KR101401919B1 - 일체화 고효율 다층식 조명장치 - Google Patents
일체화 고효율 다층식 조명장치 Download PDFInfo
- Publication number
- KR101401919B1 KR101401919B1 KR1020120114027A KR20120114027A KR101401919B1 KR 101401919 B1 KR101401919 B1 KR 101401919B1 KR 1020120114027 A KR1020120114027 A KR 1020120114027A KR 20120114027 A KR20120114027 A KR 20120114027A KR 101401919 B1 KR101401919 B1 KR 101401919B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- heat dissipation
- groove
- layer
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101116665A TW201347244A (zh) | 2012-05-10 | 2012-05-10 | 一體化高效率多層式照明裝置 |
| TW101116665 | 2012-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130126434A KR20130126434A (ko) | 2013-11-20 |
| KR101401919B1 true KR101401919B1 (ko) | 2014-06-27 |
Family
ID=48084865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120114027A Expired - Fee Related KR101401919B1 (ko) | 2012-05-10 | 2012-10-15 | 일체화 고효율 다층식 조명장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2013236047A (https=) |
| KR (1) | KR101401919B1 (https=) |
| DE (2) | DE102013100611A1 (https=) |
| MY (1) | MY164690A (https=) |
| TW (1) | TW201347244A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6115826B2 (ja) * | 2013-11-26 | 2017-04-19 | 東芝ライテック株式会社 | 移動体用照明装置 |
| JP6467206B2 (ja) * | 2014-01-28 | 2019-02-06 | 株式会社小糸製作所 | 光源ユニット |
| CN103899955A (zh) * | 2014-03-14 | 2014-07-02 | 魏百远 | 一种高效散热的led模组结构 |
| CN115604982B (zh) * | 2022-09-09 | 2025-07-22 | 英业达科技有限公司 | 液冷板装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100705011B1 (ko) | 2005-08-31 | 2007-04-13 | 바이오닉스(주) | 발광 장치 |
| KR100714749B1 (ko) | 2006-03-21 | 2007-05-04 | 삼성전자주식회사 | 발광 소자 패키지 모듈 및 이의 제조 방법 |
| KR101048440B1 (ko) | 2010-04-29 | 2011-07-11 | 금호전기주식회사 | Led모듈 가변 장착형 방열판 및 이를 이용한 조명 장치 |
| KR101054305B1 (ko) | 2010-12-30 | 2011-08-08 | 금강전기 (주) | Led 조명장치 및 그 제조방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008311471A (ja) * | 2007-06-15 | 2008-12-25 | Toyoda Gosei Co Ltd | 発光装置 |
| TW200725940A (en) * | 2005-12-29 | 2007-07-01 | Anteya Technology Corp | LED package structure |
| KR101210090B1 (ko) * | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
| JP3162599U (ja) * | 2010-06-25 | 2010-09-09 | 李家茂 | リング状パッケージ構造 |
| TWM409367U (en) * | 2011-01-28 | 2011-08-11 | Fin Core Corp | Heat-dissipation module and LED lamp having heat-dissipation module |
| TWM424620U (en) * | 2011-08-03 | 2012-03-11 | Gem Weltronics Twn Corp | Multi-layer array type LED light engine structure improvement |
| TWM422041U (en) * | 2011-09-16 | 2012-02-01 | Zi-Hua Chen | High-power lightweight LED bulb |
-
2012
- 2012-05-10 TW TW101116665A patent/TW201347244A/zh not_active IP Right Cessation
- 2012-10-05 JP JP2012223119A patent/JP2013236047A/ja active Pending
- 2012-10-15 KR KR1020120114027A patent/KR101401919B1/ko not_active Expired - Fee Related
-
2013
- 2013-01-22 DE DE201310100611 patent/DE102013100611A1/de not_active Ceased
- 2013-01-22 DE DE202013100293U patent/DE202013100293U1/de not_active Expired - Lifetime
- 2013-01-25 MY MYUI2013700153A patent/MY164690A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100705011B1 (ko) | 2005-08-31 | 2007-04-13 | 바이오닉스(주) | 발광 장치 |
| KR100714749B1 (ko) | 2006-03-21 | 2007-05-04 | 삼성전자주식회사 | 발광 소자 패키지 모듈 및 이의 제조 방법 |
| KR101048440B1 (ko) | 2010-04-29 | 2011-07-11 | 금호전기주식회사 | Led모듈 가변 장착형 방열판 및 이를 이용한 조명 장치 |
| KR101054305B1 (ko) | 2010-12-30 | 2011-08-08 | 금강전기 (주) | Led 조명장치 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130126434A (ko) | 2013-11-20 |
| DE202013100293U1 (de) | 2013-03-11 |
| MY164690A (en) | 2018-01-30 |
| TW201347244A (zh) | 2013-11-16 |
| DE102013100611A1 (de) | 2013-11-14 |
| TWI470841B (https=) | 2015-01-21 |
| JP2013236047A (ja) | 2013-11-21 |
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| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| P13-X000 | Application amended |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
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St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180527 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| P22-X000 | Classification modified |
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