KR100738876B1 - Chemical vapor deposition apparatus for flat display - Google Patents

Abstract

A CVD apparatus for a flat display is provided to stably support a gas distribution plate in a suspending state against an electrode, without forming a spaced space therebetween. An electrode(16) is provided in a chamber in which a deposition process for a flat display is carried out. An electrode support(25) is provided on one side of the electrode to support the electrode. A gas distribution plate(17) is disposed under the electrode to distribute a deposition material on the flat display. A corrugated suspending support member(50) is connected to a surrounding portion of the gas distribution plate to support the gas distribution plate against the electrode.

Description

Chemical Vapor Deposition Apparatus for Flat Displays {Chemical Vapor Deposition Apparatus for Flat Display}

1 is an enlarged view of an electrode region in a chemical vapor deposition apparatus for a planar display according to the prior art.

2 is a schematic structural diagram of a chemical vapor deposition apparatus for planar display according to a first embodiment of the present invention.

3 is a perspective view of area “A” of FIG. 2.

4 is an exploded perspective view of FIG. 3.

5 is an enlarged side view of the suspension supporting member shown in FIG. 2.

6 is a view schematically showing a state in which the suspension supporting member shown in FIG. 5 is thermally expanded in the same direction as the gas distribution plate is thermally expanded in the X-axis direction.

7 is a partial perspective view of a suspension support member in a chemical vapor deposition apparatus for a planar display according to a second embodiment of the present invention.

8 is a partial perspective view of a suspension support member in a chemical vapor deposition apparatus for a planar display according to a third embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10 chamber 11 bottom surface

17 gas distribution plate 17a orifice

17b: groove 19: spaced space part

25 electrode support 27 slit

30: susceptor 31: substrate loading portion

40: susceptor support 50: suspension support member

51: side wall portion 52a, 52b: corrugated groove

54: upper wall part 57: lower wall part

60: departure stop

The present invention relates to a chemical vapor deposition apparatus for a flat panel display, and more particularly, it is possible to stably support the gas distribution plate with respect to the electrode while not allowing the space to be spaced apart to open the entire heat flow within a limited height. It is possible to prevent the heat of the gas distribution plate from conducting upward by increasing the length of the gas distribution plate and also to effectively cope with thermal expansion of the gas distribution plate due to the mechanical stability. The present invention relates to a chemical vapor deposition apparatus for planar displays, which can prevent the occurrence of defects.

Flat panel displays are widely used in personal handheld terminals, as well as in TVs and computers.

Such flat displays include a variety of types such as cathode ray tube (CRT), liquid crystal display (LCD), plasma display panel (PDP), and organic light emitting diodes (OLED).

Among them, liquid crystal display (LCD) injects a liquid crystal, which is an intermediate between solid and liquid, between two thin upper and lower glass substrates, and generates light and shade by changing the arrangement of liquid crystal molecules by the electrode voltage difference between the upper and lower glass substrates. It is a device using a kind of optical switch phenomenon to display an image.

LCDs are now widely used in electronic clocks, electronic calculators, TVs, notebook PCs, electronic products, automobiles, aircraft speed displays and driving systems.

Previously, LCD TVs have a size of about 20 to 30 inches, and monitors have a mainstream size of 17 inches or less. In recent years, however, the preference for large TVs of 40 inches or larger and large monitors of 20 inches or larger has increased.

Therefore, manufacturers of LCDs have come to produce wider glass substrates. Currently, research has been conducted to increase the size of glass substrates to the 7th generation having a width of 1950 × 2250 mm or 1870 × 2200 mm, or the 8th generation having a width of 2160 × 2460 mm or more.

LCD is a TFT process in which processes such as deposition, photo lithography, etching, chemical vapor deposition, etc. are repeatedly performed, a cell process for bonding upper and lower glass substrates, and an apparatus It is released as a product through the completed module process.

On the other hand, the chemical vapor deposition process, one of many processes, is plasma-formed by an external high frequency power source, and silicon-based compound ions having high energy are ejected from the gas distribution plate through the electrodes. It is a process to be deposited on a glass substrate.

1 is an enlarged view of an electrode region in a chemical vapor deposition apparatus for a planar display according to the prior art.

As shown in the figure, the electrode 116 is provided on the upper portion of the process chamber 110 (hereinafter referred to as a chamber) for performing a chemical vapor deposition process in the prior art. The electrode 116 is coupled to the electrode support 125 disposed adjacent to the chamber upper wall (not shown) formed in the upper region of the chamber 110.

The lower portion of the electrode 116 is provided with a gas distribution plate 117 for distributing a predetermined deposition material (reactive gas, a silicon-based compound) onto a flat panel display (not shown). A plurality of orifices 117a through which reactive gas passes are formed on the plate surface of the gas distribution plate 117. A space 119 is formed between the gas distribution plate 117 and the electrode 116 as a space in which the reactive gas flows.

A suspension support member 150 is provided between the electrode 116 and the gas distribution plate 117 along the circumferential direction of the electrode 116 and the gas distribution plate 117. Suspension support member 150 has a limited height to prevent the heat of the gas distribution plate 117 is conducted to the top, it is manufactured by bending a thin thin plate having a thickness of about 1 mm.

The upper wall portion 154 that is bent at the upper end of the side wall portion 151 of the suspension supporting member 150 is fixed to the electrode 116 by the bolt 155, and the lower wall portion bent at the lower end of the side wall portion 151 ( 157 is fixed to the gas distribution plate 117 by pins 158.

The suspension supporting member 150 serves to shield the spaced space portion 119 so that the reactive gas existing in the spaced space portion 119 does not leak to the outside. In addition, the suspension supporting member 150 supports the gas distribution plate 117 having a heavy weight of about 400 kg with respect to the electrode 116, and the gas distribution plate 117 heated to about 200 ° C. during the deposition process. Compensate for thermal expansion.

That is, as the deposition process proceeds, the susceptor (not shown) loaded with the planar display is heated to a temperature of about 400 ° C., and is disposed adjacent to the gas distribution plate 117, whereby the gas distribution plate 117 has a temperature of about 200 ° C.

Therefore, the gas distribution plate 117 thermally expands in the X-axis, Y-axis, and Z-axis directions with respect to the plate surface of the gas distribution plate 117. In particular, thermal expansion in the X-axis and Y-axis directions, which are the plate surface directions of the gas distribution plate 117, is deepened. In this case, the suspension supporting member 150 suspends the gas distribution plate 117 while expanding as much as the length of the gas distribution plate 117 is extended by thermal expansion.

By the way, in the conventional chemical vapor deposition apparatus for planar displays, since the suspension supporting member 150 is made of a simple thin plate structure sufficiently thin, mechanical stability is lowered and the gas distribution plate 117 is the same as the thermal expansion. It is not possible to expand to cause the gap (Gap) in the region of the upper wall portion 154 or the lower wall portion 157, which causes the reactive gas in the separation space 119 is leaked to the outside through the gap (Gap) There is this.

As such, when the reactive gas is leaked to the outside through the gap, abnormal discharge occurs at the outer portion of the gas distribution plate 117 to impair the uniformity of the process and further cause particle defects in the flat panel display. do.

It is an object of the present invention to stably support the gas distribution plate with respect to the electrode while not allowing the space to be opened, and to increase the length of the overall heat flow within a limited height so that the heat of the gas distribution plate is conducted upward. And chemical stability for the flat display, which can effectively cope with thermal expansion of the gas distribution plate due to mechanical stability, and thus, the separation of the space is opened, thereby preventing the uniformity of the process and the occurrence of particle defects. It is to provide a vapor deposition apparatus.

The object is, in accordance with the present invention, an electrode coupled to the chamber in which the deposition process for the planar display proceeds; An electrode support part provided on one side of the electrode to support the electrode; A gas distribution plate disposed below the electrode with a predetermined spaced portion between the electrode and distributing a deposition material on the flat panel display; And a suspension support member having a corrugated structure that is coupled along the circumferential direction of the electrode and the gas distribution plate so as to shield the separation space, and suspends the gas distribution plate with respect to the electrode. It is achieved by a chemical vapor deposition apparatus.

Here, the suspension supporting member suspends the gas distribution plate with respect to the electrode based on the gas distribution plate thermally expanding in at least one of X, Y, and Z axis directions with respect to the plate surface of the gas distribution plate. I support it.

The corrugated suspension supporting member includes: a sidewall portion disposed horizontally in an arrangement direction of the electrode and the gas distribution plate and having a plurality of corrugated grooves recessed inward on an outer surface thereof; An upper wall portion formed horizontally on a plate surface of the side wall portion at an upper end of the side wall portion; And a lower wall portion formed parallel to the upper wall portion at a lower end of the side wall portion.

A plurality of corrugation grooves formed in the side wall portion are formed on both side surfaces of the side wall portion.

The plurality of corrugation grooves formed on both side surfaces of the side wall portion are mutually disposed on both side surfaces of the side wall portion so as not to be arranged on the same horizontal axis.

The spacing between the corrugations is substantially the same.

The recessed depth of the corrugation grooves is at least less than half the thickness of the side wall portion.

The thickness of at least one of the upper wall portion and the lower wall portion is larger than the thickness of the side wall portion.

The upper wall portion and the lower wall portion extend in opposite directions with respect to the side wall portion.

The upper wall portion is stitched to a slit formed between the electrode and the electrode support portion.

The lower wall portion is inserted into and coupled to a groove formed on a side of the gas distribution plate, and the lower wall portion and the gas distribution plate are provided with a release blocking portion for preventing the lower wall portion from being separated from the groove.

The separation blocking unit, the first pin insertion portion formed in the gas distribution plate; A second pin insertion portion formed in the lower wall portion and communicating with the first pin insertion portion when the lower wall portion is inserted into the groove; And a pin block integrally inserted and fastened through the first and second pin insertion portions communicated with each other.

The lower wall portion adjacent to the side wall portion is provided with a valley portion that prevents interference with the gas distribution plate that is thermally expanded.

The side wall portion has a thickness of 2 mm to 6 mm.

The corrugations are hemispherical in shape.

The suspension supporting member of the corrugation structure is made of aluminum.

The flat panel display is a large glass substrate for an LCD (Liquid Crystal Display).

Hereinafter, with reference to the accompanying drawings will be described in detail for each embodiment of the present invention. In the description, the same reference numerals are given to the same components.

As described above, any one of a cathode ray tube (CRT), a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) may be applied to the flat panel display described below.

However, in the present embodiment, a large glass substrate for liquid crystal display (LCD) will be regarded as a flat panel display. As described above, the large size refers to the size of the level applied to the 7th or 8th generation.

FIG. 2 is a schematic structural diagram of a chemical vapor deposition apparatus for a planar display according to a first embodiment of the present invention, FIG. 3 is a perspective view of region “A” of FIG. 2, and FIG. 4 is an exploded perspective view of FIG. 3.

As shown in FIG. 2, the chemical vapor deposition apparatus 1 for a flat panel display according to the present invention includes a chamber 10 and a glass substrate G to be deposited, which is provided in the chamber 10. Adjacent to the susceptor 30, a plurality of susceptor supports 40 supporting the susceptor 30 below the susceptor 30, and an upper chamber 8 formed in the upper region of the chamber 10. An electrode support portion 25, an electrode 16 supported by the electrode support portion 25 and emitting a predetermined deposition material (reactive gas, which is a silicon-based compound), and a glass substrate G provided below the electrode 16. And a gas distribution plate 17 for distributing the reactive gas onto the phase.

In the chamber 10, the outer wall is shielded from the outside so that the deposition space S therein can be maintained in a vacuum atmosphere. In the deposition space S of the chamber 10, inert gases He and Ar are filled in the deposition process.

A remote plasma 18 is provided above the outside of the chamber 10 to supply a predetermined cleaning gas for removing impurities remaining in the chamber 10. The high frequency power supply unit 20 is provided around the remote plasma 18. The high frequency power supply unit 20 is connected to the electrode 16 by a connection line 22.

The outer wall of the chamber 10 is formed with an opening 10a which is a passage through which the glass substrate G flows in and out of the chamber 10 by a predetermined working robot. Although not shown, the opening 10a is selectively opened and closed by a door (not shown).

A gas diffusion plate 12 is provided on the bottom surface 11 of the chamber 10 to diffuse the gas existing in the deposition space S in the chamber 10 back into the deposition space S. In the central region of the bottom surface 11 in the chamber 10, a through hole 10b through which the column 32 of the susceptor 30 penetrates is formed. An additional through hole 10c through which the shaft portion 42 of the susceptor support 40 penetrates is further formed around the through hole 10b.

The susceptor 30 has a substrate loading part 31 for supporting a glass substrate G loaded in a transverse direction in the deposition space S in the chamber 10, and an upper end thereof is the center of the substrate loading part 31. The lower end includes a column 32 that is fixed to the through hole 10b and disposed outside the chamber 10.

The upper surface of the substrate loading portion 31 is made of almost a plate so that the glass substrate G can be loaded in a precise horizontal state. A heater (not shown) is mounted inside the substrate loading unit 31 to heat the substrate loading unit 31 to a predetermined deposition temperature of approximately 400 ° C.

The susceptor 30 moves up and down in the deposition space S in the chamber 10. That is, when the glass substrate G is loaded, the glass substrate G is disposed in the bottom surface 11 region of the chamber 10, and when the glass substrate G is loaded and the deposition process is performed, the glass substrate G is a gas distribution plate ( 17) Injury so as to be adjacent to. During the deposition process, the substrate loading portion 31 of the susceptor 30 floats on the lower surface of the gas distribution plate 17 to an interval of about several tens of millimeters (mm).

For this purpose, the elevating module 36 for elevating the susceptor 30 is provided in the column 32 of the susceptor 30. The susceptor 30 and the susceptor support 40 are elevated together by the lifting module 36.

In the process of elevating the susceptor 30 by the elevating module 36, no space is generated between the column 32 of the susceptor 30 and the through hole 10b. Accordingly, the bellows pipe 34 is provided around the through hole 10b to surround the outside of the column 32. The bellows pipe 34 is expanded when the susceptor 30 descends and is compressed when the susceptor 30 rises to prevent space from occurring between the column 32 and the through hole 10b.

The substrate loading part 31 of the susceptor 30 is provided with a plurality of lift pins 38 which reliably support the lower surface of the glass substrate G loaded or taken out to guide the upper surface of the substrate loading part 31. . The lift pin 38 is provided to penetrate the substrate loading portion 31.

When the susceptor 30 is lowered by the elevating module 36, the lift pin 38 is pressed to the bottom 11 of the chamber 10 so that the top thereof is the top surface of the substrate loading part 31. It protrudes. Thus, the glass substrate G is spaced apart from the substrate loading part 31. On the contrary, when the susceptor 30 floats, the susceptor 30 moves downward to bring the glass substrate G into close contact with the upper surface of the substrate loading part 31.

The lift pin 38 is disposed between the glass substrate G and the substrate loading portion 31 so that the robot arm (not shown) can grip the glass substrate G loaded on the substrate loading portion 31 of the susceptor 30. It also serves to form a space.

As described above, the susceptor 30 under 7th generation or 8th generation may have a large weight and a relatively large size, which may cause sag. In this case, sagging may occur on the glass substrate G.

Thus, as shown, a plurality of susceptor support 40 is provided below the substrate loading portion 31 of the susceptor 30 to support the substrate loading portion 31 of the susceptor 30. Since the substrate loading part 31 is formed to be larger than the size of the large glass substrate G, sagging occurs seriously toward the radially outer side from the central column 32.

Therefore, the susceptor support 40 is provided in plurality in the outer region of the substrate loading part 31 of the susceptor 30 to prevent the substrate loading part 31 of the susceptor 30 from sagging.

The susceptor support 40 has a head portion 41 positioned on the bottom surface of the substrate loading portion 31, and a shaft portion extending from the head portion 41 and arranged side by side with the column 32 of the susceptor 30. Has 42.

The end of the shaft portion 42 is integrally coupled to the elevating module 36, like the column 32. Therefore, when the elevating module 36 operates, the elevating module 36 moves up and down together with the susceptor 30. A bellows pipe 34a is also formed in the region of the shaft portion 42.

An insulator 26 is provided between the electrode 16 and the outer wall of the chamber 10 so that the electrode 16 directly contacts the outer wall of the chamber 10 and does not conduct electricity. The insulator 26 may be made of Teflon or the like. The space | interval space part 19 as an exhaust buffer space is formed between the electrode 16 and the gas distribution board 17. As shown in FIG.

The gas distribution plate 17 for distributing the reactive gas has a heavy weight of about 400 kg. The gas distribution plate 17 is heated to a temperature of about 200 ° C. due to the susceptor 30 being heated to a temperature of about 400 ° C. during the deposition process.

The orifice 17a (refer FIG. 3 and FIG. 4) is formed in the plate surface of this gas distribution board 17. FIG. Accordingly, the reactive gas provided from the electrode 16 may be distributed into the chamber 10 through the plurality of orifices 17a via the space 19.

On the other hand, in the chemical vapor deposition apparatus according to the present invention, a suspension supporting member 50 having a corrugated structure is provided between the electrode 16 and the gas distribution plate 17.

The suspension supporting member 50 of the corrugated structure serves to shield the spaced space portion 19 so that the reactive gas existing in the spaced space portion 19 does not leak to the outside. Therefore, the suspension supporting member 50 of the corrugation structure is continuously disposed along the circumferential direction of the electrode 16 and the gas distribution plate 17. 3 and 4 illustrate the suspension supporting member 50 having a corrugated structure located on one side for convenience of description.

The corrugated suspension supporting member 50 suspends the gas distribution plate 17 with respect to the electrode 16 having a heavy weight of about 400 kg. That is, as shown, the gas distribution plate 17 is positioned above the chamber 10 in a state suspended from the suspension supporting member 50 of the corrugated structure.

In addition, the corrugated suspension supporting member 50 compensates for the thermal expansion of the gas distribution plate 17 heated at about 200 ° C. in at least one of the X, Y, and Z directions of FIG. 3 during the deposition process. It thermally expands together with the gas distribution plate 17 so as to be able to do so. Of course, when the deposition process is completed, the gas distribution plate 17 and the suspension supporting member 50 is contracted to the original state.

Since the suspension supporting member 50 performing various roles as described above needs to have a structure different from that of the prior art (see FIG. 1), in the present embodiment, the suspension supporting member 50 has a corrugated structure.

However, the heat of the gas distribution plate 17 should not be conducted upward through the suspension supporting member 50 having a corrugated structure. Therefore, the suspension supporting member 50 of this embodiment also needs to be designed to have a limited height as in the prior art.

The suspension supporting member 50 having a corrugated structure will be described in detail with reference to FIGS. 3 to 6 as follows.

The corrugated suspension supporting member 50 has a plurality of corrugated grooves 52a disposed horizontally in the arrangement direction (left and right directions in FIG. 2) of the electrode 16 and the gas distribution plate 17 and recessed inwardly on an outer surface thereof. 52b), the upper wall portion 54 formed horizontally on the plate surface of the side wall portion 51 at the upper end of the side wall portion 51, and the upper wall portion (lower portion of the side wall portion 51). A lower wall portion 57 formed in parallel with 54;

The suspension supporting member 50 of the corrugation structure may be made of aluminum. That is, the side wall part 51, the upper wall part 54, and the lower wall part 57 can be integrally manufactured by bending the said position from aluminum. In this case, the upper wall portion 54 and the lower wall portion 57 may be bent at a corresponding position of the side wall portion 51 or may be formed by a method such as machining. However, in some cases, the side wall part 51, the upper wall part 54 and the lower wall part 57 may be partially manufactured to be welded or bolted to each other.

The side wall part 51 is formed larger than the thickness of the conventional suspension support member 150 (refer to FIG. 1). That is, the side wall portion 51 may have a thickness t (see FIG. 5) of about 2 mm to 6 mm. In the present embodiment, the thickness t of the side wall portion 51 is about 4 mm.

At this time, at least one of the upper wall portion 54 and the lower wall portion 57 may be formed larger than the thickness t of the side wall portion 51. In the present embodiment, the lower wall portion 57 may be formed as a side wall portion ( It is produced larger than the thickness t of 51). The upper wall portion 54 is made almost similar to the thickness t of the side wall portion 51.

A plurality of corrugation grooves 52a and 52b are formed in each of both side surfaces of the side wall portion 51. The corrugation grooves 52a and 52b have an approximately hemispherical shape. However, it is not necessary to achieve a full hemispheric shape, and a partial arc shape is sufficient.

The number of corrugation grooves 52a and 52b can be appropriately selected. However, it is preferable that the plurality of corrugated grooves 52a and 52b formed on both side surfaces of the side wall portion 51 intersect each other on both side surfaces of the side wall portion 51 so as not to be arranged on the same horizontal axis.

As such, when the plurality of corrugated grooves 52a and 52b are mutually disposed at both sides of the wall 51, the length of the overall heat flow increases within a limited height, and thus the heat of the gas distribution plate 17 is moved upward. To be preached.

In addition, due to the plurality of corrugated grooves 52a and 52b, the suspension supporting member 50 may increase its expansion length more (see FIG. 6), thereby effectively coping with thermal expansion of the gas distribution plate 17. Therefore, as the separation space 19 is opened, uniformity of the process may be lowered and particle defects may be prevented from occurring.

At this time, in order to ensure mechanical stability due to thermal expansion and contraction, the spacing interval between the corrugated grooves 52a and 52b may be substantially the same. However, the spacing between the corrugation grooves 52a and 52b need not be exactly the same.

In addition, in the present embodiment, the recessed depths of the corrugation grooves 52a and 52b are formed at least smaller than half the thickness of the side wall portion 51. As described above, when the thickness t of the side wall portion 51 is 4 mm, the depth of depression of the corrugation grooves 52a and 52b has a level of 2 mm or less. This is also a method for ensuring mechanical stability due to thermal expansion and contraction, and need not be limited thereto.

The upper wall portion 54 extends along the outer wall direction of the chamber 10 at the upper end of the side wall portion 51. Unlike the prior art, in the present embodiment, the upper wall portion 54 of the suspension support member 50 is bit-coupled to the slit 27 formed between the electrode 16 and the electrode support portion 25. Accordingly, the suspension supporting member 50 can cope with thermal expansion of the gas distribution plate 17 because the suspension structure 50 can flow at a predetermined interval of the slit 27 together with the corrugation structure during thermal expansion of the gas distribution plate 17. do.

The lower wall portion 57 extends toward the gas distribution plate 17 from the lower end of the side wall portion 51. That is, the lower wall portion 57 extends in the opposite direction to the upper wall portion 54. The lower wall portion 57 is further provided with a valley portion 57a at the position adjacent to the side wall portion 51 to prevent interference with the gas distribution plate 17 that is thermally expanded.

The lower wall portion 57 also has a structure that is inserted into the groove 17b formed on the side surface of the gas distribution plate 17 similarly to the upper wall portion 54. However, since the gas distribution plate 17 and the suspension supporting member 50 having a corrugated structure flow while thermally expanding, the lower wall portion 57 may be separated from the groove 17b.

In order to prevent this, the lower wall portion 57 and the gas distribution plate 17 are further provided with a release blocking portion 60 for preventing the lower wall portion 57 from being separated from the groove 17b.

The separation blocking part 60 is formed when the first pin insertion part 60a formed in the gas distribution plate 17 and the lower wall part 57 and the lower wall part 57 are inserted into the groove 17b. The second pin insertion portion 60b communicating with the one pin insertion portion 60a and the pin block 60c integrally inserted and fastened through the first and second pin insertion portions 60a and 60b communicated with each other. do.

The operation of the chemical vapor deposition apparatus 1 for a flat panel display having such a configuration and the effects thereof will be described as follows.

First, the glass substrate G to be deposited transferred by the robot arm in the state where the susceptor 30 and the susceptor support 40 are lowered to the lower region of the chamber 10 by the elevating module 36 is opened. It is loaded through 10a and disposed on the substrate loading part 31 of the susceptor 30.

At this time, since the upper end of the lift pin 38 is protruded a predetermined height to the upper surface of the substrate loading portion 31, the robot arm is taken out after placing the glass substrate (G) on the lift pins (38). When the robot arm is taken out, the inside of the chamber 10 is maintained in a vacuum atmosphere and filled with inert gases He and Ar necessary for deposition.

Next, in order to proceed with the deposition process, the elevating module 36 is operated to raise the susceptor 30 and the susceptor support 40 together. The lift pin 38 is then lowered, through which the glass substrate G is loaded while being in close contact with the upper surface of the substrate loading part 31. When the susceptor 30 is injured, the operation of the elevating module 36 is stopped and the glass substrate G is positioned directly below the electrode 16. At this time, the susceptor 30 is heated to about 400 ° C.

Then, power is applied through the electrode 16 insulated by the insulator 26. Subsequently, the reactive gas is ejected through the gas distribution plate 17 on which the orifices 17a are formed and reaches the glass substrate G, thereby depositing on the glass substrate G.

Meanwhile, in this process, the gas distribution plate 17 is heated to a temperature of about 200 ° C. to thermally expand in at least one of the X, Y, and Z directions of FIG. 3, wherein the suspension supporting member ( 50 is the same in the expansion direction of the gas distribution plate 17 due to the structural feature of the corrugated structure.

For example, in the state in which the suspension supporting member 50 is the same as in FIG. 5, when the gas distribution plate 17 is thermally expanded in the X-axis direction (see FIG. 3), the suspension supporting member 50 also extends in the same direction. (See Figure 6). In this case, the corrugated grooves 52a and 52b are also extended to help thermal expansion of the suspension supporting member 50.

Therefore, even if the gas distribution plate 17 is thermally expanded due to a structural feature that can be easily expanded than the conventional suspension supporting member 150 (see FIG. 1), the spaced space portion 19 is not opened. This reduces the uniformity of the process and can prevent the occurrence of particle defects.

As described above, according to the present invention, the gas distribution plate 17 can be stably supported with respect to the electrode 16 while preventing the separation space 19 from being opened, and the length of the entire heat flow within a limited height. It is possible to prevent the heat of the gas distribution plate 17 from being conducted to the upper side by increasing the number and to effectively cope with thermal expansion of the gas distribution plate 17 due to the mechanical stability, so that the spaced space portion 19 is opened. It is possible to prevent the uniformity of and to reduce the particle (particle) defects.

7 is a partial perspective view of a suspension support member in a chemical vapor deposition apparatus for a planar display according to a second embodiment of the present invention.

In the case of the above-described embodiment, the corrugated suspension supporting member 50 is a unit plate and is disposed on four sides between the electrode 16 and the gas distribution plate 17. However, as illustrated in FIG. 7, the suspension supporting member 50a of the corrugation structure may be formed of the Hangul “A” character structure. As shown in FIG. 7, since the suspension supporting member 50a of the corrugated structure has to be assembled in the opposite direction between the electrode 16 and the gas distribution plate 17, the assembly and manufacturing process may be simplified.

8 is a partial perspective view of a suspension support member in a chemical vapor deposition apparatus for a planar display according to a third embodiment of the present invention.

8 is a view showing the assembly structure between the suspension structure supporting members 50 of the corrugated structure, the suspension supporting members 50 of the corrugated structure are arranged perpendicular to each other, and then assembled together. To this end, a side portion 51a is further formed on the side surfaces of the suspension supporting members 50 of the corrugation structure. At this time, as shown, the gush portion 51a may be made of a flat plate-like body, or may have a wrinkled structure.

As shown in FIG. 8, when the grate portions 51a face each other, separate binding members 70 are fitted to the grate portions 51a. That is, the pair of suspension supporting members 50 facing each other may be assembled by inserting the grooves 70a formed in the binding member 70 into the grate portions 51a.

Of course, although optional, the rear end of the binding member 70 may be further provided with an edge cover portion 72 to cover the edge area of the interconnected suspension supporting members 50. The edge cover portion 72 may be assembled to the corresponding position, and then fastened to the lower structure of the suspension supporting members 50 or the suspension supporting members 50 by bolts 73.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the gas distribution plate can be stably supported by the suspension plate while stably supporting the gas distribution plate with respect to the electrode while the separation space is not opened. It can be prevented from conducting to the upper side, and can also effectively cope with thermal expansion of the gas distribution plate due to the mechanical stability, so that the separation space can be opened, thereby preventing the uniformity of the process and the occurrence of particle defects. .

Claims (17)

An electrode coupled to the chamber in which the deposition process for the flat panel display is performed; An electrode support part provided on one side of the electrode to support the electrode; A gas distribution plate disposed below the electrode with a predetermined spaced portion between the electrode and distributing a deposition material on the flat panel display; And Flat display chemistry comprising a suspension support member coupled along the circumferential direction of the electrode and the gas distribution plate so as to shield the spaced space, and suspending the gas distribution plate with respect to the electrode. Vapor deposition apparatus. The method of claim 1, The suspension support member, And flatly display the gas distribution plate with respect to the electrode on the basis of the gas distribution plate thermally expanding in at least one of X, Y and Z axis directions with respect to the plate surface of the gas distribution plate. Chemical vapor deposition apparatus. The method according to claim 1 or 2, The suspension supporting member of the corrugation structure, A sidewall portion disposed horizontally in an arrangement direction of the electrode and the gas distribution plate and having a plurality of corrugated grooves recessed inwardly on an outer surface thereof; An upper wall portion formed horizontally on a plate surface of the side wall portion at an upper end of the side wall portion; And And a lower wall portion formed in parallel with the upper wall portion at a lower end of the side wall portion. The method of claim 3, And a plurality of corrugated grooves formed in the sidewall portion are formed on both side surfaces of the sidewall portion. The method of claim 4, wherein And a plurality of corrugated grooves formed on both side surfaces of the side wall portion are mutually disposed on both side surfaces of the side wall portion so as not to be arranged on the same horizontal axis. The method of claim 5, Separation interval between the corrugated grooves is a chemical vapor deposition apparatus for a flat display, characterized in that the same. The method of claim 6, The depth of depression of the corrugation grooves is at least less than half the thickness of the side wall portion chemical vapor deposition apparatus for a flat display. The method of claim 3, And at least one of the upper wall portion and the lower wall portion is larger than the thickness of the side wall portion. The method of claim 8, And the upper wall portion and the lower wall portion extend in opposite directions with respect to the side wall portion. The method of claim 9, The upper wall portion is a chemical vapor deposition apparatus for a flat display, characterized in that the bite coupled to the slit formed between the electrode and the electrode support. The method of claim 9, The lower wall portion is inserted into and coupled to the groove formed on the side of the gas distribution plate, The lower wall portion and the gas distribution plate is provided with a separation blocking portion for preventing the lower wall portion from being separated from the groove is a chemical vapor deposition apparatus for a flat display. The method of claim 11, The separation blocking unit, A first pin insertion portion formed on the gas distribution plate; A second pin insertion portion formed in the lower wall portion and communicating with the first pin insertion portion when the lower wall portion is inserted into the groove; And And a pin block integrally inserted into and fastened through the first and second pin insertion portions communicated with each other. The method of claim 3, And a valley portion for interfering with the gas distribution plate which is thermally expanded is formed in the lower wall portion adjacent to the side wall portion. The method of claim 3, The thickness of the side wall portion is a chemical vapor deposition apparatus for a flat display, characterized in that 2mm to 6mm. The method of claim 3, The corrugated groove is a chemical vapor deposition apparatus for a flat display, characterized in that the hemispherical shape. The method of claim 1, The corrugated suspension supporting member is a chemical vapor deposition apparatus for a flat display, characterized in that made of aluminum. The method of claim 1, The planar display is a chemical vapor deposition apparatus for a flat panel display, characterized in that the large glass substrate for liquid crystal display (LCD).

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