이브리드 uv/가시광 복사선-경화성 수지 조성물
KR101941649B1 (ko) 2017-11-24 2019-01-23 주식회사 엘지화학 편광판 및 이를 포함하는 화상 표시 장치
JP7488102B2 (ja) * 2019-05-17 2024-05-21 住友化学株式会社 塩、クエンチャー、レジスト組成物及びレジストパターンの製造方法
JP7537913B2 (ja) * 2019-06-04 2024-08-21 住友化学株式会社 塩、クエンチャー、レジスト組成物及びレジストパターンの製造方法
JP7689013B2 (ja) * 2020-05-15 2025-06-05 住友化学株式会社 カルボン酸塩、クエンチャー、レジスト組成物及びレジストパターンの製造方法
WO2025140899A1 (en) * 2023-12-28 2025-07-03 Merck Patent Gmbh Methods for stabilizing a photoactive generator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051656A (ja) 2002-07-16 2004-02-19 Konica Minolta Holdings Inc 画像形成方法、印刷物及び記録装置
US20050165141A1 (en) * 2004-01-27 2005-07-28 Jean-Pierre Wolf Thermally stable cationic photocurable compositions
JP2006008740A (ja) 2004-06-22 2006-01-12 Nitto Denko Corp 紫外線硬化型樹脂組成物
US20060223903A1 (en) * 2005-04-04 2006-10-05 Jie Cao Radiation-curable desiccant-filled adhesive/sealant

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641014A1 (de) 1986-12-19 1988-06-16 Wolfen Filmfab Veb Fotopolymerisierbares material
JP2699188B2 (ja) * 1988-03-15 1998-01-19 三新化学工業株式会社 カチオン重合性組成物、重合触媒および重合方法
JPH0735917A (ja) * 1993-07-23 1995-02-07 Toray Ind Inc カラーフィルタの製造方法
DE19627469A1 (de) * 1995-07-12 1997-01-16 Sanyo Chemical Ind Ltd Epoxidharzvernetzungsmittel und Ein-Komponenten-Epoxidharzzusammensetzung
TW460509B (en) * 1996-07-12 2001-10-21 Ciba Sc Holding Ag Curing process for cationically photocurable formulations
DE69824961T2 (de) * 1997-07-28 2005-07-28 Kaneka Corp. Härtbare zusammensetzung
US5973020A (en) * 1998-01-06 1999-10-26 Rhodia Inc. Photoinitiator composition including hindered amine stabilizer
DE19927949A1 (de) * 1999-06-18 2000-12-21 Delo Industrieklebstoffe Gmbh Kationisch härtende Masse, ihre Verwendung sowie Verfahren zur Herstellung gehärteter Polymermassen
SG98433A1 (en) * 1999-12-21 2003-09-19 Ciba Sc Holding Ag Iodonium salts as latent acid donors
BR0205767B1 (pt) * 2001-07-19 2013-10-15 Sais de sulfônio, composições curáveis por radiação, formulações líquidas, e, método para a preparação dos sais de sulfônio
GB0204467D0 (en) 2002-02-26 2002-04-10 Coates Brothers Plc Novel fused ring compounds, and their use as cationic photoinitiators
EP1731544A4 (en) * 2004-03-30 2008-06-18 Kaneka Corp CURABLE COMPOSITION
JP4331644B2 (ja) * 2004-05-10 2009-09-16 日東電工株式会社 紫外線硬化型樹脂組成物
JP4421938B2 (ja) * 2004-05-10 2010-02-24 日東電工株式会社 紫外線硬化型樹脂組成物
JP2006124636A (ja) * 2004-06-28 2006-05-18 Konica Minolta Medical & Graphic Inc 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置
EP2028228B1 (en) * 2004-10-25 2018-12-12 IGM Group B.V. Functionalized nanoparticles
JP4644050B2 (ja) * 2005-02-04 2011-03-02 積水化学工業株式会社 光デバイスの製造方法及び光デバイス
JP2006257257A (ja) * 2005-03-17 2006-09-28 Sumitomo Chemical Co Ltd 硬化性樹脂組成物および該組成物を用いて形成される保護膜
KR101191370B1 (ko) * 2005-04-04 2012-10-15 헨켈 아게 운트 코. 카게아아 방사선 경화성 건조제-충전 접착제/밀봉제

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051656A (ja) 2002-07-16 2004-02-19 Konica Minolta Holdings Inc 画像形成方法、印刷物及び記録装置
US20050165141A1 (en) * 2004-01-27 2005-07-28 Jean-Pierre Wolf Thermally stable cationic photocurable compositions
JP2006008740A (ja) 2004-06-22 2006-01-12 Nitto Denko Corp 紫外線硬化型樹脂組成物
US20060223903A1 (en) * 2005-04-04 2006-10-05 Jie Cao Radiation-curable desiccant-filled adhesive/sealant

Also Published As

Publication number Publication date
CN101558110A (zh) 2009-10-14
EP2076563A1 (en) 2009-07-08
CN101558110B (zh) 2012-06-13
WO2008049743A1 (en) 2008-05-02
US20100304284A1 (en) 2010-12-02
JP5523101B2 (ja) 2014-06-18
EP2076563B1 (en) 2016-08-17
KR20090082251A (ko) 2009-07-29
US8084522B2 (en) 2011-12-27
JP2010507696A (ja) 2010-03-11
ES2603838T3 (es) 2017-03-01
JP2013241622A (ja) 2013-12-05

Similar Documents

Publication Publication Date Title
KR101435410B1 (ko) 열 안정성 양이온 광경화성 조성물
US20070225395A1 (en) Thermally stable cationic photocurable compositions
KR101435652B1 (ko) 신규한 β-옥심에스테르 플루오렌 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
KR100563019B1 (ko) 광중합 가능한 감광성 열경화성 액체 조성물
CN1128799C (zh) 基于α-氨基烯烃的可被光活化的含氮碱
KR101892086B1 (ko) 옥심에스테르 유도체 화합물, 이를 포함하는 광중합 개시제, 및 감광성 조성물
CN101466804A (zh) 硫盐引发剂
JP2001512421A (ja) α−アミノケトンに基づく光活性化可能な窒素含有塩基
KR102118233B1 (ko) 감광성 수지 조성물, 레지스트 적층체 및 그들의 경화물 (2)
WO2014080977A1 (ja) 感光性樹脂組成物、レジスト積層体及びそれらの硬化物(10)
KR102124230B1 (ko) 감광성 수지 조성물, 레지스트 적층체 및 그들의 경화물 (7)
CN109476898B (zh) 树脂组合物
JP7127635B2 (ja) 感光性樹脂組成物
EP0304886A2 (de) Oligomere Benzilketale und ihre Verwendung als Photoinitiatoren
JP7338062B2 (ja) 活性エネルギー線硬化性樹脂組成物、及び、その硬化物
US8617795B2 (en) Photosensitive resin composition and pattern forming method using the same
KR102602567B1 (ko) 염기 증식제 및 당해 염기 증식제를 함유하는 염기 반응성 수지 조성물
EP1698646B1 (en) Photocurable composition and photocurable compound
TW202328224A (zh) 光阻劑底層組成物
KR101991838B1 (ko) 신규 1,3-벤조디아졸 베타-옥심 에스테르 화합물 및 이를 포함하는 조성물
KR20240087719A (ko) 봉지용 수지 조성물
KR20210148100A (ko) 저온경화성 수지 조성물
KR20100116844A (ko) 네가티브 감광성 수지 조성물

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20171124

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180809

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210823

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210823