KR101406172B1 - 반도체 웨이퍼의 연속 처리 장치 및 방법 - Google Patents

반도체 웨이퍼의 연속 처리 장치 및 방법 Download PDF

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Publication number
KR101406172B1
KR101406172B1 KR1020130002207A KR20130002207A KR101406172B1 KR 101406172 B1 KR101406172 B1 KR 101406172B1 KR 1020130002207 A KR1020130002207 A KR 1020130002207A KR 20130002207 A KR20130002207 A KR 20130002207A KR 101406172 B1 KR101406172 B1 KR 101406172B1
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KR
South Korea
Prior art keywords
wafer
chamber
turntable
chambers
space
Prior art date
Application number
KR1020130002207A
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English (en)
Korean (ko)
Inventor
이원구
서현모
안현환
류수렬
최우진
Original Assignee
(주)에스티아이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에스티아이 filed Critical (주)에스티아이
Priority to KR1020130002207A priority Critical patent/KR101406172B1/ko
Priority to CN201480004276.5A priority patent/CN104919583A/zh
Priority to PCT/KR2014/000143 priority patent/WO2014109526A1/ko
Priority to TW103100660A priority patent/TWI555114B/zh
Application granted granted Critical
Publication of KR101406172B1 publication Critical patent/KR101406172B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130002207A 2013-01-08 2013-01-08 반도체 웨이퍼의 연속 처리 장치 및 방법 KR101406172B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020130002207A KR101406172B1 (ko) 2013-01-08 2013-01-08 반도체 웨이퍼의 연속 처리 장치 및 방법
CN201480004276.5A CN104919583A (zh) 2013-01-08 2014-01-07 半导体晶圆的连续处理装置及方法
PCT/KR2014/000143 WO2014109526A1 (ko) 2013-01-08 2014-01-07 반도체 웨이퍼의 연속 처리 장치 및 방법
TW103100660A TWI555114B (zh) 2013-01-08 2014-01-08 半導體晶圓的連續處理裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130002207A KR101406172B1 (ko) 2013-01-08 2013-01-08 반도체 웨이퍼의 연속 처리 장치 및 방법

Publications (1)

Publication Number Publication Date
KR101406172B1 true KR101406172B1 (ko) 2014-06-12

Family

ID=51132499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130002207A KR101406172B1 (ko) 2013-01-08 2013-01-08 반도체 웨이퍼의 연속 처리 장치 및 방법

Country Status (4)

Country Link
KR (1) KR101406172B1 (zh)
CN (1) CN104919583A (zh)
TW (1) TWI555114B (zh)
WO (1) WO2014109526A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107342242A (zh) * 2016-05-03 2017-11-10 系统科技公司 基板处理装置及基板处理方法
KR20180042767A (ko) * 2016-10-18 2018-04-26 주식회사 원익아이피에스 기판 처리 장치 및 기판 처리 방법
KR20200117242A (ko) * 2019-04-03 2020-10-14 (주)에스티아이 기판처리장치 및 기판처리방법
CN112563160A (zh) * 2019-09-25 2021-03-26 系统科技公司 基板处理装置
KR102259121B1 (ko) * 2019-12-23 2021-06-01 (주)에스티아이 기판처리장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017098823A1 (ja) * 2015-12-07 2017-06-15 東京エレクトロン株式会社 基板洗浄装置
KR101921597B1 (ko) * 2016-12-16 2018-11-26 (주)에스티아이 기판의 연속 처리 장치 및 방법
KR101987576B1 (ko) * 2018-01-24 2019-06-10 주식회사 기가레인 승강하는 유도부와 연동하는 연동부를 포함하는 기판 처리 장치
CN109355710A (zh) * 2018-09-19 2019-02-19 上海迈铸半导体科技有限公司 真空腔中半导体晶圆的可控快速冷却系统及方法
CN110125694A (zh) * 2019-06-10 2019-08-16 格力电器（芜湖）有限公司 一种集成化加工仓室及钣金件加工设备
CN114464519B (zh) * 2021-12-27 2024-03-29 拓荆科技股份有限公司 抽气环及半导体处理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213770A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体ウエハ処理装置および半導体ウエハ処理装置におけるアライメント方法
KR100679269B1 (ko) 2006-01-04 2007-02-06 삼성전자주식회사 멀티 챔버형 반도체 제조 장치
KR20080101317A (ko) * 2007-05-17 2008-11-21 위순임 기판 처리 시스템 및 방법
KR101175266B1 (ko) 2010-04-19 2012-08-21 주성엔지니어링(주) 기판 처리장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021946A (ja) * 1998-06-29 2000-01-21 C Bui Res:Kk 半導体製造装置
KR100666764B1 (ko) * 2001-10-16 2007-01-09 동경 엘렉트론 주식회사 피처리체 승강기구 및 이를 사용한 처리장치
US6827789B2 (en) * 2002-07-01 2004-12-07 Semigear, Inc. Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
WO2005123549A2 (en) * 2004-06-10 2005-12-29 Semigear, Inc. Serial thermal processor arrangement
KR100814238B1 (ko) * 2006-05-03 2008-03-17 위순임 기판 반송 장치 및 이를 이용한 기판 처리 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213770A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体ウエハ処理装置および半導体ウエハ処理装置におけるアライメント方法
KR100679269B1 (ko) 2006-01-04 2007-02-06 삼성전자주식회사 멀티 챔버형 반도체 제조 장치
KR20080101317A (ko) * 2007-05-17 2008-11-21 위순임 기판 처리 시스템 및 방법
KR101175266B1 (ko) 2010-04-19 2012-08-21 주성엔지니어링(주) 기판 처리장치

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107342242A (zh) * 2016-05-03 2017-11-10 系统科技公司 基板处理装置及基板处理方法
KR20180042767A (ko) * 2016-10-18 2018-04-26 주식회사 원익아이피에스 기판 처리 장치 및 기판 처리 방법
KR102125512B1 (ko) * 2016-10-18 2020-06-23 주식회사 원익아이피에스 기판 처리 장치 및 기판 처리 방법
US10752993B2 (en) 2016-10-18 2020-08-25 Wonik Ips Co., Ltd. Substrate processing apparatus and substrate processing method
KR20200117242A (ko) * 2019-04-03 2020-10-14 (주)에스티아이 기판처리장치 및 기판처리방법
KR102166269B1 (ko) * 2019-04-03 2020-10-15 (주)에스티아이 기판처리장치 및 기판처리방법
CN112563160A (zh) * 2019-09-25 2021-03-26 系统科技公司 基板处理装置
KR20210036012A (ko) * 2019-09-25 2021-04-02 (주)에스티아이 기판처리장치
KR102288733B1 (ko) * 2019-09-25 2021-08-11 (주)에스티아이 기판처리장치
CN112563160B (zh) * 2019-09-25 2023-09-29 系统科技公司 基板处理装置
KR102259121B1 (ko) * 2019-12-23 2021-06-01 (주)에스티아이 기판처리장치

Also Published As

Publication number Publication date
CN104919583A (zh) 2015-09-16
WO2014109526A1 (ko) 2014-07-17
TWI555114B (zh) 2016-10-21
TW201428882A (zh) 2014-07-16

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