KR101402293B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR101402293B1
KR101402293B1 KR1020070099533A KR20070099533A KR101402293B1 KR 101402293 B1 KR101402293 B1 KR 101402293B1 KR 1020070099533 A KR1020070099533 A KR 1020070099533A KR 20070099533 A KR20070099533 A KR 20070099533A KR 101402293 B1 KR101402293 B1 KR 101402293B1
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KR
South Korea
Prior art keywords
transistor
terminal
electrically connected
circuit
tag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070099533A
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English (en)
Korean (ko)
Other versions
KR20080035455A (ko
Inventor
키요시 카토
아사미 타도코로
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20080035455A publication Critical patent/KR20080035455A/ko
Application granted granted Critical
Publication of KR101402293B1 publication Critical patent/KR101402293B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/02Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0715Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including means to regulate power transfer to the integrated circuit
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073Special arrangements for circuits, e.g. for protecting identification code in memory
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Near-Field Transmission Systems (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Sources (AREA)
  • Emergency Protection Circuit Devices (AREA)
KR1020070099533A 2006-10-18 2007-10-02 반도체 장치 Expired - Fee Related KR101402293B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00283935 2006-10-18
JP2006283935 2006-10-18

Publications (2)

Publication Number Publication Date
KR20080035455A KR20080035455A (ko) 2008-04-23
KR101402293B1 true KR101402293B1 (ko) 2014-06-02

Family

ID=38786935

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070099533A Expired - Fee Related KR101402293B1 (ko) 2006-10-18 2007-10-02 반도체 장치

Country Status (7)

Country Link
US (3) US7907902B2 (enExample)
EP (1) EP1914669B1 (enExample)
JP (3) JP5799049B2 (enExample)
KR (1) KR101402293B1 (enExample)
CN (1) CN101165712B (enExample)
DE (1) DE602007013986D1 (enExample)
TW (1) TWI423139B (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007013986D1 (de) * 2006-10-18 2011-06-01 Semiconductor Energy Lab ID-Funktransponder
JP5325415B2 (ja) * 2006-12-18 2013-10-23 株式会社半導体エネルギー研究所 半導体装置
JP5388632B2 (ja) 2008-03-14 2014-01-15 株式会社半導体エネルギー研究所 半導体装置
US8115160B2 (en) * 2008-03-14 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Protection circuit and photoelectric conversion device
JP4838827B2 (ja) * 2008-07-02 2011-12-14 シャープ株式会社 太陽電池モジュールおよびその製造方法
US8432070B2 (en) * 2008-08-25 2013-04-30 Qualcomm Incorporated Passive receivers for wireless power transmission
US8947041B2 (en) 2008-09-02 2015-02-03 Qualcomm Incorporated Bidirectional wireless power transmission
US8532724B2 (en) 2008-09-17 2013-09-10 Qualcomm Incorporated Transmitters for wireless power transmission
WO2010032603A1 (en) 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and wireless tag using the same
US8224277B2 (en) * 2008-09-26 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010038712A1 (en) 2008-09-30 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101596227B1 (ko) 2008-10-02 2016-02-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5319469B2 (ja) * 2008-10-03 2013-10-16 株式会社半導体エネルギー研究所 Rfidタグ
KR101595755B1 (ko) 2008-10-03 2016-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
FR2939580A1 (fr) * 2008-12-09 2010-06-11 Commissariat Energie Atomique Objet portatif couple inductivement a une station fixe et comportant des moyens de controle du gain
KR101667622B1 (ko) * 2008-12-11 2016-10-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터 및 표시 장치
US8890660B2 (en) * 2009-03-24 2014-11-18 Nxp B.V. Power saving method
US8328105B2 (en) * 2009-03-31 2012-12-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101829176B1 (ko) 2009-11-20 2018-02-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20120120330A (ko) 2010-01-29 2012-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8130008B2 (en) 2010-03-01 2012-03-06 Infineon Technologies Ag Integrated circuit with a radiation-sensitive thyristor structure
US9092710B2 (en) * 2010-03-25 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9391476B2 (en) 2010-09-09 2016-07-12 Semiconductor Energy Laboratory Co., Ltd. Power feeding device, wireless power feeding system using the same and wireless power feeding method
JP5815337B2 (ja) * 2010-09-13 2015-11-17 株式会社半導体エネルギー研究所 半導体装置
US9065302B2 (en) 2010-12-24 2015-06-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power feeding system
KR20120084659A (ko) 2011-01-20 2012-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 급전 장치 및 비접촉 급전 시스템
US9325205B2 (en) 2011-03-04 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for driving power supply system
US8659015B2 (en) 2011-03-04 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101822491B1 (ko) 2011-04-01 2018-01-26 삼성전자주식회사 전압 조정 회로 및 이의 동작 방법
DE102011100095B4 (de) * 2011-04-29 2014-12-24 Gottfried Wilhelm Leibniz Universität Hannover Transpondereinheit
EA025756B1 (ru) * 2011-10-10 2017-01-30 Ростислав Владимирович Босенко Система беспроводной передачи данных, способ беспроводной передачи данных между передающим и приемным устройствами, способ беспроводного получения сигнала, передающее устройство для беспроводной передачи и приемное устройство для беспроводного приема данных
JP6169376B2 (ja) 2012-03-28 2017-07-26 株式会社半導体エネルギー研究所 電池管理ユニット、保護回路、蓄電装置
TWI553825B (zh) * 2013-01-11 2016-10-11 日月光半導體製造股份有限公司 堆疊式封裝模組與其製造方法
JP6128986B2 (ja) * 2013-06-24 2017-05-17 任天堂株式会社 通信システム、通信端末装置、通信プログラム、および通信方法
US9361564B2 (en) * 2013-12-02 2016-06-07 Qualcomm Technologies International, Ltd. Protection of an NFC or RFID radio in the presence of strong electromagnetic fields
CN106485290B (zh) 2015-08-24 2019-08-13 瑞章科技有限公司 增强标签反向散射能量的装置及方法
EP3136287A3 (en) * 2015-08-24 2017-09-06 Ruizhang Technology Limited Company Increasing backscatter level for rfid chip
KR102443842B1 (ko) 2015-09-14 2022-09-16 삼성전자주식회사 Nfc 장치의 태그 감지기, nfc 장치 및 이를 포함하는 모바일 장치
EP3417421A4 (en) 2016-02-16 2019-11-06 Above The Fold, LLC SYSTEMS FOR TRACKING MEDICAMENTS
JP6906978B2 (ja) 2016-02-25 2021-07-21 株式会社半導体エネルギー研究所 半導体装置、半導体ウェハ、および電子機器
GB2547730B (en) * 2016-02-26 2018-08-01 Cirrus Logic Int Semiconductor Ltd Clamping audio signal paths
CN105929317B (zh) * 2016-04-12 2019-03-08 中国科学院微电子研究所 一种高速信号隔离装置
CN107301443A (zh) * 2016-04-15 2017-10-27 中兴通讯股份有限公司 电子标签、电子标签的电源管理方法及装置
CN106209178A (zh) * 2016-08-25 2016-12-07 成都优购科技有限公司 一种过压保护蓝牙装置
US10043124B2 (en) * 2016-12-15 2018-08-07 Em Microelectronic-Marin Sa Voltage regulation circuit for an RFID circuit
JP6855989B2 (ja) * 2017-09-14 2021-04-07 オムロン株式会社 Rfタグ回路
JP6844478B2 (ja) * 2017-09-14 2021-03-17 オムロン株式会社 Rfタグ
US11990778B2 (en) 2018-07-10 2024-05-21 Semiconductor Energy Laboratory Co., Ltd. Secondary battery protection circuit and secondary battery anomaly detection system
CN110752756B (zh) * 2019-10-28 2021-10-08 北方工业大学 一种高增益变换电路及其控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10307898A (ja) * 1997-05-09 1998-11-17 Toppan Printing Co Ltd 充電式非接触icカードシステム
JP2003085506A (ja) * 2001-09-12 2003-03-20 Yoshikawa Rf System Kk データキャリアにおける過電圧防止回路
JP2005204493A (ja) * 2003-12-19 2005-07-28 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の駆動方法
JP2005202721A (ja) * 2004-01-16 2005-07-28 Matsushita Electric Ind Co Ltd 非接触データキャリア

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898522A (en) * 1973-12-03 1975-08-05 Gte Sylvania Inc Television receiver power supply system and protective circuitry therefor
US4717996A (en) * 1987-01-14 1988-01-05 Best Power Technology, Inc. Gated parallel power switching devices protection circuit
KR100271690B1 (ko) * 1992-01-31 2000-11-15 스즈키 진이치로 보호회로를 구비하는 반도체 장치 및 전자시스템
JPH0962808A (ja) 1995-08-25 1997-03-07 Mitsubishi Electric Corp 非接触icカード及び非接触icカードシステム
US7215248B2 (en) * 1995-08-31 2007-05-08 Intermec Ip Corp. Diode receiver for radio frequency transponder
JP3755675B2 (ja) 1995-11-20 2006-03-15 ソニー株式会社 クランプ回路、cmosチツプic及び非接触型情報カード
US6097292A (en) * 1997-04-01 2000-08-01 Cubic Corporation Contactless proximity automated data collection system and method
SG54559A1 (en) * 1996-09-13 1998-11-16 Hitachi Ltd Power transmission system ic card and information communication system using ic card
JP3392016B2 (ja) 1996-09-13 2003-03-31 株式会社日立製作所 電力伝送システム並びに電力伝送および情報通信システム
US6879809B1 (en) * 1998-04-16 2005-04-12 Motorola, Inc. Wireless electrostatic charging and communicating system
US6069782A (en) * 1998-08-26 2000-05-30 Integrated Device Technology, Inc. ESD damage protection using a clamp circuit
US6198646B1 (en) * 1999-01-08 2001-03-06 Quantum Manufacturing Technologies, Inc. Commutation circuit for arresting and dissipating energy reflected from a magnetic pulse compression network
FR2801745B1 (fr) 1999-11-30 2007-05-25 St Microelectronics Sa Transpondeur electromagnetique a desaccord en frequence
JP2002176141A (ja) 2000-12-07 2002-06-21 Hitachi Ltd 半導体集積回路装置及びicタグ
JP4662003B2 (ja) * 2001-02-09 2011-03-30 ミツミ電機株式会社 Acアダプタ出力端子ショートによる保護回路
US7589944B2 (en) * 2001-03-16 2009-09-15 Sofics Bvba Electrostatic discharge protection structures for high speed technologies with mixed and ultra-low voltage supplies
JP2002368647A (ja) 2001-06-06 2002-12-20 Matsushita Electric Ind Co Ltd データキャリア
US20030107424A1 (en) * 2001-12-11 2003-06-12 Chien-Chang Huang ESD protection circuit
US7423517B2 (en) 2002-07-30 2008-09-09 Nxp B.V. Transponder with a controllable power-on-reset circuit
US7102862B1 (en) * 2002-10-29 2006-09-05 Integrated Device Technology, Inc. Electrostatic discharge protection circuit
SI21392A (sl) * 2002-12-24 2004-06-30 Vinko Kunc Postopek za avtomatsko nastavitev ojačenja izpraševalnikovega sprejemnika v brezkontaktnem identifikacijskem sistemu
DE10356259B4 (de) * 2003-12-03 2010-07-22 Atmel Automotive Gmbh Verfahren und Schaltungsanordnung zum Vergrößern einer Funktionsreichweite bei einer aus einem elektromagnetischen Feld mit Energie versorgten Vorrichtung
US7471188B2 (en) * 2003-12-19 2008-12-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
JP2005242989A (ja) * 2004-01-28 2005-09-08 Toshiba Microelectronics Corp 非接触icカードのリーダライタ端末装置、通信システム及び非接触データキャリア
DE102004013177B4 (de) * 2004-03-17 2006-05-18 Infineon Technologies Ag Datenübertragungseinheit mit einer Datenübertragungsschnittstelle und ein Verfahren zum Betreiben der Datenübertragungseinheit
JP4265487B2 (ja) 2004-06-17 2009-05-20 富士通株式会社 リーダー装置、その装置の送信方法及びタグ
JP4519713B2 (ja) * 2004-06-17 2010-08-04 株式会社東芝 整流回路とこれを用いた無線通信装置
US7424266B2 (en) * 2004-11-09 2008-09-09 Kabushiki Kaisha Toshiba Rectifier circuit and RFID tag
JP2006155045A (ja) * 2004-11-26 2006-06-15 Sony Corp 電子価値情報伝送システム及び電子価値情報伝送方法
DE102005013687B3 (de) 2005-03-18 2005-12-01 Atmel Germany Gmbh ESD-Schutzschaltung für niedrige Spannungen
KR100554889B1 (ko) * 2005-03-21 2006-03-03 주식회사 한림포스텍 무접점 충전 시스템
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
KR100688555B1 (ko) * 2005-06-30 2007-03-02 삼성전자주식회사 Mos트랜지스터를 구비하는 반도체 소자 및 그 제조 방법
EP1909384A3 (en) * 2006-10-06 2015-11-25 Semiconductor Energy Laboratory Co., Ltd. Rectifier circuit with variable capacitor, semiconductor device using the circuit, and driving method therefor
DE602007013986D1 (de) * 2006-10-18 2011-06-01 Semiconductor Energy Lab ID-Funktransponder
US20080133850A1 (en) * 2006-12-05 2008-06-05 Inventec Corporation Computer device with function of selectively redeploying one of memory modules as hard disc
JP5325415B2 (ja) * 2006-12-18 2013-10-23 株式会社半導体エネルギー研究所 半導体装置
US8358202B2 (en) * 2006-12-26 2013-01-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWM319464U (en) * 2007-04-10 2007-09-21 Coretronic Corp Electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10307898A (ja) * 1997-05-09 1998-11-17 Toppan Printing Co Ltd 充電式非接触icカードシステム
JP2003085506A (ja) * 2001-09-12 2003-03-20 Yoshikawa Rf System Kk データキャリアにおける過電圧防止回路
JP2005204493A (ja) * 2003-12-19 2005-07-28 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の駆動方法
JP2005202721A (ja) * 2004-01-16 2005-07-28 Matsushita Electric Ind Co Ltd 非接触データキャリア

Also Published As

Publication number Publication date
CN101165712A (zh) 2008-04-23
US20150188311A1 (en) 2015-07-02
CN101165712B (zh) 2013-07-10
US20080094180A1 (en) 2008-04-24
US7907902B2 (en) 2011-03-15
JP2013137830A (ja) 2013-07-11
JP5848406B2 (ja) 2016-01-27
JP5799049B2 (ja) 2015-10-21
JP2016040738A (ja) 2016-03-24
EP1914669B1 (en) 2011-04-20
KR20080035455A (ko) 2008-04-23
DE602007013986D1 (de) 2011-06-01
TWI423139B (zh) 2014-01-11
JP6088627B2 (ja) 2017-03-01
US20110163613A1 (en) 2011-07-07
EP1914669A3 (en) 2009-04-15
TW200834429A (en) 2008-08-16
US8977203B2 (en) 2015-03-10
US9391449B2 (en) 2016-07-12
EP1914669A2 (en) 2008-04-23
JP2014194826A (ja) 2014-10-09

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