KR101406172B1 - 반도체 웨이퍼의 연속 처리 장치 및 방법 - Google Patents
반도체 웨이퍼의 연속 처리 장치 및 방법 Download PDFInfo
- Publication number
- KR101406172B1 KR101406172B1 KR1020130002207A KR20130002207A KR101406172B1 KR 101406172 B1 KR101406172 B1 KR 101406172B1 KR 1020130002207 A KR1020130002207 A KR 1020130002207A KR 20130002207 A KR20130002207 A KR 20130002207A KR 101406172 B1 KR101406172 B1 KR 101406172B1
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130002207A KR101406172B1 (ko) | 2013-01-08 | 2013-01-08 | 반도체 웨이퍼의 연속 처리 장치 및 방법 |
CN201480004276.5A CN104919583A (zh) | 2013-01-08 | 2014-01-07 | 半导体晶圆的连续处理装置及方法 |
PCT/KR2014/000143 WO2014109526A1 (ko) | 2013-01-08 | 2014-01-07 | 반도체 웨이퍼의 연속 처리 장치 및 방법 |
TW103100660A TWI555114B (zh) | 2013-01-08 | 2014-01-08 | 半導體晶圓的連續處理裝置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130002207A KR101406172B1 (ko) | 2013-01-08 | 2013-01-08 | 반도체 웨이퍼의 연속 처리 장치 및 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101406172B1 true KR101406172B1 (ko) | 2014-06-12 |
Family
ID=51132499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130002207A KR101406172B1 (ko) | 2013-01-08 | 2013-01-08 | 반도체 웨이퍼의 연속 처리 장치 및 방법 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101406172B1 (zh) |
CN (1) | CN104919583A (zh) |
TW (1) | TWI555114B (zh) |
WO (1) | WO2014109526A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107342242A (zh) * | 2016-05-03 | 2017-11-10 | 系统科技公司 | 基板处理装置及基板处理方法 |
KR20180042767A (ko) * | 2016-10-18 | 2018-04-26 | 주식회사 원익아이피에스 | 기판 처리 장치 및 기판 처리 방법 |
KR20200117242A (ko) * | 2019-04-03 | 2020-10-14 | (주)에스티아이 | 기판처리장치 및 기판처리방법 |
CN112563160A (zh) * | 2019-09-25 | 2021-03-26 | 系统科技公司 | 基板处理装置 |
KR102259121B1 (ko) * | 2019-12-23 | 2021-06-01 | (주)에스티아이 | 기판처리장치 |
CN113061950A (zh) * | 2021-04-02 | 2021-07-02 | 硅密芯镀(海宁)半导体技术有限公司 | 电镀液保护装置及包括其的晶圆电镀系统 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102629308B1 (ko) * | 2015-12-07 | 2024-01-24 | 도쿄엘렉트론가부시키가이샤 | 기판 세정 장치 |
KR101921597B1 (ko) * | 2016-12-16 | 2018-11-26 | (주)에스티아이 | 기판의 연속 처리 장치 및 방법 |
KR101987576B1 (ko) * | 2018-01-24 | 2019-06-10 | 주식회사 기가레인 | 승강하는 유도부와 연동하는 연동부를 포함하는 기판 처리 장치 |
CN109355710A (zh) * | 2018-09-19 | 2019-02-19 | 上海迈铸半导体科技有限公司 | 真空腔中半导体晶圆的可控快速冷却系统及方法 |
CN110125694B (zh) * | 2019-06-10 | 2024-07-23 | 格力电器(芜湖)有限公司 | 一种集成化加工仓室及钣金件加工设备 |
CN114464519B (zh) * | 2021-12-27 | 2024-03-29 | 拓荆科技股份有限公司 | 抽气环及半导体处理装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213770A (ja) * | 1996-01-29 | 1997-08-15 | Toshiba Corp | 半導体ウエハ処理装置および半導体ウエハ処理装置におけるアライメント方法 |
KR100679269B1 (ko) | 2006-01-04 | 2007-02-06 | 삼성전자주식회사 | 멀티 챔버형 반도체 제조 장치 |
KR20080101317A (ko) * | 2007-05-17 | 2008-11-21 | 위순임 | 기판 처리 시스템 및 방법 |
KR101175266B1 (ko) | 2010-04-19 | 2012-08-21 | 주성엔지니어링(주) | 기판 처리장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000021946A (ja) * | 1998-06-29 | 2000-01-21 | C Bui Res:Kk | 半導体製造装置 |
CN1331208C (zh) * | 2001-10-16 | 2007-08-08 | 东京毅力科创株式会社 | 被处理体的升降机构及使用它的处理装置 |
US6827789B2 (en) * | 2002-07-01 | 2004-12-07 | Semigear, Inc. | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
CN101160647A (zh) * | 2004-06-10 | 2008-04-09 | 塞米吉尔公司 | 连续热处理器布局 |
KR100814238B1 (ko) * | 2006-05-03 | 2008-03-17 | 위순임 | 기판 반송 장치 및 이를 이용한 기판 처리 시스템 |
-
2013
- 2013-01-08 KR KR1020130002207A patent/KR101406172B1/ko active IP Right Grant
-
2014
- 2014-01-07 WO PCT/KR2014/000143 patent/WO2014109526A1/ko active Application Filing
- 2014-01-07 CN CN201480004276.5A patent/CN104919583A/zh active Pending
- 2014-01-08 TW TW103100660A patent/TWI555114B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213770A (ja) * | 1996-01-29 | 1997-08-15 | Toshiba Corp | 半導体ウエハ処理装置および半導体ウエハ処理装置におけるアライメント方法 |
KR100679269B1 (ko) | 2006-01-04 | 2007-02-06 | 삼성전자주식회사 | 멀티 챔버형 반도체 제조 장치 |
KR20080101317A (ko) * | 2007-05-17 | 2008-11-21 | 위순임 | 기판 처리 시스템 및 방법 |
KR101175266B1 (ko) | 2010-04-19 | 2012-08-21 | 주성엔지니어링(주) | 기판 처리장치 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107342242A (zh) * | 2016-05-03 | 2017-11-10 | 系统科技公司 | 基板处理装置及基板处理方法 |
KR20180042767A (ko) * | 2016-10-18 | 2018-04-26 | 주식회사 원익아이피에스 | 기판 처리 장치 및 기판 처리 방법 |
KR102125512B1 (ko) * | 2016-10-18 | 2020-06-23 | 주식회사 원익아이피에스 | 기판 처리 장치 및 기판 처리 방법 |
US10752993B2 (en) | 2016-10-18 | 2020-08-25 | Wonik Ips Co., Ltd. | Substrate processing apparatus and substrate processing method |
KR20200117242A (ko) * | 2019-04-03 | 2020-10-14 | (주)에스티아이 | 기판처리장치 및 기판처리방법 |
KR102166269B1 (ko) * | 2019-04-03 | 2020-10-15 | (주)에스티아이 | 기판처리장치 및 기판처리방법 |
CN112563160A (zh) * | 2019-09-25 | 2021-03-26 | 系统科技公司 | 基板处理装置 |
KR20210036012A (ko) * | 2019-09-25 | 2021-04-02 | (주)에스티아이 | 기판처리장치 |
KR102288733B1 (ko) * | 2019-09-25 | 2021-08-11 | (주)에스티아이 | 기판처리장치 |
CN112563160B (zh) * | 2019-09-25 | 2023-09-29 | 系统科技公司 | 基板处理装置 |
KR102259121B1 (ko) * | 2019-12-23 | 2021-06-01 | (주)에스티아이 | 기판처리장치 |
CN113061950A (zh) * | 2021-04-02 | 2021-07-02 | 硅密芯镀(海宁)半导体技术有限公司 | 电镀液保护装置及包括其的晶圆电镀系统 |
Also Published As
Publication number | Publication date |
---|---|
TW201428882A (zh) | 2014-07-16 |
TWI555114B (zh) | 2016-10-21 |
WO2014109526A1 (ko) | 2014-07-17 |
CN104919583A (zh) | 2015-09-16 |
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