KR101408713B1 - 경화성 에폭시 수지 조성물, 이의 경화물, 및 이의 용도 - Google Patents

경화성 에폭시 수지 조성물, 이의 경화물, 및 이의 용도 Download PDF

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Publication number
KR101408713B1
KR101408713B1 KR1020097011500A KR20097011500A KR101408713B1 KR 101408713 B1 KR101408713 B1 KR 101408713B1 KR 1020097011500 A KR1020097011500 A KR 1020097011500A KR 20097011500 A KR20097011500 A KR 20097011500A KR 101408713 B1 KR101408713 B1 KR 101408713B1
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KR
South Korea
Prior art keywords
epoxy resin
group
resin composition
component
curable epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020097011500A
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English (en)
Korean (ko)
Other versions
KR20090087903A (ko
Inventor
요시쓰구 모리타
히로시 우에키
Original Assignee
다우 코닝 도레이 캄파니 리미티드
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Publication of KR20090087903A publication Critical patent/KR20090087903A/ko
Application granted granted Critical
Publication of KR101408713B1 publication Critical patent/KR101408713B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020097011500A 2006-12-04 2007-12-03 경화성 에폭시 수지 조성물, 이의 경화물, 및 이의 용도 Expired - Fee Related KR101408713B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006327219A JP5306592B2 (ja) 2006-12-04 2006-12-04 硬化性エポキシ樹脂組成物、硬化物、およびその用途
JPJP-P-2006-327219 2006-12-04
PCT/JP2007/073736 WO2008069333A1 (en) 2006-12-04 2007-12-03 Curable epoxy resin composition, cured body thereof, and use thereof

Publications (2)

Publication Number Publication Date
KR20090087903A KR20090087903A (ko) 2009-08-18
KR101408713B1 true KR101408713B1 (ko) 2014-06-17

Family

ID=39153992

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097011500A Expired - Fee Related KR101408713B1 (ko) 2006-12-04 2007-12-03 경화성 에폭시 수지 조성물, 이의 경화물, 및 이의 용도

Country Status (10)

Country Link
US (1) US20100144928A1 (enrdf_load_stackoverflow)
EP (1) EP2094758B1 (enrdf_load_stackoverflow)
JP (1) JP5306592B2 (enrdf_load_stackoverflow)
KR (1) KR101408713B1 (enrdf_load_stackoverflow)
CN (1) CN101535367A (enrdf_load_stackoverflow)
AT (1) ATE496954T1 (enrdf_load_stackoverflow)
DE (1) DE602007012301D1 (enrdf_load_stackoverflow)
MY (1) MY151085A (enrdf_load_stackoverflow)
TW (1) TWI425048B (enrdf_load_stackoverflow)
WO (1) WO2008069333A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP5733679B2 (ja) * 2008-11-28 2015-06-10 味の素株式会社 樹脂組成物
FR2969159B1 (fr) * 2010-12-15 2013-01-11 Arkema France Composition thermoplastique modifiee choc ayant une sensibilite hydrolytique pour obtenir une fluidite elevee tout en maintenant une resistance aux chocs elevee

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877822A (en) 1985-10-07 1989-10-31 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
US5561174A (en) 1994-09-30 1996-10-01 Murata Manufacturing Co., Ltd. Liquid epoxy resin composition
WO2006098493A1 (en) 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3957832A (en) * 1970-03-16 1976-05-18 The Dow Chemical Company Epoxy resins prepared from polyhydroxy-containing compounds
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JP3161786B2 (ja) * 1991-11-20 2001-04-25 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3251655B2 (ja) * 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP3406646B2 (ja) * 1993-06-29 2003-05-12 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
US6794481B2 (en) * 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
JP4948716B2 (ja) * 2001-06-29 2012-06-06 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
JP4050070B2 (ja) * 2002-02-28 2008-02-20 東レ・ダウコーニング株式会社 シリコーンレジン組成物、硬化性樹脂組成物、および硬化物
KR101152040B1 (ko) * 2004-11-30 2012-07-23 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
JP5010162B2 (ja) * 2005-03-29 2012-08-29 長野県 農園芸用粒状殺菌剤組成物とそれを利用したいもち病の防除方法
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877822A (en) 1985-10-07 1989-10-31 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
US5561174A (en) 1994-09-30 1996-10-01 Murata Manufacturing Co., Ltd. Liquid epoxy resin composition
WO2006098493A1 (en) 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom

Also Published As

Publication number Publication date
ATE496954T1 (de) 2011-02-15
JP2008138121A (ja) 2008-06-19
TW200835745A (en) 2008-09-01
TWI425048B (zh) 2014-02-01
US20100144928A1 (en) 2010-06-10
CN101535367A (zh) 2009-09-16
EP2094758A1 (en) 2009-09-02
JP5306592B2 (ja) 2013-10-02
EP2094758B1 (en) 2011-01-26
KR20090087903A (ko) 2009-08-18
WO2008069333A1 (en) 2008-06-12
MY151085A (en) 2014-04-15
DE602007012301D1 (de) 2011-03-10

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