KR101430659B1 - Chemical Vapor Deposition Apparatus for Flat Display - Google Patents

Abstract

A chemical vapor deposition apparatus for a flat display is disclosed. A chemical vapor deposition apparatus for a flat panel display according to an embodiment of the present invention includes: a susceptor provided inside a chamber in which a deposition process is performed, in which a flat display is loaded; A column connected to a lower portion of the susceptor and having a lower end exposed downward through the chamber to support the susceptor so as to ascend and descend; And a susceptor support assembly coupled to the column to support the susceptor from below and to prevent thermal transfer of the susceptor and to flow against the thermal deformation of the susceptor to prevent shattering of the lower portion of the susceptor, .

Description

[0001] Chemical Vapor Deposition Apparatus for Flat Display [0002]

The present invention relates to a chemical vapor deposition apparatus for a flat panel display, and more particularly, to a chemical vapor deposition apparatus for a flat panel display capable of effectively supporting a susceptor in response to thermal deformation of a susceptor.

Flat displays are widely used in personal computers, monitors for TVs and computers. Such a flat display is variously classified into an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel) and an OLED (Organic Light Emitting Diodes).

Among them, an OLED called an organic light emitting diode refers to a 'self-emitting organic material' that emits light by using an electroluminescent phenomenon that emits light when a fluorescent organic compound is supplied with an electric current. OLEDs can be driven at low voltage, can be made thin, and have a wide viewing angle and fast response speed, making them the next generation display devices that can replace current LCDs.

OLEDs can be divided into passive PMOLEDs and active AMOLEDs depending on the driving method. In particular, AMOLED is a self-emissive display that has a faster response speed than conventional displays, has a natural color and has low power consumption. In addition, if AMOLED is applied to film rather than glass substrate, it can implement the technology of flexible display.

Such OLED manufacturing processes largely include a pattern forming process, an organic thin film deposition process, an encapsulating process, and a laminating process for attaching a substrate on which an organic thin film has been deposited and a substrate after an encapsulating process.

A chemical vapor deposition process is a process in which a plasma is generated by an external high-frequency power source, and silicon compound ions having high energy are ejected from the gas distribution plate through the electrode and deposited on the glass substrate Process. This process is performed in a chamber that performs a chemical vapor deposition process.

As will be described in more detail below, the chamber for performing the chemical vapor deposition process comprises an upper chamber and a lower chamber. The upper chamber is provided with an electrode, and the lower chamber is provided with a susceptor to which the glass substrate to be deposited is loaded.

When the glass substrate is loaded on the upper surface of the susceptor, the susceptor is heated to about 250 to 400 degrees centigrade. Thereafter, the susceptor rises and the glass substrate is disposed adjacent to the gas distribution plate which is the lower electrode.

Then, power is applied through the insulated electrode from the chamber by Teflon, which is an insulator. Then, a silicon substrate compound ions are ejected through a gas distribution plate having numerous orifices formed, and a glass substrate deposition process is performed.

On the other hand, during the deposition process, especially large-area susceptors can be deflected due to their own weight and temperature, so that the susceptor is prevented from sagging by supporting the bottom of the susceptor as a ceramic plate resistant to thermal deflection.

However, in such a conventional chemical vapor deposition apparatus for a flat panel display, since the ceramic plate provided on the lower surface of the susceptor is directly in surface contact with the susceptor, heat of the susceptor heated to about 400 ° C is applied to the ceramic plate Resulting in heat dissipation.

When the heat loss is induced through the ceramic plate, the thermal expansion rate changes due to the thermal imbalance between the entire region of the susceptor which is maintained at a temperature of about 250 to 400 degrees and the region where the heat loss is caused by the ceramic plate And the susceptor is distorted in the corresponding region.

Such warpage leads to deformation of the glass substrate, which causes a downward deflection of about several millimeters on the glass substrate in the area where the ceramic plate is located, resulting in deterioration of the quality of the product.

In addition, the conventional susceptor may have a lower portion of the susceptor against the ceramic plate fixed to the lower portion due to thermal expansion. When the susceptor is sagged or bent at the edge region, the susceptor deepens in the corner portion of the ceramic plate, There is a problem that the susceptor is damaged.

Korean Patent Application No. 10-2006-0011598 No. SFA, 2006.02.07

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a chemical vapor deposition (CVD) method for a flat panel display capable of maintaining a constant temperature of a heated susceptor in all regions, Device.

According to an aspect of the present invention, there is provided a plasma display apparatus comprising: a susceptor provided inside a chamber in which a deposition process is performed; A top end connected to a lower portion of the susceptor, and a bottom end exposed downward through the chamber to support the susceptor so as to move up and down; And a frictional member coupled to the column to support the susceptor from below and to restrict thermal transfer of the susceptor and flow corresponding to thermal deformation of the susceptor to prevent shattering of the lower portion of the susceptor A chemical vapor deposition apparatus for a flat panel display including a suscepter supporting assembly may be provided.

The susceptor support assembly comprising: a susceptor support plate coupled to the column and supporting a lower portion of the susceptor; And a support pad coupled to one side of the susceptor support plate and having a groove for fluidly accommodating the anti-jamming member.

The grooves of the support pads are formed in a hemispherical shape, and the shunt preventing member includes: an upper supporter for contacting and supporting the lower portion of the susceptor; And a lower receiving portion provided in a hemispherical shape extending from the upper supporting portion and slidably and rotatably received in the groove portion of the supporting pad.

The upper support part may be provided as a disc surface.

The upper support portion may further include a protruding portion protruding along a rim portion of the disc surface so that the lower portion of the susceptor can be contactably supported by the protruding portion.

The upper support portion may be provided in a hemispherical shape which is convex upward.

Wherein the susceptor support plates comprise unit susceptor support plates spaced apart from each other in parallel, wherein each of the unit susceptor support plates comprises a pair of upper support plates spaced apart from one another and supporting the lower portion of the susceptor, ; And a lower support plate coupled to a lower portion of the pair of upper support plates to connect the pair of upper support plates.

A plurality of the columns may be provided and may be coupled to the lower support plate one by one.

And a support plate connection unit connecting the unit susceptor support plates to each other.

Wherein the lower support plate further includes a seat groove for receiving one end of the support plate connection unit, and the support plate connection unit includes: a connection member interposed between the lower support plates of the unit susceptor support plates adjacent to each other; A link portion provided at both end portions of the linking member, the link portion being provided with a through hole passing through both side portions, the link portion being accommodated in the groove portion; And an engaging shaft inserted into the through hole of the link portion in a state where the link portion is accommodated in the seat groove portion and fixedly coupling the link portion to the seat groove portion.

The support pads may be provided at both ends of the upper support plate, and a plurality of the shunt preventing members may be provided on the upper surface of the support pad.

The susceptor support plate may be made of a ceramic material, and the shatter preventing member may be made of any one of ceramics, stainless steel, and aluminum.

According to the present invention, it is possible to provide a chemical vapor deposition apparatus for a flat panel display capable of keeping the temperature of a heated susceptor constant in the entire region, and preventing the lowering of the lower portion of the susceptor when heat distortion of the susceptor occurs have.

1 is a schematic structural view of a chemical vapor deposition apparatus for a flat panel display according to an embodiment of the present invention.
Figure 2 is a schematic structural view of a susceptor support assembly supporting the susceptor of Figure 1;
3 is a rear perspective view of FIG. 2. FIG.
Figure 4 is a front perspective view of the susceptor support assembly of Figure 2;
5 is an enlarged view of region A in Fig.
6 is a cross-sectional view taken along line BB in Fig.
7 is a perspective view of the anti-jamming member of Fig.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

Prior to the description with reference to the drawings, any of a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) may be used as the flat panel display.

However, in this embodiment, the OLED large glass substrate will be referred to as a flat display.

Hereinafter, for convenience, the OLED large-sized glass substrate will be simply referred to as a glass substrate.

1 is a schematic structural view of a chemical vapor deposition apparatus for a flat panel display according to an embodiment of the present invention.

As shown in this figure, the chemical vapor deposition apparatus for a flat panel display according to the present embodiment includes upper and lower chambers 10 and 20 which are capable of performing a deposition process on a glass substrate and can be disassembled and assembled with each other, An electrode 30 provided in the lower chamber 20 for discharging a deposition material as a predetermined silicon compound ion toward the glass substrate to be deposited and a susceptor 50 provided in the lower chamber 20 to support and support the glass substrate, A column 40 coupled to the susceptor 50 at an upper end thereof and having a lower end exposed downward through the lower chamber 20 to support the susceptor 50 in an ascending and descending manner, And a susceptor support assembly 70 that prevents the susceptor 50 from sagging by supporting the susceptor 50.

When the deposition process for the glass substrate proceeds, the upper and lower chambers 10 and 20 are coupled to each other as shown in FIG. That is, the upper and lower chambers 10 and 20 form one body by the upper chamber 10 being joined to the upper part of the lower chamber 20 by a separate crane.

When the upper and lower chambers 10 and 20 are formed as one body and the deposition process is performed in the deposition space S inside the deposition chamber S, Shielded.

Referring to the upper chamber 10, an electrode 30 is provided along the lateral direction inside the upper chamber 10. The electrode 30 provides the deposition material to the surface of the glass substrate by interaction with the susceptor 50, which is the lower electrode.

This electrode 30 has a gas distribution plate 31 disposed on the front face toward the lower chamber 20 and a rear space 31 on the rear side of the gas distribution plate 31 with a buffer space B between the gas distribution plate 31 interposed therebetween. And a rear plate (32) disposed on the rear side.

In the gas distribution plate 31, a number of micro-machined orifices (not shown) are formed. Therefore, when the susceptor 50 rises and is disposed close to the gas distribution plate 31 by about several tens of millimeters (mm) in the deposition process, the deposition material is discharged through a large number of orifices (not shown) Lt; / RTI >

An insulator 34 is provided between the rear plate 32 and the upper chamber 10 so that the rear plate 32 is in direct contact with the outer wall of the upper chamber 10 and is not energized. The insulator 34 may be made of Teflon or the like. At the periphery of the rear plate 32, a plate support 33 for supporting the rear plate 32 relative to the upper chamber 10 is disposed.

A present holding member 35 is provided between the gas distribution plate 31 and the rear plate 32. The present retaining member 35 not only prevents the evaporation material in the buffer space B from leaking out but also supports the gas distribution plate 31, which is a heavy weight of about 400 kg or more, with respect to the rear plate 32 .

In addition, the current holding member 35 also serves to compensate for the thermal expansion of the gas distribution plate 31 heated to about 200 degrees centigrade in at least one direction of the X axis, the Y axis, and the Z axis during the deposition process .

An upper plate 36 is provided at an upper end of the upper chamber 10. A gas supply part 37 for supplying a process gas, a reactive gas, a cleaning gas, or other gas into the deposition space S is provided on the upper part of the upper plate 36.

A high frequency power supply unit 38 is provided around the gas supply unit 37. The high-frequency power supply unit 38 is electrically connected to the rear plate 32 of the electrode 30 by a connection line 39.

The lower chamber 20 is a portion where the deposition process for the glass substrate proceeds. Therefore, the deposition space S is substantially formed in the lower chamber 20.

On the outer wall of the lower chamber 20, there is formed a substrate entry / exit portion 20a which is a passage through which the glass substrate flows into / out of the deposition space S by a predetermined work robot. The substrate entry / exit portion 20a may be selectively opened / closed by a gate valve 24 coupled to the substrate entry / exit portion 20a.

A gas diffusion plate (not shown) for diffusing the gas existing in the deposition space S back to the deposition space S is formed in the bottom surface area of the lower chamber 20 and a gas diffusion plate And a vacuum pump (not shown) for forming a vacuum atmosphere.

The susceptor 50 is disposed laterally in the deposition space S in the lower chamber 20 to support the glass substrate to be deposited. The susceptor 50 is usually formed as a structure larger than the area of the glass substrate to be vapor-deposited.

The upper surface of the susceptor 50 is made almost as a plate so that the glass substrate can be accurately and horizontally loaded. A heater (not shown) is mounted in the susceptor 50 to heat the susceptor 50 to a predetermined deposition temperature of about 250 to 400 degrees Celsius. A cable (not shown) for supplying electricity to the heater is connected to the heater through the cable tube 41 inside the column 40.

A plurality of lift pins (52) for stably supporting the lower surface of the glass substrate loaded or unloaded from the susceptor (50) are connected to the upper surface of the susceptor (50) for loading or unloading the glass substrate. The lift pins 52 may be installed to penetrate the susceptor 50 and the through hole 53 of the susceptor support assembly.

When the susceptor 50 is lowered, the lower ends of the lift pins 52 are pressed against the bottom surface of the lower chamber 20 so that the upper ends of the lift pins 52 protrude from the upper surface of the susceptor 50. Then, the glass substrate is separated from the susceptor 50. Conversely, when the susceptor 50 floats, the glass substrate moves downward due to its own weight so that the glass substrate is brought into close contact with the upper surface of the susceptor 50.

The lift pins 52 also serve to form a space between the glass substrate and the susceptor 50 so that a robot arm (not shown) can grasp the glass substrate loaded on the susceptor 50.

The susceptor 50 is provided with a column 40 having an upper end fixed to the center region of the rear surface of the susceptor 50 and a lower end exposed downward through the lower chamber 20 to support the susceptor 50 in an ascending and descending manner. Are combined. A plurality of such columns 40 are provided and disposed at both the central portion of the susceptor and both side portions of the susceptor to support the susceptor so as to ascend and descend.

The susceptor 50 is vertically moved up and down in the deposition space S in the lower chamber 20. That is, when the glass substrate is loaded, the glass substrate is placed in the bottom surface area of the lower chamber 20, and the glass substrate is loaded. When the deposition process is performed, the glass substrate floats so as to be adjacent to the gas distribution plate 31. To this end, the column 40 coupled to the susceptor 50 is connected to an ascending / descending module 60 for ascending and descending the susceptor 50.

The space between the column 40 and the lower chamber 20 should not be generated in the course of the ascending and descending of the susceptor 50 by the ascending and descending module 60. A bellows tube 58 is provided to cover the outside of the column 40 in a corresponding region of the lower chamber 20 through which the column 40 passes. The bellows tube 58 expands when the susceptor 50 descends, and is squeezed when the susceptor 50 is lifted.

On the other hand, the susceptor supporting the glass substrate is made of aluminum (Al) material stable to chemical reaction due to the characteristics of the chemical vapor deposition apparatus, and is heated to about 250 to 400 degrees Celsius in the vapor deposition process. The area susceptor may be deflected due to its own weight and temperature.

Thus, a means for stably supporting the susceptor 50 is required, which is the responsibility of the susceptor support assembly. The susceptor support assembly will be described in detail with reference to Figs. 2 to 4. Fig.

FIG. 2 is a schematic structural view of a susceptor support assembly supporting the susceptor of FIG. 1, FIG. 3 is a rear perspective view of FIG. 2, FIG. 4 is a front perspective view of the susceptor support assembly of FIG. 2, 4 is an enlarged view of the area A, Fig. 6 is a sectional view taken along the line BB in Fig. 5, and Fig. 7 is a perspective view of the anti-

Referring to these figures, the susceptor support assembly 70 includes a susceptor support plate 80 coupled to the column 40 to support the susceptor in its lower portion, A supporting pad 90 and a frictional member 100 rotatably positioned on the supporting pad 90 and supporting the lower surface of the susceptor in contact therewith.

The susceptor support plates 80 include unit susceptor support plates 80a that are arranged in parallel spaced apart from each other to support the central region and the edge region of the susceptor, respectively. In addition, the susceptor support plate 80 may be made of a ceramic material that is resistant to deflection of the heat. Such a ceramic susceptor support plate 80 may be integrally manufactured It is efficient to divide the unit susceptor support plate 80a into three unit susceptor support plates 80a as in this embodiment.

The unit susceptor support plates 80a are spaced apart from each other and include a pair of upper support plates 81 for supporting the lower portion of the susceptor 50, And a lower support plate (82) connecting the pair of upper support plates (81).

In the present embodiment, the upper support plate 81 is formed as a pair of two upper support plates 81 arranged in a rectangular plate shape arranged in the longitudinal direction with respect to the susceptor 50 and spaced apart from each other . The lower support plate 82 is provided in a square plate shape to support the center of gravity of the pair of upper support plates 81. The pair of upper support plates 81 and lower support plates 82 may be made of a ceramic material resistant to sagging due to heat and may be bolted to each other.

The susceptor support plate 80 is provided such that three unit susceptor support plates 80a are spaced apart from each other with respect to the susceptor 50 so that a total of six upper support plates 81 are disposed on the susceptor 50, It is possible to evenly support the center region and the edge region of the substrate. At this time, the three lower support plates 82 are coupled to one column 40, respectively, so that the three unit susceptor support plates 80a are independently supported by the column 40.

The support pad 90 is disposed in the rim region of the susceptor support plate 80 and the heat of the heated susceptor 50 interposed between the susceptor 50 and the susceptor support plate 80 is transferred to the susceptor support plate 80, Thereby blocking the transfer to the plate 80. The support pad 90 may be made of ceramic or aluminum.

On the other hand, if the three unit susceptor support plates 80a are only dividedly arranged and connected to the corresponding area of the lower surface of the susceptor 50, each unit susceptor support plate 80a can have the thermal expansion of the above- (F). ≪ / RTI >

To this end, the chemical vapor deposition apparatus for a flat panel display according to the present embodiment includes three unit susceptor support plates 80a connected in a divided manner so as to be integrated with each other, so that the susceptor 50 is vulnerable to thermal expansion and stress due to its own weight And a supporting plate connecting unit (110) for supplementing the supporting plate.

The support plate connection unit 110 is interposed between any one lower support plate 82 and another adjacent lower support plate 82 to connect the two lower support plates 82 to each other. 3, the support plate connecting unit 110 according to the present embodiment includes a lower support plate 82 of a unit susceptor support plate 80a disposed at the center of the susceptor 50, And two lower support plates 82 of the unit susceptor support plate 80a.

The support plate connection unit 110 includes a connection member 111 interposed between the lower support plates 82 of adjacent unit susceptor support plates 80a and a connection member 111 formed at both ends of the connection member 111, A link portion 112 provided with a through hole 112a and a coupling shaft 113 coupling the link portion 112 to the lower support plate 82.

The connecting member 111 is provided in the shape of a bar connecting both end portions of the two adjacent lower support plates 82 to connect the lower support plate 82. The link portion 112 is provided with a through hole 112a formed to pass through in the width direction and accommodated in a seat groove portion 83 formed in an end region of the lower support plate 82. [ The seat groove portion 83 is formed in a shape corresponding to the link portion 112 so as to be concavo-convex coupled.

The engagement shaft 113 is formed by partially hollowing the side of the lower support plate 82 in the direction intersecting the seat groove 83 and is provided with the engagement hole 84 and the engagement hole 84 communicating with the seat recess 83, Is inserted into the through hole 112a of the link portion 112 corresponding to the groove portion 83 and the link portion 112 is coupled to the seat groove portion 83. [ That is, when the link portion 112 is placed in the seat groove portion 83, the through hole 112a of the link portion 112 coincides with the engaging hole 84, The linking portion 113 can be inserted through the through hole 112a and the through hole 112a and the link portion 112 can be coupled to the seat groove portion 83. [

Further, a cover screw 114 for preventing disengagement of the coupling shaft 113 is engaged with the coupling hole 84. The cover screw 114 may block foreign matter from penetrating into the engagement hole 84.

When the susceptor 50 is directly brought into surface contact with the support pad 90 or the susceptor support plate 80 provided below the susceptor 50 in order to prevent the susceptor 50 from sagging, The heat of the susceptor 50 heated to a temperature may cause a problem of heat loss through the susceptor support plate 80. [ When the heat loss is induced through the susceptor support plate 80, the entire area of the susceptor 50, which is maintained at a constant temperature of about 400 degrees, and the area where heat loss is caused by the susceptor support plate 80 The thermal expansion rate due to the thermal imbalance is changed, and the susceptor 50 may be distorted in the corresponding region.

2) of the susceptor 50 is largest at corners and edges due to thermal expansion and self-weight. At this time, the susceptor 50 is thermally expanded to the susceptor support plate 80 The lower portion of the susceptor 50 may be split with respect to the susceptor 50 and the susceptor 50 may be deflected over time to cause the susceptor 50 to be deeply pinched or clipped at the edge portion of the susceptor support plate 80, (50) may be damaged.

Thus, a means is required to prevent the heat of the susceptor 50 from being damaged by the heat loss through the susceptor support plate 80 and the thermal expansion and deflection of the susceptor 50, This is achieved by the anti-jamming member (100).

4 to 7, the shunt preventing member 100 according to the present embodiment is provided on the upper surface of the support pad 90 so as to support the lower surface of the susceptor so that the heat of the susceptor is transmitted to the support pad 90 and the susceptor, And is prevented from being transmitted to the support plate (80). The shredding member 100 is movable with respect to the support pad 90 to prevent damage to the lower surface of the susceptor 50 in the event of thermal deformation such as thermal expansion and deflection of the susceptor 50.

The shredding prevention member 100 includes an upper support portion 101 for supporting the lower surface of the susceptor in contact with the upper support portion 101, And a bottom receiving portion 102 which is formed of a metal plate.

The upper support portion 101 includes protrusions 101a protruding along the edge regions of the disc surface and the disc surface. The lower surface of the susceptor 50 can be contacted and supported by the projecting portion 101a of the upper support portion 101. [ The lower surface of the susceptor 50 is contacted and supported by the projecting portion 101a as compared with the case where the lower surface of the susceptor 50 is directly supported by the support pad 90 or the upper support plate 81. As a result, Can be reduced. Unlike the embodiment of the present invention, the upper support portion 101 is provided only on the disc surface on which the protrusions 101a are not formed, so that the disc surface contacts the lower surface of the susceptor 50, or the upper support portion 101 has the upwardly convex hemispherical shape or half- As shown in FIG.

The lower receiving portion 102 is a hemispherical or semi-ellipsoidal portion and is accommodated in the groove portion 91 of the supporting pad 90. The groove portion 91 of the support pad 90 forms a hemispherical or semi-elliptic space having a concave inner side inside the support pad 90 as a portion where the lower end receiving portion 102 is floatably accommodated.

The lower receiving part 102 is provided so that the diameter of the lower receiving part 102 is slightly smaller than the diameter of the groove 91 of the supporting pad 90 and flows in the groove 91 of the supporting pad 90. The lower receiving portion 102 can be rotated in the forward and reverse directions within the groove 91 of the supporting pad 90 when receiving an external force in the horizontal direction and when the receiving portion 102 receives an external force in the vertical direction, It can be slid along the curved surface.

When the horizontal stress due to the thermal expansion of the susceptor is generated by the flow of the lower receiving portion 102, the lower receiving portion 102 of the shearing preventing member 100 rotates corresponding to the thermal expansion direction of the susceptor, The stress is dispersed to reduce the friction with the susceptor.

When the susceptor 50 is deflected due to the temperature and its own weight in the edge region of the susceptor 50, the lower stage accommodating portion 102 is rotated by an angle with the deflection direction of the susceptor 50, The slope of the groove portion 91 of the susceptor 50 can be reduced and the damage of the susceptor 50 can be reduced. Particularly, the bottom surface of the susceptor 50 can be supported by the inclining member 100 tilted by the deflection angle of the susceptor 50 at the lower end of the susceptor 50 where the edge of the upper supporting plate 81 touches It is possible to prevent the lower surface of the susceptor 50 from deeply piercing the upper support plate 81.

For reference, the thermal deformation of the susceptor 50 over time is mainly limited to a range of several millimeters in the edge region, and most of the susceptor 50 is supported by the susceptor support plate 80, 102 is inclined with respect to the curved surface of the groove portion of the support pad 90 so that one side of the upper support portion 101 does not descend to the groove portion 91 of the support pad 90 and the rotation of the lower end accommodating portion 102, (50). ≪ / RTI >

The anti-jamming member 100 may be made of any one of ceramics, stainless steel, and aluminum. A plurality of the anti-jamming members 100 may be provided on the upper surface of the support pad 90 coupled to both ends of the upper support plate 81. In this embodiment, the four support members 100 are provided on one support pad 90, and each support pad 90 includes two upper support plates 81 and two outermost support plates 81 The heat of the susceptor 50 is prevented from being generated through the support pad 90 and the upper support plate 81 by heat loss while the susceptor 50 is stably supported at the center of the upper support plate 81 And the lower portion of the susceptor 50 is prevented from being damaged or cracked during thermal deformation.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

10: upper chamber 20: lower chamber
20a: substrate entrance part 30: electrode
31: gas distribution plate 32: rear plate
35: current holding member 37: gas supply part
38: RF power unit 40: Column
50: susceptor 52: lift pin
60: lifting / lowering module 70: susceptor supporting assembly 80: susceptor supporting plate 90: supporting pad 100: forcing member 110: supporting plate connecting unit

Claims (12)

A susceptor provided inside the chamber in which the deposition process is performed and on which the flat display is loaded;
A top end connected to a lower portion of the susceptor, and a bottom end exposed downward through the chamber to support the susceptor so as to move up and down; And
And a jam preventing member which is coupled to the column to support the susceptor from below and restricts heat transfer of the susceptor and flows in accordance with thermal deformation of the susceptor to prevent jamming of the lower portion of the susceptor A susceptor support assembly,
The susceptor support assembly includes:
A susceptor support plate coupled to the column and supporting a lower portion of the susceptor; And
Further comprising a support pad coupled to one side of the susceptor support plate and having a groove for fluidly receiving the anti-
The groove of the support pad is formed in a hemispherical shape,
The anti-
An upper support portion for contacting and supporting the lower portion of the susceptor; And
And a lower receiving portion provided in a hemispherical shape extending from the upper supporting portion and slidably and rotatably received in a groove portion of the supporting pad,
Wherein the upper support portion is provided as a disk surface,
Wherein the upper-
Wherein a protruding portion protruding along an edge region of the disk surface is further formed so that the lower portion of the susceptor is contactably supported by the protruding portion. delete delete delete delete delete The method according to claim 1,
Wherein the susceptor support plate comprises unit susceptor support plates spaced apart from one another,
Each of the unit susceptor support plates includes:
A pair of upper support plates spaced apart from each other and supporting a lower portion of the susceptor; And
And a lower support plate coupled to a lower portion of the pair of upper support plates to connect the pair of upper support plates. 8. The method of claim 7,
A plurality of the columns are provided,
Wherein the first and second support plates are coupled to the lower support plate one by one. 8. The method of claim 7,
And a support plate connection unit connecting the unit susceptor support plates to each other. 10. The method of claim 9,
Wherein the lower support plate further comprises a seat groove for receiving one end of the support plate connection unit,
Wherein the support plate connecting unit comprises:
A connecting member interposed between the lower support plates of the unit susceptor support plates adjacent to each other;
A link portion provided at both end portions of the linking member, the link portion being provided with a through hole passing through both side portions, the link portion being accommodated in the groove portion; And
And an engaging shaft inserted into the through hole of the link portion in a state where the link portion is accommodated in the seat groove portion and fixedly coupling the link portion to the seat groove portion. 8. The method of claim 7,
Wherein the support pads are provided at both ends of the upper support plate,
Wherein a plurality of the anti-jamming members are provided on the upper surface of the support pad. The method according to claim 1,
The susceptor support plate is made of a ceramic material,
Wherein the anti-jamming member is made of one of ceramic, stainless steel and aluminum.

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